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SN74LVC1G07DBVR

Texas Instruments

SN74LVC1G07DBVR by Texas Instruments

SN74LVC1G07DBVR by Texas Instruments is a logic gate with 4.7ns propagation delay, 1.8V nominal voltage, and 32A max I (ol). It is used in automotive applications due to its open-drain output characteristics and small outline package style.

Median Price

$0.120

Lifecycle Status

Suppliers In-Stock

54

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 96,152 parts In-Stock

1+ parts

$0.120

100+ parts

$0.061

1k+ parts

$0.049

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$0.120

$0.061

$0.049

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DigiKey

USA . 74,340 parts In-Stock

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$0.120

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$0.060

1k+ parts

$0.049

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$0.043

74,340

$0.120

$0.060

$0.049

$0.043

Arrow

USA . 935 parts In-Stock

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$0.120

100+ parts

$0.058

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$0.044

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935

$0.120

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Verical

USA . 935 parts In-Stock

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RS (Exports)

UK . 700 parts In-Stock

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Chip1Stop

Japan . 13 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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Digiode

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TME

Poland . 4,973 parts In-Stock

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Component Electronics Inc.

Canada . 5 parts In-Stock

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Forefront Electronics and Design

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Component Sense

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Bristol Electronics

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ComSIT USA

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Italy . 57 parts In-Stock

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Ampacity Inc.

Singapore . 53,737 parts In-Stock

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$0.031

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iBuyXS LLC

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Semicontronic

India . 107,475 parts In-Stock

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Argo Parts USA

USA . 3,184 parts In-Stock

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$0.073

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Continental Prestige Electronics

USA . 2,153 parts In-Stock

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Corohmni

South Africa . 674 parts In-Stock

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Modulus Dynamics

Lithuania . 113 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Advanced Electronics

New Zealand . 400 parts In-Stock

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$0.076

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Corphita

USA . 2,383 parts In-Stock

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Component Stockers USA

USA . 165,919 parts In-Stock

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$0.320

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Parana Technologies

USA . 1,317 parts In-Stock

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$9.123

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$9.775

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DigiPath Technology Company

USA . 1,435 parts In-Stock

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$10.046

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$9.242

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ChromeModa Solutions

Germany . 2,256 parts In-Stock

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$10.251

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$8.406

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$10.251

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IDEA Electronic Components Group

UK . 407 parts In-Stock

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$10.251

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$9.738

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$9.226

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GreenTree Electronics

Israel . 200,000 parts In-Stock

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Authorized Procurement Solutions

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Infinite Electronics LLP (Excess)

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Computer Components Inc. - USA

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Allen Electronics Distributors

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ChipstoGo Electronic ltd

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Germany . 1,403 parts In-Stock

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XScomponents

USA . 1,100 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LVC1G07DBVR by Texas Instruments, a high-quality logic gate that promises reliable performance and precision engineering. Manufactured by the renowned Texas Instruments, this product is designed to meet the demands of various applications in the field of electronics. With its compact size and impressive specifications, this logic gate offers exceptional value and benefits to customers looking for efficient solutions for their projects. Upgrade your designs with the SN74LVC1G07DBVR and experience the difference in performance and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 4.7 ns

Low propagation delay ensures fast operation and response time, making these logic gates suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, saving space and making the product suitable for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 1.8

Compatible with a nominal supply voltage of 1.8V, making it energy efficient and suitable for low-power applications.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures efficient operation and minimal power consumption.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, these logic gates can withstand high-temperature environments, making them suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making these logic gates reliable and efficient.

Technical Specifications

Logic Gates SN74LVC1G07DBVR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

8.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G07DBVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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