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SN74LVC1G04DBVRE4

Texas Instruments

SN74LVC1G04DBVRE4 by Texas Instruments

SN74LVC1G04DBVRE4 by Texas Instruments is a CMOS logic gate with 4.2 ns propagation delay at 3.3V, suitable for automotive applications. It has a load capacitance of 50 pF and operates within a temperature range of -40 to 125°C. This small outline package features surface mount technology and dual terminal position with nickel/palladium/gold finish.

Median Price

$0.710

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Mouser Electronics

USA . 266 parts In-Stock

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$0.710

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$0.389

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$0.352

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$0.298

266

$0.710

$0.389

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$0.298

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$0.155

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Digiode

USA . 4,940 parts In-Stock

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$0.408

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Bristol Electronics

USA . 2,645 parts In-Stock

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$0.576

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$0.288

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$0.115

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Chip Stock

USA . 285,460 parts In-Stock

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Vyrian

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Dan-Mar Components

USA . 2,645 parts In-Stock

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Sensible Micro Corp

USA . 1,040 parts In-Stock

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ComSIT Distribution GmbH

Germany . 156 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 539 parts In-Stock

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$0.155

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Argo Parts USA

USA . 3,114 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.155

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$0.152

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Continental Prestige Electronics

USA . 544 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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Modulus Dynamics

Lithuania . 78 parts In-Stock

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$0.172

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$0.165

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Semicontronic

India . 5,419 parts In-Stock

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$0.365

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$0.356

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$0.354

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Ampacity Inc.

Singapore . 5,331 parts In-Stock

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Corphita

USA . 2,750 parts In-Stock

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$0.387

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Component Stockers USA

USA . 8,139 parts In-Stock

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$0.420

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$0.130

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Parana Technologies

USA . 1,199 parts In-Stock

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$8.829

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$9.514

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DigiPath Technology Company

USA . 111 parts In-Stock

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$9.722

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$8.944

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ChromeModa Solutions

Germany . 4,367 parts In-Stock

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IDEA Electronic Components Group

UK . 1,147 parts In-Stock

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Perfect Parts

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iodParts Technologies Inc.

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Microchip USA

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Lucentia Tech

USA . 10 parts In-Stock

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Overview

Experience the reliability and efficiency of Texas Instruments with the SN74LVC1G04DBVRE4 Logic Gate. This high-quality component offers seamless integration into various applications, ensuring optimal performance and functionality. With a compact design and advanced technology, this logic gate provides unmatched precision and speed, making it the perfect choice for automotive and industrial projects. Trust Texas Instruments to deliver superior products that exceed expectations and enhance your projects with unparalleled value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 4.2 ns

Low propagation delay ensures fast signal processing, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Easy to install and saves space on the circuit board, making it ideal for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 3.3

Works efficiently at a common supply voltage, making it compatible with many electronic systems.

Load Capacitance (CL): 50 pF

Optimized for driving loads with capacitance of 50 pF, ensuring reliable performance in various circuit configurations.

Power Supplies (V): 3.3

Operates at a low power supply voltage, reducing power consumption and heat generation in the system.

No. of Terminals: 5

Simple interface with only 5 terminals, making it easy to integrate into circuits and reducing complexity.

Maximum I (ol): 32 Amp

Capable of driving high output currents up to 32 Amp, making it suitable for applications with demanding load requirements.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold temperatures, making it suitable for automotive and industrial applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high noise immunity, and compatibility with a wide range of systems.

Technical Specifications

Logic Gates SN74LVC1G04DBVRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G04DBVRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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