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74HC1G14GW-Q100,125

NXP Semiconductors

74HC1G14GW-Q100,125 by NXP Semiconductors

NXP Semiconductors' 74HC1G14GW-Q100,125 is a CMOS Logic Gate with 5 terminals and Vsup ranging from 2V to 6V. It has a propagation delay of 190ns, operates b/w -40°C to 125°C, and is AEC-Q100 compliant for automotive applications. The package style is small outline with gull wing terminals, suitable for surface mount assembly in compact designs.

Median Price

$0.040

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Rochester

USA . 1,356 parts In-Stock

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$0.040

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Digiode

USA . 80 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

USA . 887 parts In-Stock

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Anansix

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VNN

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Semicontronic

India . 2,095 parts In-Stock

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$0.034

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$0.033

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Ampacity Inc.

Singapore . 1,116 parts In-Stock

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Corphita

USA . 166 parts In-Stock

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Continental Prestige Electronics

USA . 6,481 parts In-Stock

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$0.980

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Argo Parts USA

USA . 4,652 parts In-Stock

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Microchip USA

USA . 3,832 parts In-Stock

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Advanced Electronics

New Zealand . 540 parts In-Stock

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Corohmni

South Africa . 681 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,271 parts In-Stock

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UNI Independent Distributors

Spain . 7,897 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Modulus Dynamics

Lithuania . 58 parts In-Stock

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Overview

Elevate your automotive electronics with the 74HC1G14GW-Q100,125 by NXP Semiconductors. This high-quality logic gate offers unmatched reliability and performance, making it the perfect choice for a wide range of applications. With its compact design and advanced technology, this product provides exceptional value and benefits to customers, ensuring seamless integration into any project. Trust NXP Semiconductors to deliver cutting-edge solutions for all your automotive electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to external elements, enhancing the overall reliability of the product.

Surface Mount: YES

Being surface mountable makes the installation and assembly process easier and more efficient, especially in compact electronic designs.

Propagation Delay (tpd): 190 ns

With a low propagation delay of 190 ns, this logic gate ensures quick and efficient processing of signals, making it suitable for high-speed applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 125 °C ensures that the logic gate can function reliably in various environmental conditions, making it suitable for automotive applications.

Technology: CMOS

The CMOS technology used in this logic gate ensures low power consumption and high noise immunity, making it an energy-efficient and reliable choice for electronic circuits.

Technical Specifications

Logic Gates 74HC1G14GW-Q100,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

Length:

2.05 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

190 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74HC1G14GW-Q100,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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