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SN74LVC2G04DCKRG4

Texas Instruments

SN74LVC2G04DCKRG4 by Texas Instruments

SN74LVC2G04DCKRG4 by Texas Instruments is a logic gate with 2 functions, 4.6 ns propagation delay, and 1.8V nominal voltage. It is used in automotive applications due to its small outline package and CMOS technology, operating b/w -40 to 125°C temperature range.

Median Price

$0.613

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 166,603 parts In-Stock

1+ parts

$0.506

100+ parts

$0.390

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$0.205

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166,603

$0.506

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Mouser Electronics

USA . 30,083 parts In-Stock

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$0.720

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$0.551

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$0.478

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$0.412

30,083

$0.720

$0.551

$0.478

$0.412

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$0.276

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-

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50

$0.276

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Digiode

USA . 4,034 parts In-Stock

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$0.481

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4,034

$0.481

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Vyrian

USA . 105,691 parts In-Stock

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105,691

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Chip Stock

USA . 82,470 parts In-Stock

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Semtec, LLC

USA . 8,330 parts In-Stock

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QIE Inc.

USA . 2,050 parts In-Stock

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Bristol Electronics

USA . 81 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,349 parts In-Stock

1+ parts

$0.276

100+ parts

-

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$0.271

5,349

$0.276

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$0.271

Argo Parts USA

USA . 670 parts In-Stock

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$0.276

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$0.268

670

$0.276

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$0.268

Netroflash

USA . 100 parts In-Stock

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$0.276

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$0.271

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100

$0.276

$0.271

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Semicontronic

India . 105,705 parts In-Stock

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$0.430

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$0.419

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$0.417

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105,705

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$0.417

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Ampacity Inc.

Singapore . 105,577 parts In-Stock

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$0.430

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Corphita

USA . 3,464 parts In-Stock

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$0.455

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Advanced Electronics

New Zealand . 53 parts In-Stock

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$10.673

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$10.139

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Parana Technologies

USA . 1,240 parts In-Stock

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$18.886

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$18.960

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DigiPath Technology Company

USA . 2,031 parts In-Stock

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$20.796

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$20.796

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ChromeModa Solutions

Germany . 4,308 parts In-Stock

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$21.220

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$17.400

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$21.220

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IDEA Electronic Components Group

UK . 312 parts In-Stock

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$21.220

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$20.159

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$19.098

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$21.220

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Corohmni

South Africa . 685 parts In-Stock

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Microchip USA

USA . 2,063 parts In-Stock

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Perfect Parts

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Robosynatics

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Lucentia Tech

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Overview

Enhance your electronic designs with the SN74LVC2G04DCKRG4 logic gate by Texas Instruments, a trusted manufacturer known for delivering high-quality components. Ideal for a wide range of applications, this logic gate offers fast propagation delays and low power consumption, making it a valuable addition to any project. With its compact size and reliable performance, this logic gate provides customers with the efficiency and precision they need to bring their designs to life. Choose Texas Instruments for superior quality and unmatched reliability in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes this product lightweight and durable, perfect for portable electronic devices.

Propagation Delay At Nominal Supply: 4.6 ns

With a low propagation delay, this logic gate ensures quick and efficient signal processing in electronic circuits.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on printed circuit boards, making it ideal for compact designs.

No. of Functions: 2

With two functions in one device, this logic gate offers versatility and efficiency in circuit design.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and alignment on circuit boards, ensuring a seamless integration in electronic systems.

Nominal Supply Voltage: 1.8 V

Operating at a low nominal supply voltage, this logic gate helps in reducing power consumption and heat generation in electronic devices.

Load Capacitance: 50 pF

The 50 pF load capacitance of this logic gate ensures stable and reliable performance in various circuit configurations.

Power Supplies: 3.3 V

Designed to work with a common power supply voltage of 3.3 V, this logic gate is compatible with a wide range of electronic systems.

No. of Terminals: 6

With six terminals, this logic gate offers multiple connection points for easy integration into complex circuit designs.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this logic gate allows for high-density mounting and space-saving on circuit boards.

Technical Specifications

Logic Gates SN74LVC2G04DCKRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.6 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC2G04DCKRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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