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SN74LVC1G11DCKRG4

Texas Instruments

SN74LVC1G11DCKRG4 by Texas Instruments

SN74LVC1G11DCKRG4 by Texas Instruments is a CMOS logic gate with 3 inputs, 6 terminals, and a propagation delay of 17.2 ns at 3.3V supply voltage. It operates in automotive-grade temperatures from -40 to 125°C, suitable for applications requiring fast response times and low power consumption. The small outline package with surface mount capability makes it ideal for compact electronic designs.

Median Price

$0.176

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 492,750 parts In-Stock

1+ parts

$0.181

100+ parts

$0.123

1k+ parts

$0.063

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492,750

$0.181

$0.123

$0.063

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Mouser Electronics

USA . 5,165 parts In-Stock

1+ parts

$0.380

100+ parts

$0.206

1k+ parts

$0.174

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$0.159

5,165

$0.380

$0.206

$0.174

$0.159

DigiKey

USA . 4,082 parts In-Stock

1+ parts

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$0.172

4,082

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$0.172

Chip1Stop

Japan . 3,000 parts In-Stock

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$0.102

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$0.102

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.146

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100

$0.146

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Digiode

USA . 3,548 parts In-Stock

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$0.172

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Chip Stock

USA . 283,730 parts In-Stock

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283,730

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Vyrian

USA . 133,075 parts In-Stock

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Semtec, LLC

USA . 3,001 parts In-Stock

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Connector Distribution Corp

USA . 2,080 parts In-Stock

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2,080

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Right Parts Inc.

USA . 2,080 parts In-Stock

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Component Sense

UK . 206 parts In-Stock

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Prism Electronics

USA . 8 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 133,016 parts In-Stock

1+ parts

$0.078

100+ parts

-

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133,016

$0.078

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Corohmni

South Africa . 64 parts In-Stock

1+ parts

$0.118

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64

$0.118

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$0.122

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$0.115

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$0.115

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100

$0.122

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$0.115

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.143

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$0.137

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$0.143

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Argo Parts USA

USA . 3,847 parts In-Stock

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$0.146

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$0.141

3,847

$0.146

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$0.141

Continental Prestige Electronics

USA . 494 parts In-Stock

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$0.146

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$0.143

494

$0.146

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Corphita

USA . 4,741 parts In-Stock

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$0.163

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Semicontronic

India . 133,070 parts In-Stock

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$0.170

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$0.166

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$0.165

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133,070

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Microchip USA

USA . 2,451 parts In-Stock

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$0.869

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$0.869

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Parana Technologies

USA . 226 parts In-Stock

1+ parts

$10.967

100+ parts

$1,018.413

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$9.870

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226

$10.967

$1,018.413

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DigiPath Technology Company

USA . 2,285 parts In-Stock

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$12.076

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$12.076

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ChromeModa Solutions

Germany . 6,602 parts In-Stock

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$12.322

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$10.104

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$12.322

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IDEA Electronic Components Group

UK . 404 parts In-Stock

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$12.322

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$11.706

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$11.090

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404

$12.322

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Lixinc

USA . 4,590 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 2,601 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Robosynatics

Brazil . 30 parts In-Stock

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$1.279

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$1.279

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$1.279

30

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$1.279

$1.279

$1.279

Lucentia Tech

USA . 30 parts In-Stock

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$1.279

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$1.279

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$1.279

30

-

$1.279

$1.279

$1.279

Overview

Enhance your electronic projects with the SN74LVC1G11DCKRG4 by Texas Instruments, a high-quality logic gate designed for efficiency and reliability. Manufactured by industry leader Texas Instruments, this small outline, thin profile package offers a quick propagation delay of 4.9 ns, making it ideal for automotive applications and beyond. With a wide supply voltage range and 3-state output characteristics, this logic gate provides flexibility and performance that will bring value to your designs. Upgrade your circuits today with the SN74LVC1G11DCKRG4 and experience the benefits of top-notch technology from Texas Instruments.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 4.9 ns

Low propagation delay ensures fast operation and efficient performance.

No. of Inputs: 3

Having 3 inputs provides flexibility and versatility in logic operations.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common and stable supply voltage, ensuring compatibility with various systems.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and slim package design saves space and allows for high-density integration.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges, making it suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Logic Gates SN74LVC1G11DCKRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

17.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC1G11DCKRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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