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SN74LVC1G08DBVRG4

Texas Instruments

SN74LVC1G08DBVRG4 by Texas Instruments

SN74LVC1G08DBVRG4 by Texas Instruments is a logic gate with 2 inputs and a propagation delay of 4.5 ns. It operates at a nominal voltage of 3.3V and is commonly used in automotive applications due to its temperature grade and small package size.

Median Price

$0.274

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Modulus Dynamics

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GreenTree Electronics

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Overview

Discover the SN74LVC1G08DBVRG4, an exceptional logic gate by Texas Instruments. Renowned for their superior quality and reliability, Texas Instruments continues to lead the industry with innovative solutions. As part of their extensive range of logic gates, the SN74LVC1G08DBVRG4 stands out with its impressive features and benefits. With a fast propagation delay of just 4.5ns, this surface-mount device offers lightning-fast performance. Its small outline, low profile package shape makes it perfect for space-constrained applications. Whether you're working on automotive electronics or any other project requiring precise signal processing, the SN74LVC1G08DBVRG4 is your go-to solution. Experience the value and advantages this product brings to your designs - choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the logic gates, making them suitable for various environments.

Propagation Delay At Nominal Supply: 4.5 ns

The low propagation delay ensures fast and efficient signal transmission, making this product ideal for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

No. of Functions: 1

Having one function per logic gate makes it straightforward to implement specific digital operations, enhancing overall system design.

No. of Inputs: 2

With two inputs, this logic gate can process binary information effectively, enabling logical operations such as AND or OR.

Package Shape: RECTANGULAR

The rectangular shape facilitates proper positioning and alignment during circuit board assembly, improving overall accuracy.

Nominal Supply Voltage / Vsup (V): 3.3

This voltage level ensures compatibility with standard power supply systems, making the logic gate widely applicable.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures efficient operation and minimizes signal distortion, enhancing the reliability of the logic gate.

Power Supplies (V): 3.3

The availability of a suitable power supply voltage makes this logic gate easy to integrate into existing systems without extensive modifications.

No. of Terminals: 5

The limited number of terminals simplifies circuitry connections, reducing complexity and potential for error during installation.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style enhances space efficiency while maintaining a low profile, making it suitable for compact designs in constrained environments.

Maximum I (ol): 32 Amp

The high maximum output current capability allows for driving various loads, offering versatility in different applications.

Propagation Delay (tpd): 8 ns

The specified propagation delay time denotes fast response characteristics, ensuring minimal lag in processing signals.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance enables reliable operation even in demanding thermal environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for stable performance in extreme cold conditions, expanding the product's potential applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The specified terminal finish provides excellent conductivity, corrosion resistance, and solderability, guaranteeing reliable connections.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit board placement and allows for consistent and reliable signal transmission.

Maximum Seated Height: 1.45 mm

The compact maximum seated height ensures compatibility with space-constrained designs, facilitating efficient PCB layout.

Width: 1.6 mm

The narrow width dimension contributes to space-saving designs while maintaining appropriate electrical performance.

Minimum Supply Voltage (Vsup): 1.65 V

The specified minimum supply voltage requirement ensures reliable operation even at low power supply levels.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for compatibility with lead-free soldering processes, ensuring proper assembly during manufacturing.

Length: 2.9 mm

The compact length of the logic gate accommodates space constraints while still providing the required functionality.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures the logic gate's suitability for use in automotive applications, which often involve demanding temperature conditions.

Technology: CMOS

The use of CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems, enhancing versatility and performance.

Terminal Form: GULL WING

The gull wing terminal form enables smooth surface mount assembly and ensures secure solder joints, enhancing overall product reliability.

Packing Method: TR

The specified packing method, such as tape and reel (TR), simplifies handling, storage, and automatic pick-and-place assembly processes.

Terminal Pitch: 0.95 mm

The small terminal pitch provides compatibility with fine-pitch PCB designs, enabling higher density circuitry with improved performance.

Moisture Sensitivity Level (MSL): 1

With an MSL level of 1, the logic gate remains stable and unaffected when exposed to moisture during storage or assembly.

Maximum Supply Voltage (Vsup): 5.5 V

The logic gate's maximum supply voltage tolerance ensures compatibility with a broad range of power supply systems, amplifying its applicability.

Maximum Power Supply Current (ICC): 0.01 mA

The low maximum power supply current requirement contributes to overall energy efficiency while reducing operating costs.

Technical Specifications

Logic Gates SN74LVC1G08DBVRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G08DBVRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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