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SN74AHC1G08DBVRE4

Texas Instruments

SN74AHC1G08DBVRE4 by Texas Instruments

SN74AHC1G08DBVRE4 by Texas Instruments is a CMOS logic gate with 2 inputs, 14ns propagation delay, and 3.3V nominal voltage. It is ideal for applications requiring fast signal processing in compact electronic devices due to its small outline package and low power consumption of 0.01mA at max supply voltage of 5.5V.

Median Price

$0.400

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,289 parts In-Stock

1+ parts

$0.400

100+ parts

$0.210

1k+ parts

$0.177

10k+ parts

$0.138

4,289

$0.400

$0.210

$0.177

$0.138

Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

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$0.185

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200

$0.185

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Chip Stock

USA . 596,810 parts In-Stock

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596,810

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Vyrian

USA . 7,583 parts In-Stock

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Digiode

USA . 571 parts In-Stock

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Semicontronic

India . 7,704 parts In-Stock

1+ parts

$0.111

100+ parts

$0.108

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$0.108

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-

7,704

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$0.108

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Ampacity Inc.

Singapore . 7,581 parts In-Stock

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$0.111

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7,581

$0.111

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Continental Prestige Electronics

USA . 5,887 parts In-Stock

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$0.177

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$0.173

5,887

$0.177

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$0.173

Argo Parts USA

USA . 4,840 parts In-Stock

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$0.177

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$0.172

4,840

$0.177

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$0.172

Netroflash

USA . 100 parts In-Stock

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$0.185

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Modulus Dynamics

Lithuania . 550 parts In-Stock

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$0.196

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$0.195

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$0.189

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550

$0.196

$0.195

$0.189

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Parana Technologies

USA . 724 parts In-Stock

1+ parts

$7.767

100+ parts

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$8.311

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724

$7.767

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$8.311

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ChromeModa Solutions

Germany . 2,483 parts In-Stock

1+ parts

$8.727

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$7.156

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2,483

$8.727

$7.156

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IDEA Electronic Components Group

UK . 405 parts In-Stock

1+ parts

$8.727

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$8.291

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$7.854

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405

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Corohmni

South Africa . 293 parts In-Stock

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$17.119

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$37.166

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$33.821

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$30.476

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$37.166

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Perfect Parts

USA . 8,850 parts In-Stock

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Corphita

USA . 3,263 parts In-Stock

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Microchip USA

USA . 1,968 parts In-Stock

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DigiPath Technology Company

USA . 1,916 parts In-Stock

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$7.868

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Robosynatics

Brazil . 1,500 parts In-Stock

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Lucentia Tech

USA . 1,500 parts In-Stock

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$1.446

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$1.446

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$1.446

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$1.446

$1.446

$1.446

Overview

Elevate your electronic projects with the SN74AHC1G08DBVRE4 logic gate by Texas Instruments. Known for its high-quality components and reliable performance, Texas Instruments delivers cutting-edge technology in a compact package. Whether you're working on circuit design, robotics, or automation, this logic gate offers fast propagation delay, low power consumption, and wide operating temperature range. Trust Texas Instruments to provide innovative solutions that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the package lightweight and durable, ideal for portable electronic devices.

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast signal processing and minimal lag in the circuit.

Surface Mount: YES

Easy to mount on Printed Circuit Boards (PCBs) for efficient and compact circuit designs.

No. of Inputs: 2

Having 2 inputs allows for more versatile logic operations in the circuit.

Nominal Supply Voltage / Vsup (V): 3.3

Works efficiently with a common supply voltage, suitable for various applications.

Load Capacitance (CL): 50 pF

Optimized for handling capacitive loads in the circuit without significant performance degradation.

Power Supplies (V): 2/5.5

Supports a wide range of power supplies, providing flexibility in voltage requirements.

No. of Terminals: 5

Compact design with a minimal number of terminals for simple connectivity in circuits.

Maximum I (ol): 8 Amp

High output current capability for driving external loads without additional buffer circuits.

Propagation Delay (tpd): 14 ns

Low propagation delay ensures quick response time in logic operations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and harsh environment applications.

Minimum Operating Temperature: -55 °C

Operational in extreme low temperatures, making it suitable for diverse environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for reliable and corrosion-resistant connections.

Schmitt Trigger: YES

Incorporating a Schmitt trigger ensures noise immunity and cleaner signal transitions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Logic Gates SN74AHC1G08DBVRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74AHC1G08DBVRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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