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MC14007UBCPG

Onsemi

MC14007UBCPG by Onsemi

MC14007UBCPG by Onsemi is a CMOS Logic Gates IC with 3 functions, Vsup of 5V, and tpd of 125ns. It operates in a temperature range of -55 to 125 °C and is ideal for military-grade applications requiring high-speed signal processing.

Median Price

$0.840

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$0.840

100+ parts

-

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1

$0.840

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Adafruit Industries

USA . 52 parts In-Stock

1+ parts

$26.588

100+ parts

$25.259

1k+ parts

$25.259

10k+ parts

-

52

$26.588

$25.259

$25.259

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Rochester

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

5

-

$0.238

$0.197

$0.176

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 65 parts In-Stock

1+ parts

$0.185

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65

$0.185

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$0.209

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550

$0.209

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Vyrian

USA . 4,184 parts In-Stock

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4,184

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Bristol Electronics

USA . 2,907 parts In-Stock

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2,907

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Connector Distribution Corp

USA . 425 parts In-Stock

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425

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Right Parts Inc.

USA . 425 parts In-Stock

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425

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Distributors (Availability)

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Ampacity Inc.

Singapore . 19 parts In-Stock

1+ parts

$0.166

100+ parts

-

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19

$0.166

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Semicontronic

India . 19 parts In-Stock

1+ parts

$0.166

100+ parts

$0.162

1k+ parts

$0.161

10k+ parts

-

19

$0.166

$0.162

$0.161

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Corphita

USA . 479 parts In-Stock

1+ parts

$0.176

100+ parts

-

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479

$0.176

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Corohmni

South Africa . 357 parts In-Stock

1+ parts

$0.195

100+ parts

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357

$0.195

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Component Stockers USA

USA . 565 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

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565

$0.200

$0.190

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Argo Parts USA

USA . 2,047 parts In-Stock

1+ parts

$0.209

100+ parts

-

1k+ parts

-

10k+ parts

$0.203

2,047

$0.209

-

-

$0.203

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.209

100+ parts

-

1k+ parts

$0.199

10k+ parts

$0.194

1,000

$0.209

-

$0.199

$0.194

AZTECH Wire

Italy . 479 parts In-Stock

1+ parts

$17.547

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479

$17.547

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Aztec Data Supply Inc.

USA . 3,933 parts In-Stock

1+ parts

$21.226

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3,933

$21.226

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Advanced Electronics

New Zealand . 52 parts In-Stock

1+ parts

$26.588

100+ parts

$25.259

1k+ parts

$25.259

10k+ parts

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52

$26.588

$25.259

$25.259

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Kepictronics

USA . 7,875 parts In-Stock

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7,875

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Problanco Electronics

Mexico . 6,592 parts In-Stock

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Kulean Microsystems

USA . 6,194 parts In-Stock

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TANS Electronics

Latvia . 3,263 parts In-Stock

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3,263

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Continental Prestige Electronics

USA . 489 parts In-Stock

1+ parts

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100+ parts

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$0.169

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489

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-

$0.169

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SupplyDigital Components

Austria . 313 parts In-Stock

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313

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Microchip USA

USA . 225 parts In-Stock

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225

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UHIMA Technologies

Türkiye . 127 parts In-Stock

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127

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Overview

Unlock the power of efficient logic gate technology with the MC14007UBCPG by Onsemi. Manufactured with precision and expertise, this innovative product offers three functions in a compact rectangular package. Ideal for a wide range of applications, this logic gate provides reliable performance with a nominal supply voltage of 5V. Experience enhanced functionality and seamless operation with this high-quality product, designed to meet your needs with ease. Elevate your projects with the MC14007UBCPG and discover the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the logic gates, ensuring a longer lifespan.

No. of Functions: 3

With multiple functions available in one package, this product offers versatility and efficiency.

Propagation Delay (tpd): 125 ns

The low propagation delay ensures fast response times, making this product suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this product can withstand harsh environmental conditions and maintain optimal performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Logic Gates MC14007UBCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Logic IC Type:

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC14007UBCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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