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74AHC14PW-Q100,118

NXP Semiconductors

74AHC14PW-Q100,118 by NXP Semiconductors

NXP Semiconductors' 74AHC14PW-Q100,118 is a CMOS logic gate with 6 functions and Schmitt Trigger technology. It has a propagation delay of 13.5 ns at 5V, suitable for automotive applications due to AEC-Q100 screening level. Package style is small outline, thin profile, shrink pitch for compact designs.

Median Price

$0.214

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Chip1Stop

Japan . 1,464 parts In-Stock

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DigiKey

USA . 2,677 parts In-Stock

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$0.102

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Newark

USA . 658 parts In-Stock

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Future Electronics

Canada . 15,000 parts In-Stock

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Arrow

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Element14

Singapore . 2,425 parts In-Stock

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Verical

USA . 1,464 parts In-Stock

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$0.151

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$0.105

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$0.096

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Rochester

USA . 1,142 parts In-Stock

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Farnell

UK . 470 parts In-Stock

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Digiode

USA . 4,807 parts In-Stock

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Nova Conductors

Japan . 45 parts In-Stock

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Chip Stock

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IBS Electronics

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NAC Semi

USA . 12,500 parts In-Stock

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Vyrian

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VNN

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Anansix

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Bristol Electronics

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Semicontronic

India . 20,553 parts In-Stock

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Ampacity Inc.

Singapore . 12,594 parts In-Stock

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Corphita

USA . 4,664 parts In-Stock

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AZTECH Wire

Italy . 9,922 parts In-Stock

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Argo Parts USA

USA . 870 parts In-Stock

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Corohmni

South Africa . 290 parts In-Stock

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Continental Prestige Electronics

USA . 105 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,900 parts In-Stock

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$14.570

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Advanced Electronics

New Zealand . 75 parts In-Stock

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Eastek

USA . 52,500 parts In-Stock

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GreenTree Electronics

Israel . 52,500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Authorized Procurement Solutions

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UNI Independent Distributors

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Supply Digital

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Netroflash

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Overview

Discover the high-quality 74AHC14PW-Q100,118 by NXP Semiconductors, a top-tier manufacturer known for delivering reliable logic gates. Ideal for automotive applications, this component offers fast propagation delay and low power consumption, ensuring optimal performance in various systems. With six functions packed into a compact package, this product provides value and efficiency to customers seeking dependable solutions for their projects. Trust NXP Semiconductors for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protects the internal components of the logic gates, making it a reliable choice for various applications.

Propagation Delay At Nominal Supply: 13.5 ns

With a fast propagation delay, this product ensures quick response times, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation on printed circuit boards, saving space and facilitating automated assembly processes.

No. of Functions: 6

Having multiple functions in one component reduces the need for additional components, simplifying the circuit design and potentially reducing costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this product is compatible with common power sources in electronic systems.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in determining the maximum capacitive load that the logic gates can drive, ensuring reliable operation in various circuit configurations.

Power Supplies (V): 2/5.5

This product can operate within a range of supply voltages, providing flexibility in system design and compatibility with different power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions and is suitable for automotive and industrial applications.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger ensures robust signal conditioning, helping in noise immunity and signal integrity in digital circuits.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Logic Gates 74AHC14PW-Q100,118 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

20.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74AHC14PW-Q100,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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