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SN74LVC2G34DBVR

Texas Instruments

SN74LVC2G34DBVR by Texas Instruments

SN74LVC2G34DBVR by Texas Instruments is a logic gate with 2 functions, 4.1 ns propagation delay, and 50 pF load capacitance. It operates at a nominal voltage of 1.8V and is suitable for automotive applications due to its low profile package style and wide temperature range from -40°C to 125°C.

Median Price

$0.308

Lifecycle Status

Suppliers In-Stock

41

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 138,152 parts In-Stock

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Chip1Stop

Japan . 2,720 parts In-Stock

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Arrow

USA . 176 parts In-Stock

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Mouser Electronics

USA . 6,084 parts In-Stock

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6,084

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$0.284

Newark

USA . 327 parts In-Stock

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$0.670

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$0.370

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DigiKey

USA . 36,705 parts In-Stock

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RS (Exports)

UK . 9,125 parts In-Stock

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Element14

Singapore . 9,034 parts In-Stock

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$0.166

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$0.087

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Verical

USA . 2,970 parts In-Stock

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Farnell

UK . 2,324 parts In-Stock

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Freelance Electronics

USA . 3 parts In-Stock

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$0.052

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Ozdisan Elektronik

Türkiye . 2,435 parts In-Stock

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Digiode

USA . 1,712 parts In-Stock

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Maritex

Poland . 3,049 parts In-Stock

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$0.068

3,049

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TME

Poland . 9,915 parts In-Stock

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$0.333

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9,915

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Nova Conductors

Japan . 100 parts In-Stock

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Component Electronics Inc.

Canada . 1,131 parts In-Stock

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Chip Stock

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Atlantic Semiconductor

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Martec Srl

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NAC Semi

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Connector Distribution Corp

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Sea View Technologies

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Prism Electronics

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Mil-Aero Solutions, Inc.

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LWI Electronics Inc

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Semtec, LLC

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Elcom Components

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Semicontronic

India . 27,081 parts In-Stock

1+ parts

$0.099

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$0.097

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$0.096

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Ampacity Inc.

Singapore . 21,622 parts In-Stock

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Corohmni

South Africa . 87 parts In-Stock

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Argo Parts USA

USA . 629 parts In-Stock

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$0.126

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$0.122

629

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.130

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$0.123

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Corphita

USA . 3,376 parts In-Stock

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$0.140

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Component Stockers USA

USA . 54,352 parts In-Stock

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$0.440

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$0.110

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$0.070

54,352

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$0.070

Bastille Electronics

Australia . 15 parts In-Stock

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$1.000

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$0.950

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$0.902

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$0.890

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$0.890

Parana Technologies

USA . 904 parts In-Stock

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$11.341

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$11.769

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$11.341

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DigiPath Technology Company

USA . 523 parts In-Stock

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$12.488

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$11.489

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IDEA Electronic Components Group

UK . 2,227 parts In-Stock

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$12.743

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$12.106

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$11.469

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ChromeModa Solutions

Germany . 2,067 parts In-Stock

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$12.743

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$10.449

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Continental Prestige Electronics

USA . 24,225 parts In-Stock

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$0.174

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Kepictronics

USA . 12,000 parts In-Stock

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Lixinc

USA . 9,568 parts In-Stock

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 4,842 parts In-Stock

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S.R.D Solutions

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Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$55.150

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100

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$55.150

$55.150

Overview

Unlock the power of cutting-edge technology with the SN74LVC2G34DBVR logic gate by Texas Instruments. Designed with precision and reliability in mind, this small outline package offers lightning-fast propagation delay and low power consumption, making it perfect for a wide range of automotive applications. Trust in Texas Instruments' reputation for superior quality and performance, and experience the value and benefits that this advanced logic gate brings to your projects. Elevate your designs with the SN74LVC2G34DBVR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability of the logic gates.

Propagation Delay At Nominal Supply: 4.1 ns

Low propagation delay ensures fast operation of the logic gates, making them suitable for high-speed applications.

Surface Mount: YES

Being surface mountable, these logic gates can be easily integrated onto circuit boards, saving space and providing ease of assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage of 1.8V, making it power efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, these logic gates can withstand harsh environmental conditions without compromising performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making these logic gates reliable and energy efficient.

Technical Specifications

Logic Gates SN74LVC2G34DBVR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

8.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC2G34DBVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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