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74HC1G04GW,125

NXP Semiconductors

74HC1G04GW,125 by NXP Semiconductors

NXP Semiconductors' 74HC1G04GW,125 is a CMOS Logic Gate with 27ns Propagation Delay at 5V. It has a load capacitance of 50pF and operates in the temperature range of -40 to 125°C. Ideal for automotive applications due to its small size, low power consumption, and high-speed performance.

Median Price

$0.042

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Mouser Electronics

USA . 16,175 parts In-Stock

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Newark

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TTI

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Element14

Singapore . 26,790 parts In-Stock

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DigiKey

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Farnell

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Rochester

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Chip1Stop

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Digiode

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Nova Conductors

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TME

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Bristol Electronics

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IBS Electronics

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Semicontronic

India . 55,519 parts In-Stock

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Ampacity Inc.

Singapore . 15,395 parts In-Stock

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AZTECH Wire

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Aztec Data Supply Inc.

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Advanced Electronics

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Continental Prestige Electronics

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Computer Components Inc. - USA

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Glotronic Ltd.

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Lucentia Tech

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Supply Digital

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Overview

Elevate your electronic designs with the 74HC1G04GW,125 by NXP Semiconductors. Crafted with precision and quality in mind, this logic gate offers unparalleled performance and reliability. Ideal for a wide range of applications, this component is a game-changer in the world of electronics. With a low propagation delay, small package size, and a wide operating temperature range, this product delivers exceptional value and flexibility to customers. Trust NXP Semiconductors to provide you with innovative solutions that exceed your expectations. Experience the difference with the 74HC1G04GW,125 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it ideal for various applications.

Propagation Delay At Nominal Supply: 27 ns

With a low propagation delay, this logic gate allows for fast signal processing and response times.

Surface Mount: YES

Being surface mountable makes the installation and placement of this logic gate easy and efficient.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with many standard electronic circuits and systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable performance when connected to external devices or components.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption and high noise immunity, making it energy-efficient and reliable.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this logic gate can withstand harsh environmental conditions and operate reliably in various settings.

Technical Specifications

Logic Gates 74HC1G04GW,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74HC1G04GW,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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