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CD74AC14M96

Texas Instruments

CD74AC14M96 by Texas Instruments

CD74AC14M96 by Texas Instruments is a CMOS logic gate with 6 functions, operating at 3.3/5V. It features a propagation delay of 10.5ns and load capacitance of 50pF, suitable for military-grade applications requiring Schmitt trigger technology in small outline packages.

Median Price

$0.502

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Texas Instruments

USA . 38,047 parts In-Stock

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Mouser Electronics

USA . 8,630 parts In-Stock

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$0.245

Arrow

USA . 2,130 parts In-Stock

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$0.644

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$0.408

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$0.225

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$0.644

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Verical

USA . 2,090 parts In-Stock

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$0.319

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$0.267

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$0.258

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$0.319

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Chip1Stop

Japan . 2,090 parts In-Stock

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$0.309

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Nova Conductors

Japan . 300 parts In-Stock

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DF Sales Co.

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DF Sales Co.

USA . 2,055 parts In-Stock

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Digiode

USA . 4,664 parts In-Stock

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Vyrian

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Mil-Aero Solutions, Inc.

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Extreme Components

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Prism Electronics

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Chip Stock

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Bristol Electronics

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ComSIT Distribution GmbH

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Semicontronic

India . 10,416 parts In-Stock

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$0.235

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$0.229

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$0.228

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Continental Prestige Electronics

USA . 2,701 parts In-Stock

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Argo Parts USA

USA . 932 parts In-Stock

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$0.297

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$0.288

932

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Corphita

USA . 303 parts In-Stock

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$0.452

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Corohmni

South Africa . 230 parts In-Stock

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Parana Technologies

USA . 2,136 parts In-Stock

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DigiPath Technology Company

USA . 1,349 parts In-Stock

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$16.809

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ChromeModa Solutions

Germany . 5,060 parts In-Stock

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IDEA Electronic Components Group

UK . 2,201 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

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Supply Digital

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A-Z Elektronik GmbH

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Metaverse IC Inc.

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Bastille Electronics

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Akira Global LLC

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GreenTree Electronics

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Overview

Enhance your electronic projects with the high-quality CD74AC14M96 by Texas Instruments. This logic gates component offers reliable performance, fast propagation delay, and a wide operating temperature range, making it ideal for a variety of applications. From industrial automation to consumer electronics, this versatile product provides excellent value and benefits, ensuring seamless integration and efficient operation. Trust Texas Instruments for innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for housing the logic gates.

Propagation Delay At Nominal Supply: 10.5 ns

Fast response time ensures quick processing of signals.

Surface Mount: YES

Easy to install and suitable for modern circuit board designs.

No. of Functions: 6

Can handle multiple logic operations efficiently.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for compatibility with various systems.

Load Capacitance (CL): 50 pF

Optimized for handling capacitance in the circuit.

Power Supplies (V): 3.3/5

Offers flexibility in power input options.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance and ensures good electrical conductivity.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity.

Technical Specifications

Logic Gates CD74AC14M96 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74AC14M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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