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CD74ACT14M96

Texas Instruments

CD74ACT14M96 by Texas Instruments

CD74ACT14M96 by Texas Instruments is a logic gate with 6 functions and 1 input. It has a propagation delay of 14.5 ns and operates at a nominal voltage of 5V. This component is commonly used in military-grade applications due to its temperature grade and moisture sensitivity level.

Median Price

$0.580

Lifecycle Status

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1k+

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Texas Instruments

USA . 11,350 parts In-Stock

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Mouser Electronics

USA . 9,335 parts In-Stock

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$0.580

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$0.320

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$0.277

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9,335

$0.580

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DigiKey

USA . 1,981 parts In-Stock

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$0.580

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$0.319

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$0.276

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Adafruit Industries

USA . 5,000 parts In-Stock

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$18.268

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Arrow

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

USA . 2,927 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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Vyrian

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Connector Distribution Corp

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Right Parts Inc.

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Ashlea Components Ltd

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Sensible Micro Corp

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Bristol Electronics

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Semtec, LLC

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Mentor Electronics Marketing, LLC

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Speed Components Ltd

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Semicontronic

India . 5,111 parts In-Stock

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$0.202

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$0.197

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Aranea Global

USA . 2,000 parts In-Stock

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$0.393

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$0.377

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Continental Prestige Electronics

USA . 2,924 parts In-Stock

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$0.401

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$0.393

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Argo Parts USA

USA . 645 parts In-Stock

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$0.401

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Corphita

USA . 2,771 parts In-Stock

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Corohmni

South Africa . 414 parts In-Stock

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$9.358

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Parana Technologies

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DigiPath Technology Company

USA . 722 parts In-Stock

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ChromeModa Solutions

Germany . 3,878 parts In-Stock

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IDEA Electronic Components Group

UK . 2,068 parts In-Stock

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$10.876

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Glotronic Ltd.

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Benley Electronics

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ChipTracer

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Supply Digital

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Overview

Discover the CD74ACT14M96 by Texas Instruments, a high-quality logic gate that offers unmatched performance and reliability. Manufactured by one of the industry leaders, this product is designed to meet the needs of various applications. With its compact design and advanced technology, it provides fast propagation delay and low power consumption. Whether you're working on industrial automation, consumer electronics, or any other project, this logic gate delivers exceptional value, benefits, and advantages. Trust Texas Instruments for superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 14.5 ns

The low propagation delay ensures fast and efficient signal transmission, ideal for time-critical applications.

Surface Mount: YES

The surface mount design allows for easy and efficient integration onto circuit boards, saving space and facilitating mass production.

No. of Functions: 6

With multiple functions, this logic gate product offers versatility and flexibility in circuit design, reducing the need for additional components.

No. of Inputs: 1

The single input configuration simplifies circuit design and reduces complexity, making it suitable for basic logic operations.

Package Shape: RECTANGULAR

The rectangular shape enables efficient utilization of space on circuit boards, maximizing the integration of multiple components.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage allows for compatibility with a wide range of electronic systems, ensuring ease of integration.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures proper signal handling and stability under different operating conditions.

Power Supplies (V): 5

The 5V power supply requirement simplifies the power management system and ensures ease of integration into existing setups.

No. of Terminals: 14

The ample number of terminals allows for versatile connectivity options, enabling the product to cater to various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides space-efficient integration, making it suitable for compact electronic devices.

Maximum I (ol): 24 Amp

The high maximum output current capability ensures robust and reliable performance, even under demanding load conditions.

Propagation Delay (tpd): 14.5 ns

The low propagation delay guarantees fast signal processing, reducing overall system latency and enhancing performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature enables the product to withstand demanding environmental conditions, enhancing reliability.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the product to operate reliably in cold environments, expanding its range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and ensures reliable electrical connections over an extended lifespan.

Terminal Position: DUAL

The dual terminal position offers flexible mounting options, accommodating different circuit board layouts and simplifying installation.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for space-saving integration, making it suitable for compact electronic devices and systems.

Width: 3.91 mm

The compact width dimensions facilitate efficient use of space on circuit boards, enabling dense integration of components.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement ensures compatibility with various low-power electronic systems, offering versatile integration options.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature ensures safe and efficient soldering during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures reliable soldering and proper component attachment during assembly.

Length: 8.65 mm

The product's compact length dimensions allow for efficient utilization of space on circuit boards, enabling optimal layout and integration.

Temperature Grade: MILITARY

The military temperature grade certification guarantees reliable operation across a wide temperature range, making it suitable for demanding applications.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger in the logic gate design ensures excellent noise immunity, enhancing signal integrity and stability.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and compatibility with a wide range of systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy surface mount soldering, ensuring secure and reliable electrical connections.

Packing Method: TR

The TR packing method ensures convenient handling and protection during transportation and storage, maintaining the product's quality.

Terminal Pitch: 1.27 mm

The specified terminal pitch allows for easy and accurate soldering, enabling efficient integration into circuit board designs.

Moisture Sensitivity Level (MSL): 1

The low moisture sensitivity level ensures the product's resistance to moisture-related damage, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage capability provides a safety margin and ensures reliable operation even in scenarios involving voltage fluctuations.

Maximum Power Supply Current (ICC): 0.08 mA

The very low maximum power supply current requirement minimizes power consumption, allowing for energy-efficient operation.

Technical Specifications

Logic Gates CD74ACT14M96 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Trade Compliance

CD74ACT14M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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