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SN74LVC1G17DCKTE4

Texas Instruments

SN74LVC1G17DCKTE4 by Texas Instruments

SN74LVC1G17DCKTE4 by Texas Instruments is a CMOS logic gate with 5.5 ns propagation delay, suitable for automotive applications. It operates at a nominal voltage of 3.3V and has a load capacitance of 50 pF. With Schmitt Trigger technology, it offers fast response times in a small outline package.

Median Price

$1.210

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 446 parts In-Stock

1+ parts

$1.210

100+ parts

$0.729

1k+ parts

$0.520

10k+ parts

$0.495

446

$1.210

$0.729

$0.520

$0.495

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 634,420 parts In-Stock

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Digiode

USA . 2,998 parts In-Stock

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Vyrian

USA . 234 parts In-Stock

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Nova Conductors

Japan . 43 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 642 parts In-Stock

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$0.800

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642

$0.800

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Semicontronic

India . 417 parts In-Stock

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$0.800

100+ parts

$0.780

1k+ parts

$0.776

10k+ parts

-

417

$0.800

$0.780

$0.776

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Component Stockers USA

USA . 1,068 parts In-Stock

1+ parts

$0.930

100+ parts

$0.640

1k+ parts

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1,068

$0.930

$0.640

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Corohmni

South Africa . 133 parts In-Stock

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$11.497

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AZTECH Wire

Italy . 823 parts In-Stock

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$13.328

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$15.860

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$15.067

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$15.067

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$15.860

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Parana Technologies

USA . 851 parts In-Stock

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$21.933

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$22.442

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851

$21.933

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$22.442

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DigiPath Technology Company

USA . 103 parts In-Stock

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$24.151

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$22.219

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$24.151

$22.219

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ChromeModa Solutions

Germany . 534 parts In-Stock

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$24.644

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$20.208

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534

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IDEA Electronic Components Group

UK . 256 parts In-Stock

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$24.644

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$23.412

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Argo Parts USA

USA . 3,643 parts In-Stock

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Microchip USA

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Corphita

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Continental Prestige Electronics

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Robosynatics

Brazil . 350 parts In-Stock

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Lucentia Tech

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Bastille Electronics

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Overview

Elevate your projects with the SN74LVC1G17DCKTE4 by Texas Instruments, a top-tier manufacturer known for excellence in the field of Logic Gates. This compact yet powerful component offers lightning-fast propagation delay and robust performance at a nominal supply voltage of 3.3V. Perfect for automotive applications, this product boasts a wide temperature range and reliable functionality. With its small outline and surface-mount capabilities, the SN74LVC1G17DCKTE4 is the ideal choice for efficient circuit designs that demand quality and precision. Upgrade your electronics with this cutting-edge solution and experience unmatched value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures quick response times.

Surface Mount: YES

Easy to integrate into surface mount technology.

Nominal Supply Voltage / Vsup (V): 3.3

Works with common supply voltage, suitable for a wide range of applications.

Load Capacitance (CL): 50 pF

Able to handle moderate load capacitance for reliable performance.

Minimum Operating Temperature: -40 °C

Operates in extreme low temperatures, suitable for harsh environments.

Maximum Seated Height: 1.1 mm

Low profile design for space-constrained applications.

Schmitt Trigger: YES

Incorporates Schmitt Trigger for noise immunity and signal conditioning.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Logic Gates SN74LVC1G17DCKTE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G17DCKTE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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