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NC7S14P5X

Onsemi

NC7S14P5X by Onsemi

The Onsemi NC7S14P5X is a CMOS logic gate with Schmitt Trigger technology. It operates at a supply voltage range of 2-6V and has a propagation delay of 35ns. With a small outline package, it is ideal for industrial applications requiring fast signal processing in compact spaces.

Median Price

$0.028

Lifecycle Status

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USA . 39,309 parts In-Stock

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Mouser Electronics

USA . 21,063 parts In-Stock

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Arrow

USA . 102,000 parts In-Stock

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Verical

USA . 102,000 parts In-Stock

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Rochester

USA . 9,000 parts In-Stock

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Future Electronics

Canada . 9,000 parts In-Stock

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Chip1Stop

Japan . 6,000 parts In-Stock

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EBV Elektronik

Germany . 3,000 parts In-Stock

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Digiode

USA . 1,794 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Component Electronics Inc.

Canada . 2,706 parts In-Stock

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Chip Stock

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Cyclops Electronics Ltd

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IBS Electronics

USA . 12,000 parts In-Stock

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NAC Semi

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Prism Electronics

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Micros

Poland . 2,985 parts In-Stock

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Partservice

France . 2,985 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

Poland . 2,985 parts In-Stock

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R&J Components

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Atlantic Semiconductor

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Mil-Aero Solutions, Inc.

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Ampacity Inc.

Singapore . 29,227 parts In-Stock

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Semicontronic

India . 23,045 parts In-Stock

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Corphita

USA . 1,740 parts In-Stock

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Corohmni

South Africa . 203 parts In-Stock

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Argo Parts USA

USA . 4,930 parts In-Stock

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Continental Prestige Electronics

USA . 4,261 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Advanced Electronics

New Zealand . 2,335 parts In-Stock

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$14.772

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$14.034

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Aztec Data Supply Inc.

USA . 4,814 parts In-Stock

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Perfect Parts

USA . 832,339 parts In-Stock

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Metaverse IC Inc.

Canada . 183,600 parts In-Stock

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iBuyXS LLC

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RC Electronics

USA . 56,422 parts In-Stock

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Kepictronics

USA . 38,480 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,019 parts In-Stock

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CPlus Electronics

USA . 9,000 parts In-Stock

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Glotronic Ltd.

UK . 7,200 parts In-Stock

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SupplyDigital Components

Austria . 6,290 parts In-Stock

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Lixinc

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Germany . 5,144 parts In-Stock

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Kulean Microsystems

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Spain . 4,381 parts In-Stock

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iodParts Technologies Inc.

India . 4,358 parts In-Stock

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Problanco Electronics

Mexico . 3,143 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Microchip USA

USA . 2,799 parts In-Stock

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Infinite Electronics LLP (Excess)

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Robosynatics

Brazil . 583 parts In-Stock

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$10.978

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$10.978

Lucentia Tech

USA . 583 parts In-Stock

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$11.206

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Supply Digital

USA . 450 parts In-Stock

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Latvia . 396 parts In-Stock

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Futuretech Components

Singapore . 244 parts In-Stock

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UHIMA Technologies

Türkiye . 116 parts In-Stock

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Overview

Unlock limitless possibilities with the Onsemi NC7S14P5X logic gate. Crafted with precision and expertise by Onsemi, this high-quality product offers unparalleled performance and reliability. Perfect for a wide range of applications, this logic gate provides seamless integration and unmatched efficiency. Experience the value and benefits that only Onsemi can deliver with the NC7S14P5X. Elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability.

Propagation Delay at Nominal Supply: 35 ns

With a low propagation delay, this logic gate allows for fast signal processing.

Surface Mount: YES

The surface mount capability makes installation and integration easier and more efficient.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact design for space-saving installations.

Nominal Supply Voltage (Vsup): 3V

Operating at a nominal supply voltage of 3V, this logic gate is efficient in power consumption.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF allows for stable and reliable operation with external components.

Power Supplies (V): 2/6

This logic gate is versatile and compatible with power supplies ranging from 2V to 6V.

No. of Terminals: 5

The 5 terminals offer flexibility in connection options for various circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile of the package make it ideal for compact applications.

Maximum I (ol): 2.6 Amp

With a maximum output current of 2.6 Amps, this logic gate can drive high loads.

Propagation Delay (tpd): 125 ns

The propagation delay of 125 ns ensures quick response time for signal processing.

Maximum Operating Temperature: 85 °C

The high operating temperature range of 85°C allows for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this logic gate is suitable for use in harsh conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and solderability for easy installation.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and connection options.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1 mm allows for a compact and space-efficient design.

Width: 1.25 mm

The narrow width of 1.25 mm enables tight spacing and efficient PCB layout.

Minimum Supply Voltage (Vsup): 2V

With a minimum supply voltage of 2V, this logic gate can operate in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second peak reflow time allows for proper soldering and thermal management.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliability under high temperatures.

Length: 2 mm

The compact length of 2 mm allows for efficient use of PCB space.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this logic gate is suitable for rugged environments.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger ensures noise immunity and reliable digital signal processing.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering.

Packing Method: TR

The TR packing method ensures safe transportation and storage of the logic gate.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm allows for precise and secure connections on the PCB.

Maximum Supply Voltage (Vsup): 6V

With a maximum supply voltage of 6V, this logic gate is versatile and compatible with a range of applications.

Maximum Power Supply Current (ICC): 25 mA

Operating with a maximum power supply current of 25 mA, this logic gate is energy-efficient.

Technical Specifications

Logic Gates NC7S14P5X attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2.6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NC7S14P5X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-646-3755, 5962016463755

NIIN

016463755

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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