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SN74HC14N3

Texas Instruments

SN74HC14N3 by Texas Instruments

SN74HC14N3 by Texas Instruments is a CMOS logic gate with 6 functions, 31 ns propagation delay at 5V. It operates in industrial temperature range (-40 to 85°C) and has Schmitt Trigger feature. Ideal for applications requiring fast signal processing in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,601 parts In-Stock

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Digiode

USA . 4,754 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 682 parts In-Stock

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$11.804

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682

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Parana Technologies

USA . 2,018 parts In-Stock

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$15.823

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$16.182

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$15.823

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Semicontronic

India . 1,287 parts In-Stock

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$17.000

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$16.575

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$16.490

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1,287

$17.000

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$16.490

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IDEA Electronic Components Group

UK . 1,857 parts In-Stock

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$17.779

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$16.890

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$16.001

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$16.890

$16.001

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ChromeModa Solutions

Germany . 1,562 parts In-Stock

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$17.779

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$14.579

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$14.579

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Ampacity Inc.

Singapore . 895 parts In-Stock

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$27.000

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Corohmni

South Africa . 1,165 parts In-Stock

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$30.743

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$30.901

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$29.356

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$29.356

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One Stop Electronics

USA . 319 parts In-Stock

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$32.000

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Continental Prestige Electronics

USA . 439 parts In-Stock

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DigiPath Technology Company

USA . 170 parts In-Stock

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Corphita

USA . 169 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$4.257

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Modulus Dynamics

Lithuania . 96 parts In-Stock

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Argo Parts USA

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Overview

Unlock the power of reliable logic gates with the SN74HC14N3 by Texas Instruments. Crafted with precision and expertise, this product delivers unmatched quality and performance in a variety of applications. Whether you need to amplify signals or control voltage levels, this versatile component offers exceptional value and benefits. Trust in Texas Instruments to provide you with cutting-edge technology that enhances your projects and ensures seamless operation. Experience the advantage of using the SN74HC14N3 and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the internal components of the logic gates.

Propagation Delay at Nominal Supply:

31 ns - Low propagation delay ensures fast and efficient signal processing within the gates.

No. of Functions:

6 - Having multiple functions in a single package offers versatility and flexibility in circuit design.

Package Shape:

RECTANGULAR - The rectangular shape allows for easy integration into circuit boards and saves space.

Nominal Supply Voltage (Vsup):

5V - A common supply voltage that is compatible with many other electronic components.

Load Capacitance (CL):

50 pF - This capacitance value ensures stable and reliable operation of the logic gates.

Power Supplies (V):

2/6 - Supports a range of supply voltages for different applications.

No. of Terminals:

14 - Sufficient terminals for connecting to other components and creating complex circuits.

Package Style (Meter):

IN-LINE - The in-line style makes it easy to arrange multiple logic gates in a compact space.

Maximum I (ol):

4 Amp - High output current capability for driving external loads.

Propagation Delay (tpd):

155 ns - Low propagation delay ensures fast response time in signal processing.

Maximum Operating Temperature:

85 °C - Can operate in a wide range of temperature environments.

Minimum Operating Temperature:

40 °C - Can withstand cold temperatures without affecting performance.

Terminal Position:

DUAL - Dual terminal position for easy installation and connection in circuits.

Maximum Seated Height:

5.08 mm - Low profile design for space-constrained applications.

Width:

7.62 mm - Compact width for efficient use of board space.

Minimum Supply Voltage (Vsup):

2V - Can operate at low supply voltages for energy-efficient designs.

Length:

19.305 mm - Suitable length for accommodating all necessary components.

Temperature Grade:

INDUSTRIAL - Can withstand industrial temperature conditions for reliable operation.

Schmitt Trigger:

YES - Includes Schmitt trigger for noise immunity and signal conditioning.

Technology:

CMOS - CMOS technology offers low power consumption and high noise immunity.

Terminal Form:

THROUGH-HOLE - Through-hole terminals for easy soldering and secure connections.

Terminal Pitch:

2.54 mm - Standard terminal pitch for compatibility with common PCB layouts.

Maximum Supply Voltage (Vsup):

6V - Can handle high supply voltages for versatile applications.

Technical Specifications

Logic Gates SN74HC14N3 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

31 ns

Propagation Delay (tpd):

155 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

5.08 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74HC14N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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