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SN74LVC1G04DCKRE4

Texas Instruments

SN74LVC1G04DCKRE4 by Texas Instruments

SN74LVC1G04DCKRE4 by Texas Instruments is a logic gate with 4.2ns propagation delay at 3.3V, suitable for automotive applications. It features a small outline package with 5 terminals and operates b/w -40°C to 125°C temperature range. With a load capacitance of 50pF, it offers low power consumption at 0.01mA ICC.

Median Price

$0.385

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,185 parts In-Stock

1+ parts

$0.120

100+ parts

$0.060

1k+ parts

$0.049

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-

1,185

$0.120

$0.060

$0.049

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Mouser Electronics

USA . 2,869 parts In-Stock

1+ parts

$0.650

100+ parts

$0.361

1k+ parts

$0.309

10k+ parts

$0.288

2,869

$0.650

$0.361

$0.309

$0.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,417 parts In-Stock

1+ parts

$0.104

100+ parts

-

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3,417

$0.104

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Nova Conductors

Japan . 300 parts In-Stock

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$0.157

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$0.157

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Chip Stock

USA . 273,170 parts In-Stock

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Vyrian

USA . 7,918 parts In-Stock

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QIE Inc.

USA . 2,576 parts In-Stock

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2,576

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Connector Distribution Corp

USA . 2,363 parts In-Stock

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2,363

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Right Parts Inc.

USA . 2,363 parts In-Stock

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2,363

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Speed Components Ltd

Israel . 70 parts In-Stock

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70

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Distributors (Availability)

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Corphita

USA . 1,648 parts In-Stock

1+ parts

$0.099

100+ parts

-

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1,648

$0.099

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Ampacity Inc.

Singapore . 7,850 parts In-Stock

1+ parts

$0.102

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7,850

$0.102

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Semicontronic

India . 7,305 parts In-Stock

1+ parts

$0.102

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$0.099

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$0.099

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7,305

$0.102

$0.099

$0.099

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Argo Parts USA

USA . 4,244 parts In-Stock

1+ parts

$0.142

100+ parts

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$0.138

4,244

$0.142

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$0.138

Continental Prestige Electronics

USA . 3,445 parts In-Stock

1+ parts

$0.142

100+ parts

-

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$0.139

3,445

$0.142

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$0.139

Advanced Electronics

New Zealand . 98 parts In-Stock

1+ parts

$20.412

100+ parts

$19.391

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$19.391

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98

$20.412

$19.391

$19.391

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Corohmni

South Africa . 60 parts In-Stock

1+ parts

$24.493

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60

$24.493

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Parana Technologies

USA . 1,418 parts In-Stock

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$28.510

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$48.348

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1,418

$28.510

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$48.348

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DigiPath Technology Company

USA . 1,837 parts In-Stock

1+ parts

$31.393

100+ parts

$28.882

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1,837

$31.393

$28.882

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ChromeModa Solutions

Germany . 5,005 parts In-Stock

1+ parts

$32.034

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$26.268

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$32.034

$26.268

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IDEA Electronic Components Group

UK . 1,187 parts In-Stock

1+ parts

$32.034

100+ parts

$30.432

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$28.831

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$32.034

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$28.831

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Perfect Parts

USA . 33,589 parts In-Stock

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Microchip USA

USA . 2,931 parts In-Stock

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Modulus Dynamics

Lithuania . 1,000 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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$8.627

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$8.627

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$8.627

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$8.627

$8.627

Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Experience superior performance and reliability with the SN74LVC1G04DCKRE4 by Texas Instruments, a leading manufacturer in the industry. As a logic gate device, this product offers fast propagation delay, surface mount capabilities, and a wide operating temperature range, making it ideal for various applications. Whether you're designing automotive systems, consumer electronics, or industrial equipment, this compact and efficient component provides exceptional value, efficiency, and functionality to meet your project requirements. Trust Texas Instruments for innovative solutions that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the logic gates, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 4.2 ns

With a low propagation delay, this product can quickly process signals, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

This voltage is commonly used in many electronic devices, ensuring compatibility with a wide range of applications.

Load Capacitance (CL): 50 pF

With a moderate load capacitance, this product can handle a variety of loads effectively, making it versatile for different circuit designs.

Power Supplies (V): 3.3

Having a consistent power supply voltage helps maintain stable performance and reliability in various operating conditions.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact and efficient package style allows for space-saving integration in crowded PCB layouts, maximizing design flexibility.

Maximum I (ol): 32 Amp

With a high output current capacity, this product can drive strong signals or loads without overheating or performance degradation.

Propagation Delay (tpd): 7.5 ns

Although slightly longer than the nominal delay, this still provides fast signal processing, ensuring efficient operation in various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions or prolonged use without performance issues.

Minimum Operating Temperature: -40 °C

Having a wide temperature range ensures reliable operation even in extreme cold conditions, making it suitable for diverse applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish offers excellent conductivity, corrosion resistance, and solderability for reliable connections and long-term performance.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and routing, allowing for efficient signal paths and optimal circuit design.

Maximum Seated Height: 1.1 mm

With a low profile, this product is suitable for compact designs or applications with limited space, ensuring easy integration and installation.

Width: 1.25 mm

The slim width of this product enables efficient use of PCB real estate, allowing for more components to be packed in a small area for dense circuit designs.

Minimum Supply Voltage (Vsup): 1.65 V

With a low minimum supply voltage, this product can operate in energy-efficient systems or battery-powered devices, extending battery life.

Peak Reflow Temperature °C: 260

This high reflow temperature tolerance ensures proper soldering and rework processes during assembly, maintaining product quality and reliability.

Length: 2 mm

The compact length of this product allows for efficient use of space on the PCB, enabling compact and streamlined circuit designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, this product is suitable for automotive applications where reliability and performance under harsh conditions are crucial.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation, making this product energy-efficient and reliable for various digital applications.

Terminal Form: GULL WING

The gull-wing terminal form provides secure mechanical attachment and easy soldering during assembly, ensuring robust connections for stable performance.

Packing Method: TR

This packing method ensures safe transportation and storage of the product, preventing damage or contamination that could affect its performance.

Terminal Pitch: 0.65 mm

With a fine terminal pitch, this product allows for high-density mounting on the PCB, enabling more components to be placed in a limited space for complex circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage, this product can handle a wide range of voltage levels, ensuring compatibility with various power supply systems.

Maximum Power Supply Current (ICC): 0.01 mA

This low power supply current consumption contributes to energy efficiency and helps reduce overall power consumption in the system, making it cost-effective in the long run.

Technical Specifications

Logic Gates SN74LVC1G04DCKRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G04DCKRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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