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74LVC1G17GW/C,125

NXP Semiconductors

74LVC1G17GW/C,125 by NXP Semiconductors

74LVC1G17GW/C,125 by NXP Semiconductors is a logic gate with a propagation delay of 7 ns and a load capacitance of 50 pF. It is commonly used in automotive applications due to its temperature grade and Schmitt trigger technology.

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AZTECH Wire

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Overview

Discover the power of the 74LVC1G17GW/C,125 by NXP Semiconductors, a cutting-edge logic gate that delivers unmatched quality and performance. Manufactured by industry-leading NXP Semiconductors, this product showcases their commitment to excellence. With its compact shape and surface mount capability, it is perfect for a wide range of applications. Experience lightning-fast propagation delay and maximum operating temperature of 125°C, ensuring reliable operation even in challenging environments. Trust in the value, benefits, and advantages that the 74LVC1G17GW/C,125 brings to your projects. Don't settle for less when you can have the best.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and protection for the logic gates, making them suitable for various environments and applications.

Propagation Delay At Nominal Supply:

7 ns - The low propagation delay ensures fast response times, making the logic gates ideal for time-sensitive circuits or applications that require quick logic decisions.

Surface Mount:

YES - The surface mount capability allows for easy and efficient integration of the logic gates onto circuit boards, saving valuable space and simplifying the manufacturing process.

No. of Functions:

1 - With a single function, these logic gates provide a focused and dedicated operation, ensuring reliability and simplicity in circuit design.

No. of Inputs:

1 - The logic gates with one input provide simplicity in circuit integration and are ideal for basic logical operations.

Package Shape:

RECTANGULAR - The rectangular shape allows for easy placement and alignment on circuit boards, maximizing efficiency and simplifying assembly.

Nominal Supply Voltage / Vsup (V):

3 - The nominal supply voltage of 3V makes these logic gates compatible with a wide range of electronic systems and power sources.

Load Capacitance (CL):

50 pF - The specified load capacitance ensures optimal performance and stability when driving external loads, making these logic gates suitable for various applications.

Power Supplies (V):

3.3 - The specified power supply voltage of 3.3V ensures compatibility with standard electronic systems, providing hassle-free integration and operation.

No. of Terminals:

5 - The logic gates with a limited number of terminals offer simplicity in circuit design and facilitate easy connectivity, enhancing overall efficiency.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The small outline, thin profile, and shrink pitch package style allows for compact and space-saving integration, making these logic gates suitable for applications with limited board space.

Maximum I (ol):

24 Amp - The high maximum output current allows these logic gates to drive demanding loads, making them suitable for applications that require strong output capability.

Propagation Delay (tpd):

14 ns - The propagation delay of 14 ns ensures efficient and accurate signal transmission, making these logic gates suitable for high-speed applications.

Maximum Operating Temperature:

125 °C - With a wide maximum operating temperature range, these logic gates can withstand harsh environmental conditions, ensuring reliable performance in various applications.

Minimum Operating Temperature:

40 °C - The wide minimum operating temperature range allows these logic gates to function reliably in cold environments, making them suitable for both indoor and outdoor applications.

Terminal Finish:

Tin (Sn) - The tin terminal finish provides corrosion resistance and solderability, ensuring a reliable electrical connection and making these logic gates suitable for long-lasting applications.

Terminal Position:

DUAL - The dual terminal position facilitates easy and secure soldering, ensuring reliable connections and enhancing the overall durability of the logic gates.

Maximum Seated Height:

1.1 mm - The low maximum seated height allows for compact circuit board designs and efficient use of space, making these logic gates ideal for applications with size constraints.

Width:

1.25 mm - The compact width of these logic gates allows for efficient placement on circuit boards, maximizing space utilization and enabling compact designs.

Minimum Supply Voltage (Vsup):

1.65 V - The low minimum supply voltage ensures compatibility with low-power systems and extends the range of applications where these logic gates can be used.

Length:

2.05 mm - The compact length of these logic gates allows for efficient placement and space-saving integration on circuit boards, making them suitable for compact electronic systems.

Temperature Grade:

AUTOMOTIVE - The specified automotive temperature grade ensures that these logic gates can perform reliably in automotive environments, making them suitable for automotive applications.

Schmitt Trigger:

YES - The inclusion of Schmitt trigger functionality enhances noise immunity and signal stability, making these logic gates ideal for applications with noisy or fluctuating input signals.

Technology:

CMOS - With CMOS technology, these logic gates offer low power consumption, fast switching speeds, and wide voltage compatibility, making them suitable for a wide range of electronic systems.

Terminal Form:

GULL WING - The gull wing terminal form allows for easy and secure soldering, ensuring reliable electrical connections and enhancing the overall durability of the logic gates.

Packing Method:

TR - The specified tape and reel (TR) packing method provides convenience and ease of handling during assembly and manufacturing processes, ensuring efficient integration of the logic gates.

Terminal Pitch:

0.65 mm - The narrow terminal pitch allows for compact placement and high-density integration of these logic gates on circuit boards, maximizing space utilization and enabling miniaturized designs.

Maximum Supply Voltage (Vsup):

5.5 V - The high maximum supply voltage ensures compatibility with various electronic systems and power sources, providing flexibility and versatility in application usage.

Technical Specifications

Logic Gates 74LVC1G17GW/C,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LVC1G17GW/C,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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