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74AHC1G08GW/C,125

NXP Semiconductors

74AHC1G08GW/C,125 by NXP Semiconductors

NXP Semiconductors' 74AHC1G08GW/C,125 is a CMOS Logic Gate with 2 inputs, 16ns propagation delay, and operates b/w -40 to 125 °C. It comes in a small outline package suitable for automotive applications.

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5

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1k+

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Digiode

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Nova Conductors

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One Stop Electronics

USA . 479 parts In-Stock

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Corohmni

South Africa . 58 parts In-Stock

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AZTECH Wire

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Advanced Electronics

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Aztec Data Supply Inc.

USA . 3,202 parts In-Stock

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Semicontronic

India . 732 parts In-Stock

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Ampacity Inc.

Singapore . 1,624 parts In-Stock

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Australia . 500 parts In-Stock

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Lucentia Tech

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Argo Parts USA

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Overview

Unlock the potential of your electronic designs with the NXP Semiconductors 74AHC1G08GW/C,125 Logic Gate. Manufactured with precision and expertise, this high-quality component offers reliable performance and efficiency. Ideal for a wide range of applications, this logic gate provides seamless integration and functionality. Experience the value and benefits this product brings to your projects, from increased productivity to enhanced performance. Trust NXP Semiconductors to deliver superior quality components for all your electronics needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation and saves space on the circuit board.

No. of Functions: 1

With one function, this logic gate simplifies circuit design and reduces complexity.

No. of Inputs: 2

Having two inputs allows for basic logic operations to be performed efficiently.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and integrate into electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with most electronic devices.

No. of Terminals: 5

The 5 terminals provide easy connectivity and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers space-saving benefits and ease of assembly.

Propagation Delay (tpd): 16 ns

The low propagation delay of 16ns ensures fast signal processing and high-speed operation.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C ensures reliability even in extreme conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this logic gate can be used in a wide range of environments.

Terminal Finish: TIN

The tin terminal finish provides good electrical conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit layout and connection options.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1mm allows for compact designs and space-saving benefits.

Width: 1.25 mm

The narrow width of 1.25mm allows for dense packing on the circuit board.

Minimum Supply Voltage (Vsup): 2V

Operating at a minimum voltage of 2V enables power-efficient operation in low-power applications.

Length: 2.05 mm

The compact length of 2.05mm saves space on the circuit board and allows for tight layouts.

Temperature Grade: AUTOMOTIVE

This logic gate is designed for automotive applications, ensuring reliability and performance in vehicle electronics.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this logic gate energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure attachment to the circuit board.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting and compact circuit design.

Maximum Supply Voltage (Vsup): 5.5V

With a maximum supply voltage of 5.5V, this logic gate can handle a wide range of power requirements.

Technical Specifications

Logic Gates 74AHC1G08GW/C,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

16 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74AHC1G08GW/C,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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