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74LVC1G08GW,165

NXP Semiconductors

74LVC1G08GW,165 by NXP Semiconductors

NXP Semiconductors' 74LVC1G08GW,165 is a logic gate with 2 inputs and 6 ns propagation delay at 1.8V. It operates in a temperature range of -40 to 125 °C and has a max supply voltage of 5.5V. Ideal for automotive applications due to its small outline package and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 5,710 parts In-Stock

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Digiode

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Nova Conductors

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One Stop Electronics

USA . 682 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 14,083 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,361 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 352 parts In-Stock

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Semicontronic

India . 502 parts In-Stock

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Ampacity Inc.

Singapore . 1,408 parts In-Stock

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Component Stockers USA

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Discover the ultimate solution for your logic gate needs with the NXP Semiconductors 74LVC1G08GW,165. Crafted with precision and quality, this small outline, thin profile chip offers fast propagation delay and dual terminal position for seamless integration. Perfect for automotive applications, this CMOS technology marvel operates flawlessly at temperatures ranging from -40°C to 125°C. Trust NXP's expertise in semiconductor manufacturing and experience the unmatched performance and reliability of the 74LVC1G08GW,165 for all your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 6 ns

Fast propagation delay allows for quick processing of signals, making this product suitable for high-speed applications.

Surface Mount: YES

Can be easily mounted on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy efficient and suitable for battery-powered devices.

No. of Inputs: 2

Provides versatility in designing circuits and allows for implementation in various logic configurations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in automotive and industrial environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ensuring reliable performance.

Technical Specifications

Logic Gates 74LVC1G08GW,165 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LVC1G08GW,165 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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