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74LVC1G14GW-Q100

NXP Semiconductors

74LVC1G14GW-Q100 by NXP Semiconductors

74LVC1G14GW-Q100 by NXP Semiconductors is a logic gate with 1 input and a propagation delay of 14 ns. It is designed for automotive applications, with a temperature range of -40 to 125 °C and a moisture sensitivity level of 1.

Median Price

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Lifecycle Status

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Corohmni

South Africa . 388 parts In-Stock

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AZTECH Wire

Italy . 9,932 parts In-Stock

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Singapore . 576 parts In-Stock

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Aztec Data Supply Inc.

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Advanced Electronics

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Semicontronic

India . 1,543 parts In-Stock

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Overview

Looking for a reliable logic gate that delivers exceptional performance? Look no further than the 74LVC1G14GW-Q100 by NXP Semiconductors. Known for their top-quality products, NXP Semiconductors has designed this logic gate to meet the highest standards in the industry. With its compact size and versatile applications, this logic gate is perfect for various electronic projects. Whether you're building a prototype or working on automotive applications, the 74LVC1G14GW-Q100 offers incredible value, superior benefits, and unmatched advantages. Experience the difference with NXP Semiconductors today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making it suitable for various environments.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common voltage level, compatible with many systems and devices.

Propagation Delay (tpd): 14 ns

Ensures fast signal processing and minimal delay, crucial for efficient performance.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Can operate in cold environments without performance issues, increasing versatility.

Technology: CMOS

Utilizes CMOS technology known for low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Logic Gates 74LVC1G14GW-Q100 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

Length:

2.05 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

14 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LVC1G14GW-Q100 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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