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74AHC1G08GW-Q100,125

NXP Semiconductors

74AHC1G08GW-Q100,125 by NXP Semiconductors

NXP Semiconductors' 74AHC1G08GW-Q100,125 is a CMOS Logic Gate with 2 inputs and 16ns propagation delay. Ideal for automotive applications due to AEC-Q100 screening level, operating b/w -40 to 125 °C. Package style: Small Outline, Thin Profile, Shrink Pitch.

Median Price

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Lifecycle Status

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Avnet

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Chip Stock

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Vyrian

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Anansix

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Nova Conductors

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Microchip USA

USA . 2,804 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,766 parts In-Stock

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Corohmni

South Africa . 102 parts In-Stock

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Advanced Electronics

New Zealand . 70 parts In-Stock

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Semicontronic

India . 209,440 parts In-Stock

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Ampacity Inc.

Singapore . 104,861 parts In-Stock

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Eastek

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GreenTree Electronics

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Argo Parts USA

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Overview

Looking for a reliable and high-quality logic gate for your automotive applications? Look no further than the 74AHC1G08GW-Q100,125 by NXP Semiconductors. With AEC-Q100 screening level, this logic gate ensures robust performance even in challenging environments. Its compact design and low propagation delay make it ideal for space-constrained applications. Trust NXP Semiconductors for cutting-edge technology that delivers value and reliability to your projects. Upgrade to the 74AHC1G08GW-Q100,125 today and experience superior performance like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable makes installation and integration of this logic gate easier and more efficient.

Screening Level: AEC-Q100

AEC-Q100 qualification ensures that the product meets automotive industry standards for reliability and performance.

No. of Inputs: 2

Having 2 inputs allows for basic logic operations to be performed, making it suitable for simple circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V allows compatibility with standard electronic systems and power sources.

Propagation Delay (tpd): 16 ns

With a low propagation delay, this logic gate can quickly process input signals for fast and efficient operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the product can withstand harsh environmental conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this logic gate energy efficient and reliable.

Technical Specifications

Logic Gates 74AHC1G08GW-Q100,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

Length:

2.05 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

16 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74AHC1G08GW-Q100,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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