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CD74HC14M

Texas Instruments

CD74HC14M by Texas Instruments

CD74HC14M by Texas Instruments is a CMOS logic gate with 6 functions, 41ns propagation delay at 4.5V. It operates in temperatures from -55 to 125°C, suitable for military-grade applications requiring Schmitt Trigger technology and a small outline package.

Median Price

$0.734

Lifecycle Status

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Adafruit Industries

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Chip1Stop

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Mouser Electronics

USA . 29,406 parts In-Stock

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UK . 15 parts In-Stock

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Freelance Electronics

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Digiode

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Semicontronic

India . 5,716 parts In-Stock

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Corohmni

South Africa . 26 parts In-Stock

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Advanced Electronics

New Zealand . 40 parts In-Stock

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Modulus Dynamics

Lithuania . 750 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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$0.668

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$0.659

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Parana Technologies

USA . 1,850 parts In-Stock

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DigiPath Technology Company

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Germany . 3,095 parts In-Stock

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IDEA Electronic Components Group

UK . 1,435 parts In-Stock

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Perfect Parts

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Overview

Discover the ultimate solution for your logic gate needs with the Texas Instruments CD74HC14M. This top-quality product offers unparalleled performance and reliability, thanks to its manufacturer's renowned expertise in the industry. Perfect for a wide range of applications, this logic gate provides exceptional value by delivering fast propagation delay, low power consumption, and precise functionality. Elevate your projects with the CD74HC14M and experience the difference that superior quality can make.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material makes the product durable and lightweight, ideal for various applications.

Propagation Delay At Nominal Supply:

41 ns - Low propagation delay ensures quick signal processing, making this product efficient for high-speed operations.

Surface Mount:

YES - Being surface mountable makes the product easy to install and suitable for compact PCB designs.

No. of Functions:

6 - With 6 functions in one package, this product offers versatility and cost-effectiveness for different logic gate requirements.

Nominal Supply Voltage / Vsup (V):

4.5 - Operating at a nominal supply voltage of 4.5V ensures compatibility with common power supply configurations.

Load Capacitance (CL):

50 pF - The low load capacitance minimizes signal distortion and enhances the overall performance of the product.

Power Supplies (V):

2/6 - With support for power supplies ranging from 2V to 6V, this product offers flexibility in various operating environments.

No. of Terminals:

14 - The ample number of terminals allows for easy connectivity and integration within a circuit setup.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space on the PCB and enables denser circuit designs.

Maximum I (ol):

5.2 Amp - High maximum output current handling capacity ensures reliability and robustness in challenging operating conditions.

Propagation Delay (tpd):

205 ns - The specified propagation delay of 205ns indicates stable signal processing capabilities for consistent performance.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature makes the product suitable for industrial and harsh environments.

Minimum Operating Temperature:

55 °C - The low minimum operating temperature range allows the product to function effectively in extreme conditions.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - The use of high-quality terminal finish enhances conductivity and corrosion resistance for long-term reliability.

Terminal Position:

DUAL - Dual terminal positions provide flexibility in mounting options and circuit board layouts.

Maximum Seated Height:

1.75 mm - The low seated height enables the product to be used in space-constrained applications.

Width:

3.9 mm - The compact width of the product allows for efficient space utilization on the circuit board.

Minimum Supply Voltage (Vsup):

2 V - The low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature tolerance simplifies the soldering process during assembly and rework.

Length:

8.65 mm - The moderate length of the product provides a balance between compactness and ease of handling.

Temperature Grade:

MILITARY - The military-grade temperature specifications make this product suitable for rugged and demanding applications.

Schmitt Trigger:

YES - The inclusion of a Schmitt trigger enhances noise immunity and signal stability in the product.

Technology:

CMOS - Utilizing CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form:

GULL WING - The gull-wing terminal form facilitates easy soldering and ensures secure connections on the circuit board.

Packing Method:

TUBE - The tube packing method provides protection during transportation and storage, preserving the product's quality.

Terminal Pitch:

1.27 mm - The standard terminal pitch allows for compatibility with common PCB layouts and connectors.

Maximum Supply Voltage (Vsup):

6 V - The high maximum supply voltage rating ensures resilience against voltage fluctuations and overloads.

Maximum Power Supply Current (ICC):

0.04 mA - The low maximum power supply current requirement results in energy-efficient operation and reduced power consumption.

Technical Specifications

Logic Gates CD74HC14M attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

41 ns

Propagation Delay (tpd):

205 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74HC14M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-453-4035, 5962014534035

NIIN

014534035

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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