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SN74LVC1G14YZVR

Texas Instruments

SN74LVC1G14YZVR by Texas Instruments

SN74LVC1G14YZVR by Texas Instruments is a CMOS logic gate with 5.5 ns propagation delay at 3.3V, suitable for industrial applications. It features Schmitt Trigger technology, operates b/w -40 to 85 °C, and has a load capacitance of 50 pF. This surface-mount device has a very thin profile and fine pitch package style.

Median Price

$0.230

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 376 parts In-Stock

1+ parts

$0.152

100+ parts

$0.144

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$0.142

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376

$0.152

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Texas Instruments

USA . 2,572,093 parts In-Stock

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$0.290

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$0.197

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$0.101

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2,572,093

$0.290

$0.197

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Mouser Electronics

USA . 5,450 parts In-Stock

1+ parts

$0.370

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$0.198

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$0.167

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$0.152

5,450

$0.370

$0.198

$0.167

$0.152

Element14

Singapore . 1,703 parts In-Stock

1+ parts

$0.475

100+ parts

$0.458

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$0.442

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$0.426

1,703

$0.475

$0.458

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$0.426

Rochester

USA . 155,400 parts In-Stock

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-

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$0.183

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$0.152

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$0.136

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DigiKey

USA . 155,400 parts In-Stock

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$0.230

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Verical

USA . 110,900 parts In-Stock

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$0.170

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Chip1Stop

Japan . 2,114 parts In-Stock

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$0.144

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$0.130

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$0.115

2,114

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$0.144

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$0.115

Farnell

UK . 1,702 parts In-Stock

1+ parts

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$0.356

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$0.290

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1,702

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,896 parts In-Stock

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$0.133

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$0.133

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Nova Conductors

Japan . 400 parts In-Stock

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$0.182

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400

$0.182

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Vyrian

USA . 322,907 parts In-Stock

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322,907

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DigiKey Marketplace

USA . 158,500 parts In-Stock

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$0.150

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$0.150

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Chip Stock

USA . 31,355 parts In-Stock

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Bristol Electronics

USA . 10,552 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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Pegasus Components GmbH

Germany . 1,287 parts In-Stock

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Speed Components Ltd

Israel . 186 parts In-Stock

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Prism Electronics

USA . 100 parts In-Stock

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Distributors (Availability)

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iBuyXS LLC

. 15,000 parts In-Stock

1+ parts

$0.090

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$0.090

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Ampacity Inc.

Singapore . 322,740 parts In-Stock

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$0.111

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$0.111

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Semicontronic

India . 322,831 parts In-Stock

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$0.114

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$0.111

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$0.111

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322,831

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Corphita

USA . 631 parts In-Stock

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$0.126

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Argo Parts USA

USA . 284 parts In-Stock

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$0.155

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Continental Prestige Electronics

USA . 2,004 parts In-Stock

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$0.308

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$21.282

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$20.218

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Parana Technologies

USA . 960 parts In-Stock

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$22.804

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$23.468

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$22.804

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DigiPath Technology Company

USA . 279 parts In-Stock

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$25.110

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$23.101

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ChromeModa Solutions

Germany . 1,952 parts In-Stock

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$25.622

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$21.010

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IDEA Electronic Components Group

UK . 1,360 parts In-Stock

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$25.622

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$24.341

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$23.060

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$23.060

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Corohmni

South Africa . 324 parts In-Stock

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$30.693

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Perfect Parts

USA . 37,378 parts In-Stock

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BidChips

USA . 15,000 parts In-Stock

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Lixinc

USA . 8,145 parts In-Stock

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Robosynatics

Brazil . 10 parts In-Stock

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Lucentia Tech

USA . 10 parts In-Stock

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$27.619

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$27.619

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$27.619

10

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$27.619

$27.619

$27.619

Overview

Discover the cutting-edge SN74LVC1G14YZVR by Texas Instruments, a high-quality logic gate that offers unmatched performance and reliability. With a propagation delay of just 5.5 ns and a compact square package shape, this versatile component is perfect for a wide range of applications. From industrial automation to consumer electronics, this logic gate delivers exceptional value with its low power consumption and Schmitt trigger technology. Trust Texas Instruments for top-notch quality and unlock endless possibilities with the SN74LVC1G14YZVR.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures fast response time, suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard 3.3V power supplies, widely used in electronic devices.

Load Capacitance (CL): 50 pF

Can handle a moderate load capacitance, suitable for various circuit designs.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures, ensuring versatility in different operating conditions.

Schmitt Trigger: YES

Includes Schmitt trigger for hysteresis, reducing noise and providing stable output signals.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, suitable for battery-powered devices.

Technical Specifications

Logic Gates SN74LVC1G14YZVR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-XBGA-B4

JESD-609 Code:

e1

Length:

.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA4,2X2,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74LVC1G14YZVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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