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74LVC1G14GW

NXP Semiconductors

74LVC1G14GW by NXP Semiconductors

74LVC1G14GW by NXP Semiconductors is a logic gate with a propagation delay of 7 ns and a load capacitance of 50 pF. It is commonly used in automotive applications due to its Schmitt trigger technology and small package size.

Median Price

$0.165

Lifecycle Status

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29

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1k+

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Verical

USA . 9,000 parts In-Stock

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Maritex

Poland . 1,713 parts In-Stock

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$0.064

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Chip Stock

USA . 302,500 parts In-Stock

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Sensible Micro Corp

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ComSIT Distribution GmbH

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Atlantic Semiconductor

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Pegasus Components GmbH

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Flex Direct, LLC

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LIBRA Elektronik GmbH

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Martec Srl

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Prism Electronics

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PC Components Company LLC

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ACDS - Activité Composants Distribution Service

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Component Sense

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AZTECH Wire

Italy . 11,106 parts In-Stock

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Corohmni

South Africa . 284 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Ampacity Inc.

Singapore . 693 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,965 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 1,087 parts In-Stock

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GreenTree Electronics

Israel . 900,000 parts In-Stock

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Futuretech Components

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UNI Independent Distributors

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Corphita

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Authorized Procurement Solutions

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Argo Parts USA

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Continental Prestige Electronics

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ChipstoGo Electronic ltd

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Alle Elektronik GmbH

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Glotronic Ltd.

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Lixinc

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Supply Digital

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Modulus Dynamics

Lithuania . 900 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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Bastille Electronics

Australia . 37 parts In-Stock

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Overview

Experience the ultimate in quality and performance with the 74LVC1G14GW by NXP Semiconductors. As a leading manufacturer in the industry, NXP is known for delivering top-notch products that exceed expectations. The 74LVC1G14GW falls within the Logic Gates category and offers a multitude of applications. From its superior design to its efficient functionality, this product guarantees value and benefits for customers. With a compact package shape and surface mount capability, it is perfect for various electronic devices. Say goodbye to delays with its fast propagation delay and enjoy seamless operations. Whether you're in the automotive industry or require high-quality logic gates, the 74LVC1G14GW is your go-to solution. Trust NXP Semiconductors for all your electronic needs.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The use of plastic/epoxy material in the package body ensures durability and resistance to impact, making it suitable for various applications.

Propagation Delay At Nominal Supply

7 ns - With a low propagation delay, this logic gate product ensures fast signal processing and contributes to overall system efficiency.

Surface Mount

YES - The surface mount capability of this product simplifies the assembly process and allows for compact and space-efficient circuit designs.

No. of Functions

1 - This logic gate product offers a single function, making it suitable for basic logic operations in a wide range of electronic applications.

No. of Inputs

1 - Featuring a single input, this logic gate simplifies circuit designs and meets the requirements of simple logic operations.

Package Shape

RECTANGULAR - The rectangular shape of the package facilitates easy integration into electronic circuits, allowing for efficient space utilization.

Nominal Supply Voltage / Vsup (V)

1.8 - Operating at a nominal supply voltage of 1.8V, this logic gate is suitable for low-power applications, contributing to energy efficiency.

Load Capacitance (CL)

50 pF - With a load capacitance of 50pF, this logic gate can effectively drive capacitive loads and maintain signal integrity in high-frequency applications.

Power Supplies (V)

3.3 - Designed to operate within a voltage range of 3.3V, this logic gate is compatible with common power supply systems, offering versatility in circuit integration.

No. of Terminals

5 - With a limited number of terminals, this logic gate enables compact circuit designs and simplifies the assembly process.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The small outline, thin profile, and shrink pitch package style of this logic gate enable high-density PCB layouts and reduce board space requirements.

Maximum I (ol)

24 Amp - With a maximum output current of 24A, this logic gate can drive high-current loads, expanding its range of possible applications.

Propagation Delay (tpd)

14 ns - The propagation delay of 14ns ensures efficient signal propagation and quick response times, making this logic gate suitable for time-sensitive applications.

Maximum Operating Temperature

125 °C - Being able to operate at high temperatures up to 125°C, this logic gate is suitable for demanding environments without sacrificing performance.

Minimum Operating Temperature

40 °C - With a minimum operating temperature of -40°C, this logic gate can withstand extreme cold conditions, ensuring reliable operation in various environments.

Terminal Finish

Tin (Sn) - The tin finish on the terminals enhances corrosion resistance and solderability, prolonging the product's lifespan and simplifying the assembly process.

Terminal Position

DUAL - Featuring dual terminal positions, this logic gate offers flexibility during circuit board layout, ensuring ease of integration and wiring.

Maximum Seated Height

1.1 mm - With a low maximum seated height, this logic gate allows for compact and slim designs, optimizing space utilization in electronic systems.

Width

1.25 mm - The narrow width of this logic gate promotes efficient utilization of board space, especially in applications where size constraints are significant.

Minimum Supply Voltage (Vsup)

1.65 V - Being able to operate at a minimum supply voltage as low as 1.65V, this logic gate is suitable for low-power applications and extends battery life.

Maximum Time At Peak Reflow Temperature (s)

30 - With a maximum time of 30 seconds at peak reflow temperature, this logic gate ensures proper soldering during assembly, reducing the risk of solder joint defects.

Peak Reflow Temperature °C

260 - Capable of withstanding peak reflow temperatures up to 260°C, this logic gate can be reliably soldered during the assembly process without compromising performance.

Length

2.05 mm - The compact length of this logic gate contributes to space-saving circuit designs, especially in applications where size constraints are crucial.

Temperature Grade

AUTOMOTIVE - This logic gate is designed to meet automotive-grade standards, ensuring reliable operation in harsh environments and automotive applications.

Schmitt Trigger

YES - The presence of a Schmitt Trigger in this logic gate enhances its noise immunity and allows for the precise shaping of input signals, making it suitable for applications with varying input levels.

Technology

CMOS - Utilizing CMOS technology, this logic gate offers low power consumption, fast switching speeds, and wide voltage compatibility, making it suitable for a wide range of applications.

Terminal Form

GULL WING - The gull wing terminal form simplifies the soldering process and provides secure mechanical support, ensuring reliable electrical connections.

Packing Method

TR - This logic gate is packed in tape and reel (TR) format, allowing for automated assembly processes and efficient handling during production.

Terminal Pitch

0.65 mm - With a small terminal pitch of 0.65mm, this logic gate enables high-density circuit designs and facilitates precise PCB layouts.

Moisture Sensitivity Level (MSL)

1 - With an MSL rating of 1, this logic gate has low moisture sensitivity, ensuring reliable operation even in humid environments.

Maximum Supply Voltage (Vsup)

5.5 V - Designed to sustain a maximum supply voltage of 5.5V, this logic gate can tolerate voltage fluctuations and provide flexibility in various power supply configurations.

Technical Specifications

Logic Gates 74LVC1G14GW attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G14GW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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