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74HC08PW-Q100,118

NXP Semiconductors

74HC08PW-Q100,118 by NXP Semiconductors

NXP Semiconductors' 74HC08PW-Q100,118 is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 27 ns at 5V supply voltage, suitable for automotive applications due to AEC-Q100 screening. The package is small outline, thin profile, with gull wing terminals for surface mount assembly.

Median Price

$0.168

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Chip1Stop

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DigiKey

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Adafruit Industries

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Arrow

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TTI

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Rochester

USA . 2,492 parts In-Stock

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Verical

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Farnell

UK . 1,635 parts In-Stock

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Element14

Singapore . 18 parts In-Stock

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Digiode

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Nova Conductors

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Chip Stock

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NAC Semi

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Vyrian

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IBS Electronics

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VNN

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Semicontronic

India . 26,954 parts In-Stock

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Corphita

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Component Stockers USA

USA . 757,501 parts In-Stock

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AZTECH Wire

Italy . 6,667 parts In-Stock

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Ampacity Inc.

Singapore . 43,001 parts In-Stock

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Netroflash

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Argo Parts USA

USA . 935 parts In-Stock

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Microchip USA

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Aztec Data Supply Inc.

USA . 6,830 parts In-Stock

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Corohmni

South Africa . 1,201 parts In-Stock

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Perfect Parts

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Allen Electronics Distributors

USA . 8,950 parts In-Stock

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Futuretech Components

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Supply Digital

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

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Kepictronics

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Overview

Discover the NXP Semiconductors 74HC08PW-Q100,118 Logic Gates, a high-quality solution for your automotive applications. With AEC-Q100 screening level, this product ensures reliability and performance in extreme conditions. Offering 4 functions, quick propagation delay, and low power consumption, this logic gate is a cost-effective choice for your projects. Trust NXP Semiconductors for cutting-edge technology that delivers value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and thermal properties, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 27 ns

The low propagation delay ensures fast response times, making the product suitable for high-speed logic operations.

No. of Functions: 4

Having multiple logic functions in one package saves space on the circuit board and simplifies design complexity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes it compatible with a wide range of electronic systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, making it suitable for automotive applications.

Technical Specifications

Logic Gates 74HC08PW-Q100,118 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74HC08PW-Q100,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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