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74AHC1G08SE-7

Diodes Incorporated

74AHC1G08SE-7 by Diodes Incorporated

74AHC1G08SE-7 by diodes incorporated is a CMOS Logic Gate with 2 inputs, 10.5 ns propagation delay at 3.3V supply voltage, and 8 Amp max I (ol). Ideal for automotive applications due to its small outline package style and wide operating temperature range from -40 to 125°C.

Median Price

$0.058

Lifecycle Status

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17

In-Stock Inventory

1k+

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Arrow

USA . 31 parts In-Stock

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$0.021

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$0.009

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$0.009

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DigiKey

USA . 2,461 parts In-Stock

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$0.100

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$0.050

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$0.041

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$0.036

2,461

$0.100

$0.050

$0.041

$0.036

Mouser Electronics

USA . 1,123 parts In-Stock

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$0.100

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$0.051

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$0.041

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1,123

$0.100

$0.051

$0.041

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Newark

USA . 2,130 parts In-Stock

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$0.422

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$0.137

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$0.082

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$0.422

$0.137

$0.082

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Verical

USA . 93,000 parts In-Stock

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$0.029

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Avnet

USA . 42,000 parts In-Stock

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Element14

Singapore . 2,865 parts In-Stock

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$0.030

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Farnell

UK . 2,045 parts In-Stock

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$0.058

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$0.045

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2,045

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$0.058

$0.045

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Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

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$0.060

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15

$0.060

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TME

Poland . 2,960 parts In-Stock

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$0.090

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$0.048

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$0.038

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2,960

$0.090

$0.048

$0.038

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IBS Electronics

USA . 390,000 parts In-Stock

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$0.044

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$0.044

Vyrian

USA . 207,232 parts In-Stock

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NAC Semi

USA . 168,000 parts In-Stock

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$0.046

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$0.046

Bristol Electronics

USA . 9,492 parts In-Stock

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ComSIT Distribution GmbH

Germany . 7,558 parts In-Stock

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Rutronik

Germany . 3,000 parts In-Stock

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$0.023

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$0.023

VNN

France . 1,929 parts In-Stock

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Semicontronic

India . 206,183 parts In-Stock

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Ampacity Inc.

Singapore . 206,165 parts In-Stock

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Argo Parts USA

USA . 2,154 parts In-Stock

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$0.060

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Modulus Dynamics

Lithuania . 2,991 parts In-Stock

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Corohmni

South Africa . 131 parts In-Stock

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Advanced Electronics

New Zealand . 60 parts In-Stock

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60

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Microchip USA

USA . 2,869 parts In-Stock

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$0.330

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Aztec Data Supply Inc.

USA . 254 parts In-Stock

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$32.840

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Lixinc

USA . 11,836 parts In-Stock

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Continental Prestige Electronics

USA . 2,715 parts In-Stock

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$0.077

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$0.052

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Robosynatics

Brazil . 2,371 parts In-Stock

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Lucentia Tech

USA . 2,371 parts In-Stock

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Overview

Unlock the power of precision with the 74AHC1G08SE-7 by Diodes Incorporated. As a leader in the industry, Diodes Incorporated is known for quality and reliability. This logic gate is perfect for a wide range of applications, offering fast propagation delay and low power consumption. With its small outline and dual terminal position, this product provides maximum performance in a compact package. Trust Diodes Incorporated to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 10.5 ns

With a low propagation delay, this product allows for fast signal processing and high-speed operations.

Surface Mount: YES

Being surface mountable makes the product easier to install and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is commonly used in many electronic devices, enabling compatibility with a wide range of applications.

No. of Inputs: 2

Having two inputs allows for more complex logic operations to be performed, increasing the versatility of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in various electronic systems.

Technical Specifications

Logic Gates 74AHC1G08SE-7 attributes and parameters. Explore more Logic Gates devices from Diodes Incorporated

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AHC1G08SE-7 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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