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74LVC1G08GW

NXP Semiconductors

74LVC1G08GW by NXP Semiconductors

NXP Semiconductors' 74LVC1G08GW logic gate has a propagation delay of 6ns, operates at a nominal voltage of 3.3V, and can handle a load capacitance of 50pF. This CMOS technology device is ideal for automotive applications due to its wide operating temperature range from -40°C to 125°C and small package size with thin profile.

Median Price

$0.070

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1k+

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Element14

Singapore . 24,483 parts In-Stock

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Farnell

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Verical

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Nova Conductors

Japan . 100 parts In-Stock

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LIBRA Elektronik GmbH

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Continental Prestige Electronics

USA . 34,757 parts In-Stock

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Argo Parts USA

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Modulus Dynamics

Lithuania . 700 parts In-Stock

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Ampacity Inc.

Singapore . 22,460 parts In-Stock

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AZTECH Wire

Italy . 4,562 parts In-Stock

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Semicontronic

India . 22,736 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Aztec Data Supply Inc.

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South Africa . 1,030 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

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GreenTree Electronics

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Glotronic Ltd.

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Computer Components Inc. - USA

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Robosynatics

Brazil . 30 parts In-Stock

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Lucentia Tech

USA . 30 parts In-Stock

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Overview

Elevate your electronic designs with the NXP Semiconductors 74LVC1G08GW logic gate. Crafted with precision and expertise, this high-quality component offers seamless integration and reliable performance. Ideal for a wide range of applications, from consumer electronics to automotive systems, this logic gate delivers speed and efficiency with a nominal supply voltage of 3.3V and a propagation delay of just 6ns. Trust in NXP Semiconductors for innovative solutions that provide value, benefits, and advantages to meet your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the logic gate, making it suitable for various applications.

Propagation Delay At Nominal Supply: 6 ns

The low propagation delay ensures fast processing speed, making this logic gate ideal for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making this logic gate convenient for compact designs.

No. of Inputs: 2

With two inputs, this logic gate offers versatility and flexibility in circuit design, making it a versatile choice for different logic operations.

Nominal Supply Voltage / Vsup: 3.3V

The nominal supply voltage of 3.3V is a commonly used standard, ensuring compatibility with a wide range of systems and applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable performance and efficient signal transmission in the circuit.

Power Supplies (V): 3.3V

Operating at a power supply voltage of 3.3V, this logic gate is energy-efficient and suitable for low-power applications.

No. of Terminals: 5

With five terminals, this logic gate offers easy connectivity and integration into existing circuit layouts for seamless operation.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and thin profile design of the package allows for space-saving installation, making it ideal for tight layouts.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amp, this logic gate can drive heavier loads and handle high-power applications effectively.

Propagation Delay (tpd): 10.5 ns

The propagation delay of 10.5 ns ensures quick response time, making this logic gate suitable for time-critical operations.

Maximum Operating Temperature: 125 °C

The high operating temperature range of 125°C allows for reliable performance in harsh environments, making this logic gate suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this logic gate can withstand extreme cold conditions, making it suitable for outdoor use.

Terminal Finish: Tin (Sn)

The tin terminal finish provides corrosion resistance and ensures long-term reliability of the connections, making this logic gate durable in various environments.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit layout and allows for easy integration into existing systems, making this logic gate versatile in application.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1 mm allows for compact installation and efficient use of space, making this logic gate suitable for miniaturized designs.

Width: 1.25 mm

With a width of 1.25 mm, this logic gate is compact and space-saving, making it ideal for applications with limited space availability.

Minimum Supply Voltage (Vsup): 1.65V

The minimum supply voltage of 1.65V ensures compatibility with low-power systems, making this logic gate suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time of 30 seconds ensures proper soldering and secure mounting of the logic gate, making it reliable for long-term use.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this logic gate can withstand high-temperature soldering processes, ensuring secure connections and reliable performance.

Length: 2.05 mm

The length of 2.05 mm allows for easy installation and integration into various circuit layouts, making this logic gate versatile in application.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this logic gate meets industry standards for reliability and performance in vehicle systems.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption and high noise immunity, making it suitable for battery-powered devices and noise-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable performance in harsh environments, making this logic gate suitable for rugged applications.

Packing Method: TR

The TR packing method ensures easy handling and storage of the logic gate, making it convenient for production and distribution processes.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this logic gate offers easy soldering and integration into circuit boards, making it suitable for automated assembly processes.

Maximum Supply Voltage (Vsup): 5.5V

With a maximum supply voltage of 5.5V, this logic gate can handle higher voltage levels, making it suitable for a wide range of applications.

Technical Specifications

Logic Gates 74LVC1G08GW attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G08GW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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