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MC74HC00ADR2G

Onsemi

MC74HC00ADR2G by Onsemi

MC74HC00ADR2G by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at a supply voltage range of 2-6V, offering a propagation delay of 55ns at nominal supply. Ideal for military-grade applications due to its small outline package and dual terminal position.

Median Price

$0.200

Lifecycle Status

Suppliers In-Stock

43

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 498 parts In-Stock

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$0.310

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Newark

USA . 12,496 parts In-Stock

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$0.181

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Adafruit Industries

USA . 2,000 parts In-Stock

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$8.541

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$8.114

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EBV Elektronik

Germany . 225,000 parts In-Stock

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Arrow

USA . 55,000 parts In-Stock

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Verical

USA . 55,000 parts In-Stock

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Future Electronics

Canada . 37,500 parts In-Stock

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Chip1Stop

Japan . 35,000 parts In-Stock

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Rochester

USA . 22,939 parts In-Stock

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DigiKey

USA . 11,497 parts In-Stock

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RS (Exports)

UK . 3,950 parts In-Stock

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Farnell

UK . 91 parts In-Stock

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Element14

Singapore . 91 parts In-Stock

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Distributors (In-Stock)

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Freelance Electronics

USA . 1,920 parts In-Stock

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$0.050

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Greenchips

USA . 2,500 parts In-Stock

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$0.106

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$0.101

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$0.091

2,500

$0.111

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$0.091

Digiode

USA . 96 parts In-Stock

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Nova Conductors

Japan . 84 parts In-Stock

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TME

Poland . 2,269 parts In-Stock

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Maritex

Poland . 28 parts In-Stock

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DF Sales Co.

USA . 75 parts In-Stock

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Forefront Electronics and Design

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NAC Semi

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Chip Stock

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Bristol Electronics

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PC Components Company LLC

USA . 2,911 parts In-Stock

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SIE Connect GmbH - GreenChips

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Flex Direct, LLC

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

France . 1,950 parts In-Stock

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Micros

Poland . 1,307 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1,201 parts In-Stock

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ComSIT Distribution GmbH

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Partservice

France . 807 parts In-Stock

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Semtec, LLC

USA . 723 parts In-Stock

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Quantum Digital Technology

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Corohmni

South Africa . 335 parts In-Stock

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Ampacity Inc.

Singapore . 28,165 parts In-Stock

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Semicontronic

India . 15,579 parts In-Stock

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$0.084

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$0.083

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Corphita

USA . 2,381 parts In-Stock

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Component Stockers USA

USA . 64,965 parts In-Stock

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Argo Parts USA

USA . 1,067 parts In-Stock

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$0.187

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Benley Electronics

USA . 3 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$8.541

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$8.114

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Aztec Data Supply Inc.

USA . 2,401 parts In-Stock

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$23.719

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Perfect Parts

USA . 510,661 parts In-Stock

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Eastek

USA . 117,500 parts In-Stock

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RC Electronics

USA . 62,918 parts In-Stock

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$0.180

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Metaverse IC Inc.

Canada . 38,468 parts In-Stock

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Glotronic Ltd.

UK . 34,000 parts In-Stock

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Continental Prestige Electronics

USA . 16,825 parts In-Stock

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Lixinc

USA . 12,694 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,266 parts In-Stock

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Formix International (Excess)

India . 10,842 parts In-Stock

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TANS Electronics

Latvia . 8,170 parts In-Stock

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SupplyDigital Components

Austria . 8,003 parts In-Stock

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S.R.D Solutions

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Microchip USA

USA . 7,148 parts In-Stock

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GreenTree Electronics

Israel . 7,000 parts In-Stock

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Kulean Microsystems

USA . 6,545 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 3,572 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 2,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,432 parts In-Stock

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ChipTracer

USA . 1,672 parts In-Stock

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Infinite Electronics LLP (Excess)

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Netroflash

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 96 parts In-Stock

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Overview

Unlock the power of reliable logic gates with the MC74HC00ADR2G by Onsemi. Known for their superior quality and cutting-edge technology, Onsemi provides top-notch solutions for a wide range of applications. With a compact design and fast propagation delay, this logic gate offers unmatched efficiency and performance. Whether you're working on a military-grade project or a commercial application, this product is sure to meet your needs. Trust Onsemi for premium quality components that deliver exceptional value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 55 ns

Fast propagation delay ensures quick processing of signals, making the logic gates efficient for high-speed applications.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Having multiple functions in a single component reduces the need for additional circuitry, saving space and cost.

Nominal Supply Voltage / Vsup (V): 3

Operating at a low voltage of 3V makes the logic gates energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates suitable for a wide range of applications.

Technical Specifications

Logic Gates MC74HC00ADR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

55 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74HC00ADR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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