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SN74LVC2G32DCUR

Texas Instruments

SN74LVC2G32DCUR by Texas Instruments

SN74LVC2G32DCUR by Texas Instruments is a logic gate with 2 functions and inputs, operating at 1.8V to 5.5V. It has a propagation delay of 3.8ns, output characteristics in 3-STATE, and can handle up to 0.01mA power supply current. Ideal for automotive applications due to its temperature grade of -40°C to 125°C and small outline package style.

Median Price

$0.350

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 63,501 parts In-Stock

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Chip1Stop

Japan . 3,123 parts In-Stock

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Newark

USA . 760 parts In-Stock

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Mouser Electronics

USA . 572 parts In-Stock

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Rochester

USA . 419,880 parts In-Stock

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DigiKey

USA . 419,880 parts In-Stock

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Verical

USA . 403,956 parts In-Stock

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Arrow

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Digiode

USA . 3,305 parts In-Stock

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Nova Conductors

Japan . 16 parts In-Stock

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Maritex

Poland . 225 parts In-Stock

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Bristol Electronics

USA . 5,622 parts In-Stock

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Vyrian

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Chip Stock

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Semtec, LLC

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Netsource Technology, Inc.

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Zilex Electronics Inc.

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Microfarads

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Connector Distribution Corp

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Atlantic Semiconductor

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Sunrise Surplus Inc.

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LWI Electronics Inc

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Manoshevitz Elec. Sales

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Semicontronic

India . 173,411 parts In-Stock

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Ampacity Inc.

Singapore . 173,352 parts In-Stock

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Corphita

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Corohmni

South Africa . 1,224 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 746 parts In-Stock

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Microchip USA

USA . 4,791 parts In-Stock

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Parana Technologies

USA . 1,117 parts In-Stock

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DigiPath Technology Company

USA . 1,590 parts In-Stock

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$23.435

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ChromeModa Solutions

Germany . 5,310 parts In-Stock

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IDEA Electronic Components Group

UK . 589 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

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Kepictronics

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Metaverse IC Inc.

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A-Z Elektronik GmbH

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Cyclops Electronics Ltd (Excess)

UK . 850 parts In-Stock

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Glotronic Ltd.

UK . 680 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 387 parts In-Stock

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Formix International (Excess)

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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Infinite Electronics LLP (Excess)

. 247 parts In-Stock

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Continental Prestige Electronics

USA . 2 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the SN74LVC2G32DCUR Logic Gates. This high-quality product offers unmatched precision and reliability, making it ideal for a wide range of applications. With its compact design and advanced features, customers can expect superior performance and seamless integration. Upgrade your projects with Texas Instruments' innovative solutions and unlock endless possibilities. Elevate your work with the SN74LVC2G32DCUR Logic Gates today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates, making it suitable for various environments.

Propagation Delay At Nominal Supply: 3.8 ns

Low propagation delay ensures fast processing of signals, making this product efficient for time-sensitive applications.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage, making it energy-efficient and suitable for low-power applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes this product suitable for use in extreme temperature conditions, enhancing its versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates reliable for various digital applications.

Technical Specifications

Logic Gates SN74LVC2G32DCUR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.8 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

SN74LVC2G32DCUR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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