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SN74LVC04AD

Texas Instruments

SN74LVC04AD by Texas Instruments

SN74LVC04AD by Texas Instruments is a logic gate with 6 functions. It has a propagation delay of 6 ns and operates at a nominal voltage of 1.8V. This small outline package is commonly used in automotive applications due to its temperature grade and compact size.

Median Price

$0.568

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Adafruit Industries

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Corphita

USA . 3,543 parts In-Stock

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$0.302

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Ampacity Inc.

Singapore . 12,881 parts In-Stock

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Semicontronic

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Argo Parts USA

USA . 2,123 parts In-Stock

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Continental Prestige Electronics

USA . 1,777 parts In-Stock

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Corohmni

South Africa . 3 parts In-Stock

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Advanced Electronics

New Zealand . 31 parts In-Stock

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Parana Technologies

USA . 2,319 parts In-Stock

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DigiPath Technology Company

USA . 2,348 parts In-Stock

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Germany . 3,352 parts In-Stock

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IDEA Electronic Components Group

UK . 125 parts In-Stock

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$24.340

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Perfect Parts

USA . 53,659 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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$101.830

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GreenTree Electronics

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the SN74LVC04AD Logic Gates. As a leader in the industry, Texas Instruments delivers cutting-edge technology and innovation. With its small outline package style and surface mount capability, this product offers flexibility and convenience. Boasting a nominal supply voltage of 1.8V and maximum power supply current of only 0.01mA, the SN74LVC04AD is tailored to provide optimized performance for various applications. Whether you're working on automotive projects or require high-speed logic gates, this product is designed to exceed your expectations. Embrace the value and benefits of the SN74LVC04AD by Texas Instruments for your next project and experience unparalleled excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and resistance to physical damage, making it suitable for various applications.

Propagation Delay At Nominal Supply: 6 ns

With a low propagation delay of 6 ns, this logic gate provides fast and efficient signal processing, allowing for rapid data transmission.

Surface Mount: YES

The surface mount capability enables easy installation and soldering onto PCBs, saving time and effort during assembly.

No. of Functions: 6

With 6 built-in functions, this logic gate offers versatility in performing multiple logic operations, reducing the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, optimizing the layout and enabling integration into compact electronic devices.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V, this logic gate promotes energy efficiency and is ideal for low-power applications.

Load Capacitance (CL): 50 pF

The ability to handle a load capacitance of 50 pF ensures compatibility with a wide range of devices, allowing for seamless integration in various electronic systems.

Power Supplies (V): 3.3

The availability of power supplies at 3.3V ensures compatibility with common voltage levels in modern electronic circuits, making it a versatile choice.

No. of Terminals: 14

With 14 terminals, this logic gate provides sufficient connectivity options for interfacing with other components and circuits, enhancing system design flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables a compact and space-saving design, making it an excellent choice for applications with size constraints.

Maximum I (ol): 24 Amp

Capable of handling a maximum output current (Iol) of 24 Amps, this logic gate can drive load circuits with high current requirements.

Propagation Delay (tpd): 9.5 ns

The propagation delay of 9.5 ns ensures accurate and speedy signal transmission, enabling efficient data processing and reducing latency.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this logic gate can withstand high-temperature environments, expanding its range of applications.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40°C makes this logic gate suitable for use in extreme cold conditions and outdoor settings.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable and long-lasting performance.

Terminal Position: DUAL

The dual terminal position allows for flexible PCB mounting options, enhancing ease of installation and accommodating various circuit layouts.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75 mm, this logic gate contributes to a low-profile design, enabling compatibility with slim devices and reducing overall system height.

Width: 3.9 mm

The compact width of 3.9 mm ensures space efficiency in PCB layouts, allowing for optimal utilization of limited board space.

Minimum Supply Voltage (Vsup): 1.65 V

With a minimum supply voltage of 1.65V, this logic gate can operate efficiently with low-power sources, making it suitable for portable and battery-powered devices.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables easy integration into PCB assembly processes, ensuring reliable solder joints and enhancing manufacturing efficiency.

Length: 8.65 mm

With a length of 8.65 mm, this logic gate offers a compact form factor, enhancing its suitability for applications where space is limited.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation across a wide temperature range, making this logic gate suitable for automotive electronics and other demanding environments.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption, high noise immunity, and compatibility with a wide range of digital circuits.

Terminal Form: GULL WING

The gull-wing terminal form enables easy attachment and soldering to PCB pads, ensuring secure electrical connections and facilitating automated assembly processes.

Packing Method: TUBE

Packaged in a tube, this logic gate offers convenient storage, protection, and transportation during both manufacturing and distribution processes.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this logic gate provides a standard interface for easy integration into PCB designs and allows for compatibility with various interconnect technologies.

Maximum Supply Voltage (Vsup): 3.6 V

Capable of handling a maximum supply voltage of 3.6V, this logic gate accommodates a wide range of voltage levels, ensuring compatibility with different power sources.

Maximum Power Supply Current (ICC): 0.01 mA

With a maximum power supply current (ICC) of 0.01 mA, this logic gate operates with minimal power consumption, making it an energy-efficient solution.

Technical Specifications

Logic Gates SN74LVC04AD attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74LVC04AD Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-576-3158, 5962015763158

NIIN

015763158

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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