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SN74AHC1G04DCKR

Texas Instruments

SN74AHC1G04DCKR by Texas Instruments

SN74AHC1G04DCKR by Texas Instruments is a CMOS logic gate with 8.5 ns propagation delay, suitable for automotive applications. It operates at a supply voltage range of 2-5.5 V and has a load capacitance of 50 pF. This surface-mount device features a small outline package with dual terminals and can handle up to 8 Amps of current.

Median Price

$0.057

Lifecycle Status

Suppliers In-Stock

53

In-Stock Inventory

1k+

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Rochester

USA . 40,312 parts In-Stock

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Texas Instruments

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Chip1Stop

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Mouser Electronics

USA . 4,964 parts In-Stock

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DigiKey

USA . 1,271 parts In-Stock

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Arrow

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Farnell

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Verical

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Digiode

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Nova Conductors

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Poland . 1,375 parts In-Stock

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Bristol Electronics

USA . 23,784 parts In-Stock

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Forefront Electronics and Design

USA . 360 parts In-Stock

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Component Electronics Inc.

Canada . 2,758 parts In-Stock

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Ampacity Inc.

Singapore . 253,165 parts In-Stock

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Semicontronic

India . 253,428 parts In-Stock

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Corphita

USA . 1,832 parts In-Stock

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Argo Parts USA

USA . 4,352 parts In-Stock

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Continental Prestige Electronics

USA . 477 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Parana Technologies

USA . 2,152 parts In-Stock

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$11.233

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$11.669

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DigiPath Technology Company

USA . 1,036 parts In-Stock

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$12.369

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$11.379

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ChromeModa Solutions

Germany . 1,485 parts In-Stock

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$12.621

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$10.349

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IDEA Electronic Components Group

UK . 948 parts In-Stock

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$12.621

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$11.990

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$11.359

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Corohmni

South Africa . 791 parts In-Stock

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$20.061

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$34.367

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$32.649

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Perfect Parts

USA . 322,849 parts In-Stock

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Lucentia Tech

USA . 5,000 parts In-Stock

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Authorized Procurement Solutions

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Overview

Unlock the power of innovation with the SN74AHC1G04DCKR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality logic gates for a wide range of applications. With fast propagation delays and a compact design, this product offers exceptional performance and reliability. Whether you're designing automotive electronics or industrial controls, the SN74AHC1G04DCKR provides unmatched value and efficiency. Stay ahead of the competition and elevate your projects with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and protection for the internal components, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 8.5 ns

The low propagation delay ensures fast signal processing, making the logic gates suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage is commonly used in many electronic devices, making the logic gates compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

The low load capacitance ensures minimal signal distortion and reliable operation in high-frequency circuits.

Power Supplies (V): 2/5.5

The wide range of power supply voltages allows for versatility in different operating conditions and environments.

Maximum I (ol): 8 Amp

The high maximum output current capability ensures the logic gates can drive multiple loads without experiencing voltage drop or signal degradation.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the logic gates to function reliably in extreme cold conditions, making them suitable for automotive and industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the logic gates energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates SN74AHC1G04DCKR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74AHC1G04DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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