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JM38510/17103BCA

Texas Instruments

JM38510/17103BCA by Texas Instruments

JM38510/17103BCA by Texas Instruments is a CMOS logic gate with 4 functions, 2 inputs, and 350 ns propagation delay at 5V. Suitable for military applications with MIL-M-38510 Class B screening level, it features open-collector output and operates b/w -55 to 125 °C.

Median Price

$26.710

Lifecycle Status

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1k+

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Arrow

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$24.020

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Verical

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Chip1Stop

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$29.400

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Rochester

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$77.570

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$69.400

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$65.320

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DigiKey

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Digiode

USA . 450 parts In-Stock

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Nova Conductors

Japan . 83 parts In-Stock

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Vyrian

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Electronic Expediters

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North Shore Components

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PC Components Company LLC

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Bristol Electronics

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Resion

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Mil-Aero Solutions, Inc.

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Sunrise Surplus Inc.

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R&J Components

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Sensible Micro Corp

USA . 2 parts In-Stock

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$48.701

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$44.955

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Semicontronic

India . 7 parts In-Stock

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$5.440

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$5.304

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$5.277

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Corphita

USA . 2,666 parts In-Stock

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AZTECH Wire

Italy . 358 parts In-Stock

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$11.175

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Parana Technologies

USA . 1,015 parts In-Stock

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$11.227

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$1,042.630

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$10.105

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DigiPath Technology Company

USA . 930 parts In-Stock

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$12.363

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$12.363

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IDEA Electronic Components Group

UK . 1,750 parts In-Stock

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$12.615

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$11.984

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$11.354

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ChromeModa Solutions

Germany . 683 parts In-Stock

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$12.615

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Advanced Electronics

New Zealand . 600 parts In-Stock

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Corohmni

South Africa . 554 parts In-Stock

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Continental Prestige Electronics

USA . 1,486 parts In-Stock

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Microchip USA

USA . 2,016 parts In-Stock

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$153.590

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$152.230

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Argo Parts USA

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Bastille Electronics

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Overview

Elevate your projects with the JM38510/17103BCA by Texas Instruments, a top-quality logic gate that delivers unrivaled performance and reliability. Crafted with precision in a ceramic, glass-sealed package, this gem from the renowned manufacturer is designed for military-grade applications. With 4 functions and low propagation delay, it offers seamless integration and exceptional results. Whether you're working on aerospace, defense, or industrial projects, this versatile component guarantees efficiency and accuracy. Trust in Texas Instruments to bring you cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material:

CERAMIC, GLASS-SEALED - Provides durability and protection for the internal components.

Propagation Delay At Nominal Supply:

350 ns - Ensures fast processing speed for efficient operation.

No. of Functions:

4 - Offers versatility and flexibility in circuit design.

Screening Level:

MIL-M-38510 Class B - Ensures high quality and reliability in performance.

No. of Inputs:

2 - Allows for multiple input signals to be processed simultaneously.

Nominal Supply Voltage / Vsup:

5V - Compatible with standard power sources for easy integration.

Load Capacitance (CL):

50 pF - Helps in stabilizing the output signal for accurate results.

No. of Terminals:

14 - Provides ample connectivity options for various applications.

Package Style (Meter):

IN-LINE - Offers a compact and space-saving design.

Maximum I (ol):

1.5 Amp - Can handle high output currents without overheating.

Propagation Delay (tpd):

250 ns - Reduces the delay in signal transmission for improved efficiency.

Maximum Operating Temperature:

125 °C - Allows for operation in a wide range of environmental conditions.

Output Characteristics:

OPEN-COLLECTOR - Enables easy interfacing with other components in the system.

Minimum Operating Temperature:

55 °C - Ensures reliable performance in extreme cold environments.

Terminal Finish:

TIN LEAD - Facilitates easy soldering and secure connections.

Terminal Position:

DUAL - Provides flexibility in mounting and installation options.

Maximum Seated Height:

5.08 mm - Fits compactly into tight spaces for space-constrained applications.

Width:

6.67 mm - Offers a slim profile for efficient use of board space.

Minimum Supply Voltage (Vsup):

3V - Can operate at lower power levels for energy efficiency.

Length:

19.56 mm - Fits a standard form factor for easy integration into existing systems.

Temperature Grade:

MILITARY - Meets stringent military standards for ruggedness and durability.

Technology:

CMOS - Utilizes advanced CMOS technology for low power consumption and high-speed operation.

Terminal Form:

THROUGH-HOLE - Ensures secure mounting on PCBs for stable connections.

Packing Method:

TUBE - Facilitates easy storage and organization during production and shipping.

Terminal Pitch:

2.54 mm - Allows for efficient spacing of terminals for easy connectivity.

Maximum Supply Voltage (Vsup):

18V - Can handle higher voltage levels for versatile compatibility.

Maximum Power Supply Current (ICC):

0.00075 mA - Consumes minimal power for energy-efficient operation.

Technical Specifications

Logic Gates JM38510/17103BCA attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

1.5 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

.00075 mA

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

6.67 mm

Trade Compliance

JM38510/17103BCA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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