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74AHC1G09GW,125

NXP Semiconductors

74AHC1G09GW,125 by NXP Semiconductors

NXP Semiconductors' 74AHC1G09GW,125 is a logic gate with 2 inputs and propagation delay of 8.5 ns at 5V. It features open-drain output, operates in automotive temperature grade (-40 to 125 °C), and has a small outline package suitable for surface mount applications.

Median Price

$0.093

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 14,304 parts In-Stock

1+ parts

$0.036

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$0.035

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$0.035

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$0.034

14,304

$0.036

$0.035

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$0.034

DigiKey

USA . 4,426 parts In-Stock

1+ parts

$0.120

100+ parts

$0.059

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$0.048

10k+ parts

$0.042

4,426

$0.120

$0.059

$0.048

$0.042

Newark

USA . 299 parts In-Stock

1+ parts

$0.254

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$0.092

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$0.051

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299

$0.254

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$0.051

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Rochester

USA . 33,000 parts In-Stock

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$0.097

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$0.080

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$0.071

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$0.097

$0.080

$0.071

Verical

USA . 24,000 parts In-Stock

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$0.089

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Future Electronics

Canada . 15,000 parts In-Stock

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$0.135

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TTI

USA . 15,000 parts In-Stock

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$0.038

15,000

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$0.038

Chip1Stop

Japan . 2,475 parts In-Stock

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$0.051

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$0.051

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Farnell

UK . 10 parts In-Stock

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$0.087

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$0.037

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$0.032

10

-

$0.087

$0.037

$0.032

Element14

Singapore . 10 parts In-Stock

1+ parts

-

100+ parts

$0.154

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$0.066

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$0.058

10

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$0.154

$0.066

$0.058

Distributors (In-Stock)

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Digiode

USA . 1,165 parts In-Stock

1+ parts

$0.034

100+ parts

-

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1,165

$0.034

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TME

Poland . 908 parts In-Stock

1+ parts

$0.080

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$0.053

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$0.039

10k+ parts

$0.037

908

$0.080

$0.053

$0.039

$0.037

Maritex

Poland . 2,237 parts In-Stock

1+ parts

$0.293

100+ parts

$0.153

1k+ parts

$0.144

10k+ parts

$0.127

2,237

$0.293

$0.153

$0.144

$0.127

Nova Conductors

Japan . 300 parts In-Stock

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$1.000

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$1.000

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Chip Stock

USA . 177,000 parts In-Stock

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IBS Electronics

USA . 57,000 parts In-Stock

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$0.191

57,000

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$0.191

NAC Semi

USA . 12,000 parts In-Stock

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$0.230

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$0.230

Vyrian

USA . 6,253 parts In-Stock

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Bristol Electronics

USA . 4,636 parts In-Stock

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$0.113

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$0.068

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$0.045

4,636

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$0.113

$0.068

$0.045

Semtec, LLC

USA . 2,972 parts In-Stock

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2,972

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A2Z Electronics, Inc.

USA . 2,855 parts In-Stock

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Anansix

USA . 2,773 parts In-Stock

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VNN

France . 1,086 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 14,734 parts In-Stock

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Ampacity Inc.

Singapore . 14,663 parts In-Stock

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Corphita

USA . 1,799 parts In-Stock

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Component Stockers USA

USA . 148,059 parts In-Stock

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$0.030

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148,059

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$0.040

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AZTECH Wire

Italy . 4,837 parts In-Stock

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$0.060

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Argo Parts USA

USA . 4,534 parts In-Stock

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$0.106

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$0.103

4,534

$0.106

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$0.103

Continental Prestige Electronics

USA . 415 parts In-Stock

1+ parts

$0.428

100+ parts

$0.159

1k+ parts

$0.081

10k+ parts

$0.054

415

$0.428

$0.159

$0.081

$0.054

Netroflash

USA . 50 parts In-Stock

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$1.000

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50

$1.000

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Modulus Dynamics

Lithuania . 3,792 parts In-Stock

1+ parts

$10.144

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$10.144

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$10.144

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3,792

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Advanced Electronics

New Zealand . 74 parts In-Stock

1+ parts

$11.721

100+ parts

$11.135

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$11.135

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74

$11.721

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$11.135

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Aztec Data Supply Inc.

USA . 3,277 parts In-Stock

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$30.920

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Corohmni

South Africa . 8 parts In-Stock

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$32.777

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8

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Perfect Parts

USA . 191,542 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 87,032 parts In-Stock

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Eastek

USA . 15,000 parts In-Stock

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GreenTree Electronics

Israel . 12,000 parts In-Stock

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UNI Independent Distributors

Spain . 4,574 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Supply Digital

USA . 837 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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Overview

Experience the superior performance of NXP Semiconductors' 74AHC1G09GW,125 Logic Gates. Designed with precision and reliability in mind, this product offers a fast propagation delay of 8.5 ns, making it perfect for applications where speed is crucial. Whether you're working on automotive electronics or industrial automation, this logic gate delivers exceptional results. With a compact design and excellent output characteristics, the 74AHC1G09GW,125 provides unmatched value and efficiency for your projects. Upgrade your circuits today with NXP Semiconductors!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to environmental factors, ensuring reliable performance over time.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast response time, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

No. of Inputs: 2

Having 2 inputs provides flexibility in logic operations and allows for more complex circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard logic circuits and power sources.

Load Capacitance (CL): 50 pF

Low load capacitance ensures efficient operation and minimizes signal distortion in the circuit.

Power Supplies (V): 2/5.5

Supporting a wide range of power supplies from 2V to 5.5V allows for versatile usage in different voltage environments.

No. of Terminals: 5

Having 5 terminals provides multiple connection points for easy integration into circuits and systems.

Maximum I (ol): 8 Amp

High maximum output current capability of 8A ensures the product can drive heavy loads without issue.

Propagation Delay (tpd): 12.5 ns

Even with a slightly higher propagation delay, the product still offers fast response time suitable for most applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of -40 to 125°C makes this product suitable for automotive and industrial applications.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for easy interfacing with other devices and flexibility in circuit design.

Minimum Operating Temperature: -40 °C

Having a low minimum operating temperature ensures the product can withstand cold environments without issues.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and connection configurations.

Maximum Seated Height: 1.1 mm

Low maximum seated height allows for compact designs and space-saving in tight PCB layouts.

Width: 1.25 mm

Small width makes the product suitable for use in compact electronic devices and circuits.

Minimum Supply Voltage (Vsup): 2 V

Ability to operate at a minimum supply voltage of 2V makes this product energy-efficient and suitable for low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the product is easy to solder and suitable for automated assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable solder joints and secure connections during assembly.

Length: 2.05 mm

Compact length makes the product suitable for use in space-constrained applications and devices.

Temperature Grade: AUTOMOTIVE

Being designed for automotive use, the product meets stringent temperature and reliability requirements for automotive electronics.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for battery-operated and noise-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy soldering during assembly, ensuring reliable connections.

Packing Method: TR

'TR' packing method allows for tape and reel packaging, facilitating automated pick-and-place assembly processes.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm enables high-density mounting and compact PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources and voltage levels.

Technical Specifications

Logic Gates 74AHC1G09GW,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

AHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AHC1G09GW,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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