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JM38510/37006B2A

Texas Instruments

JM38510/37006B2A by Texas Instruments

JM38510/37006B2A by Texas Instruments is a 6-function logic gate with 17ns propagation delay at 5V. It features TTL technology, operates in military temperature grade range (-55 to 125 °C), and has a max power supply current of 4.4mA. Ideal for applications requiring high-speed signal processing in harsh environments.

Median Price

$11.700

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$8.942

100+ parts

-

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3

$8.942

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Verical

USA . 3 parts In-Stock

1+ parts

$8.942

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3

$8.942

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Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$11.700

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3

$11.700

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Rochester

USA . 22 parts In-Stock

1+ parts

-

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$28.880

1k+ parts

$25.840

10k+ parts

$24.320

22

-

$28.880

$25.840

$24.320

DigiKey

USA . 22 parts In-Stock

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Avnet

USA . 13 parts In-Stock

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$20.591

1k+ parts

$20.083

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13

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$20.591

$20.083

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,134 parts In-Stock

1+ parts

$2.266

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-

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4,134

$2.266

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-

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Freelance Electronics

USA . 6 parts In-Stock

1+ parts

$12.906

100+ parts

$13.552

1k+ parts

$12.777

10k+ parts

-

6

$12.906

$13.552

$12.777

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Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$23.104

100+ parts

-

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32

$23.104

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Vyrian

USA . 8,557 parts In-Stock

1+ parts

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8,557

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Electronic Expediters

USA . 69 parts In-Stock

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DigiKey Marketplace

USA . 22 parts In-Stock

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Electronics Depot

USA . 3 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 11 parts In-Stock

1+ parts

$2.030

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11

$2.030

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Semicontronic

India . 11 parts In-Stock

1+ parts

$2.030

100+ parts

$1.979

1k+ parts

$1.969

10k+ parts

-

11

$2.030

$1.979

$1.969

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Corphita

USA . 2,586 parts In-Stock

1+ parts

$2.146

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2,586

$2.146

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Corohmni

South Africa . 386 parts In-Stock

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$8.532

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386

$8.532

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AZTECH Wire

Italy . 269 parts In-Stock

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$12.936

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$12.936

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Parana Technologies

USA . 387 parts In-Stock

1+ parts

$15.174

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$15.572

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387

$15.174

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$15.572

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DigiPath Technology Company

USA . 1,667 parts In-Stock

1+ parts

$16.708

100+ parts

$15.371

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1,667

$16.708

$15.371

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ChromeModa Solutions

Germany . 5,464 parts In-Stock

1+ parts

$17.049

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$13.980

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5,464

$17.049

$13.980

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IDEA Electronic Components Group

UK . 1,292 parts In-Stock

1+ parts

$17.049

100+ parts

$16.197

1k+ parts

$15.344

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1,292

$17.049

$16.197

$15.344

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Continental Prestige Electronics

USA . 5,685 parts In-Stock

1+ parts

$21.597

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$21.165

5,685

$21.597

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$21.165

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$23.104

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$22.641

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2,000

$23.104

$22.641

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Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$26.800

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$24.656

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$23.104

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650

$26.800

$24.656

$23.104

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Microchip USA

USA . 1,536 parts In-Stock

1+ parts

$58.190

100+ parts

$57.180

1k+ parts

$56.670

10k+ parts

$56.170

1,536

$58.190

$57.180

$56.670

$56.170

Argo Parts USA

USA . 3,510 parts In-Stock

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Kepictronics

USA . 117 parts In-Stock

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Overview

Looking for top-notch logic gates that deliver exceptional performance? Look no further than the Texas Instruments JM38510/37006B2A. With a reputation for manufacturing high-quality components, Texas Instruments has created a product that boasts a fast propagation delay of 17 ns and a maximum operating temperature of 125°C, making it ideal for a wide range of applications. Whether you're working on military-grade projects or need reliable logic gates for your electronic designs, this versatile chip carrier is sure to meet your needs. Invest in quality, reliability, and performance with Texas Instruments JM38510/37006B2A.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides good protection and durability for the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 17 ns

Low propagation delay allows for quick signal processing, making this product suitable for applications requiring fast response times.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and making the product suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage of 5V makes it compatible with many existing systems and easy to integrate.

Maximum Operating Temperature: 125 °C

High operating temperature range enables the logic gates to function reliably in various environmental conditions.

Technology: TTL

TTL technology ensures compatibility with other TTL components, making it a versatile choice for a wide range of applications.

Technical Specifications

Logic Gates JM38510/37006B2A attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

4.4 mA

Propagation Delay At Nominal Supply:

17 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-M-38510

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

JM38510/37006B2A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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