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SN74LV1T08DCKR

Texas Instruments

SN74LV1T08DCKR by Texas Instruments

SN74LV1T08DCKR by Texas Instruments is a CMOS logic gate with 2 inputs, 13 ns propagation delay, and 1.8V nominal voltage. It is used in automotive applications due to its small outline package style and thin profile design. With a max operating temperature of 125°C, it offers reliable performance in harsh environments.

Median Price

$0.129

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 96,763 parts In-Stock

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DigiKey

USA . 53,580 parts In-Stock

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$0.071

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$0.058

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Mouser Electronics

USA . 1,041 parts In-Stock

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$0.140

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$0.072

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$0.059

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$0.052

1,041

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Arrow

USA . 122 parts In-Stock

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Chip1Stop

Japan . 2,133 parts In-Stock

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Verical

USA . 237 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 736 parts In-Stock

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Nova Conductors

Japan . 51 parts In-Stock

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Bristol Electronics

USA . 733 parts In-Stock

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733

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Maritex

Poland . 24,083 parts In-Stock

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$0.490

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$0.111

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Chip Stock

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Vyrian

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Semtec, LLC

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Sensible Micro Corp

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Martec Srl

Italy . 853 parts In-Stock

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IBS Electronics

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ComSIT Distribution GmbH

Germany . 257 parts In-Stock

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Prism Electronics

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Cyclops Electronics Ltd

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NAC Semi

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NexGen Digital

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J2 Sourcing AB

Sweden . 2 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 35,372 parts In-Stock

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$0.088

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$0.088

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Semicontronic

India . 29,869 parts In-Stock

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$0.088

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$0.086

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$0.085

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Corphita

USA . 1,059 parts In-Stock

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$0.093

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Argo Parts USA

USA . 4,947 parts In-Stock

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Continental Prestige Electronics

USA . 2,407 parts In-Stock

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$0.217

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Microchip USA

USA . 4,759 parts In-Stock

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$1.245

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$19.847

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$18.855

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$18.855

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$19.847

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Parana Technologies

USA . 1,585 parts In-Stock

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$20.483

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$20.546

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Corohmni

South Africa . 361 parts In-Stock

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$20.693

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DigiPath Technology Company

USA . 2,281 parts In-Stock

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$22.555

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ChromeModa Solutions

Germany . 2,603 parts In-Stock

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$23.015

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IDEA Electronic Components Group

UK . 1,168 parts In-Stock

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$23.015

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$21.864

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$20.714

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Futuretech Components

Singapore . 20,000 parts In-Stock

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Lixinc

USA . 18,342 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 9,600 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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Kepictronics

USA . 4,773 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.213

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$0.206

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Infinite Electronics LLP (Excess)

. 675 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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$3.072

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$3.072

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$3.072

$3.072

iodParts Technologies Inc.

India . 11 parts In-Stock

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Overview

Experience superior performance and reliability with the SN74LV1T08DCKR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality logic gates that are ideal for a wide range of applications. From automotive to industrial settings, this product offers unmatched precision and efficiency. With a low propagation delay, high power supply voltage, and compact design, the SN74LV1T08DCKR provides exceptional value and benefits to customers looking for dependable and high-performing logic gates. Choose Texas Instruments for cutting-edge technology and unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 13 ns

Low propagation delay ensures quick signal processing, making this product efficient for time-sensitive operations.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage, making it energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this logic gate reliable and efficient.

Technical Specifications

Logic Gates SN74LV1T08DCKR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LV1T08DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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