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74HC1G14GW,118

NXP Semiconductors

74HC1G14GW,118 by NXP Semiconductors

74HC1G14GW,118 by NXP Semiconductors is a CMOS Logic Gate with 5 terminals and a propagation delay of 190 ns. It operates in temperatures ranging from -40 to 125 °C and has a supply voltage range of 2-6 V. This small outline package is ideal for automotive applications due to its compact size and surface-mount capability.

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Lifecycle Status

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Chip Stock

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Digiode

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Vyrian

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VNN

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Anansix

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Nova Conductors

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AZTECH Wire

Italy . 5,576 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 1,121 parts In-Stock

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Advanced Electronics

New Zealand . 17 parts In-Stock

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Semicontronic

India . 1,106 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 985 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Robosynatics

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Lucentia Tech

USA . 3,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,537 parts In-Stock

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Argo Parts USA

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Supply Digital

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Overview

Unlock the power of innovation with the 74HC1G14GW,118 by NXP Semiconductors. As a leading manufacturer in the industry, NXP's logic gates offer unparalleled quality and reliability. Designed for a wide range of applications, these small outline, thin profile components provide fast propagation delay and a wide operating temperature range. Whether you're working on automotive projects or industrial applications, this versatile product delivers exceptional performance, making it the ideal choice for your next project. Elevate your designs with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product easier to handle and less prone to damage during handling or installation.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and reducing production costs.

Nominal Supply Voltage: 5V

Operates efficiently at a common supply voltage, making it compatible with a wide range of systems and applications.

Propagation Delay: 190 ns

Fast propagation delay ensures quick response time and efficient signal processing, ideal for high-speed applications.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, suitable for use in automotive or industrial applications where heat may be a factor.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates 74HC1G14GW,118 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

190 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74HC1G14GW,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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