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MC74HC1G14DFT1G

Onsemi

MC74HC1G14DFT1G by Onsemi

MC74HC1G14DFT1G by Onsemi is a Schmitt Trigger CMOS logic gate with 90ns propagation delay at 3V. It has a load capacitance of 50pF and operates b/w -55 to 125°C. Ideal for applications requiring fast signal processing in compact spaces.

Median Price

$0.043

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

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Newark

USA . 133 parts In-Stock

1+ parts

$0.111

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$0.052

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$0.044

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133

$0.111

$0.052

$0.044

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Mouser Electronics

USA . 7,171 parts In-Stock

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$0.120

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$0.043

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$0.036

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7,171

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$0.043

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$0.033

Future Electronics

Canada . 231,000 parts In-Stock

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DigiKey

USA . 87,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 87,000 parts In-Stock

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Arrow

USA . 27,000 parts In-Stock

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Verical

USA . 27,000 parts In-Stock

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EBV Elektronik

Germany . 27,000 parts In-Stock

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Element14

Singapore . 17,370 parts In-Stock

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$0.130

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$0.066

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$0.043

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$0.043

Rochester

USA . 15,000 parts In-Stock

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$0.034

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$0.028

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$0.025

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$0.034

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Farnell

UK . 4,085 parts In-Stock

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Chip1Stop

Japan . 3,000 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,330 parts In-Stock

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$0.027

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$0.027

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TME

Poland . 3,269 parts In-Stock

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$0.063

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$0.100

$0.063

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Nova Conductors

Japan . 15 parts In-Stock

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$1.000

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IBS Electronics

USA . 546,000 parts In-Stock

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NAC Semi

USA . 540,000 parts In-Stock

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Chip Stock

USA . 270,000 parts In-Stock

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Martec Srl

Italy . 270,000 parts In-Stock

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Flip Electronics

USA . 87,000 parts In-Stock

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Vyrian

USA . 15,926 parts In-Stock

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Bristol Electronics

USA . 12,019 parts In-Stock

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Cogito LLC

Ukraine . 2,474 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Classic Components Corporation

USA . 978 parts In-Stock

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ComSIT Distribution GmbH

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Semicontronic

India . 21,277 parts In-Stock

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Corphita

USA . 1,328 parts In-Stock

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Corohmni

South Africa . 402 parts In-Stock

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Ampacity Inc.

Singapore . 16,696 parts In-Stock

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$0.052

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Continental Prestige Electronics

USA . 3,908 parts In-Stock

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$0.282

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Argo Parts USA

USA . 3,120 parts In-Stock

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$0.282

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$0.274

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$0.282

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Aranea Global

USA . 100 parts In-Stock

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$0.980

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$0.941

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100

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$0.941

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Aztec Data Supply Inc.

USA . 3,188 parts In-Stock

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$12.730

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Perfect Parts

USA . 419,738 parts In-Stock

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GreenTree Electronics

Israel . 270,000 parts In-Stock

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Glotronic Ltd.

UK . 146,400 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Futuretech Components

Singapore . 65,000 parts In-Stock

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Kepictronics

USA . 36,913 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,968 parts In-Stock

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TANS Electronics

Latvia . 7,755 parts In-Stock

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Problanco Electronics

Mexico . 6,786 parts In-Stock

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Microchip USA

USA . 5,902 parts In-Stock

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Kulean Microsystems

USA . 5,667 parts In-Stock

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SupplyDigital Components

Austria . 2,519 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,295 parts In-Stock

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Authorized Procurement Solutions

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Cyclops Electronics Ltd (Excess)

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Robosynatics

Brazil . 1,475 parts In-Stock

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Lucentia Tech

USA . 1,475 parts In-Stock

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$0.151

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Lixinc

USA . 1,061 parts In-Stock

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UHIMA Technologies

Türkiye . 273 parts In-Stock

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Overview

Upgrade your electronic designs with the MC74HC1G14DFT1G logic gate from Onsemi. Known for their high-quality components, Onsemi delivers reliable performance and durability. This versatile logic gate is ideal for a wide range of applications, offering fast propagation delay and low power consumption. Whether you're working on consumer electronics, automotive systems, or industrial equipment, this logic gate provides the value and efficiency you need to bring your projects to life. Trust Onsemi for top-notch components that won't disappoint.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and resistant to heat, making it suitable for a wide range of applications.

Propagation Delay at Nominal Supply: 90 ns

The low propagation delay ensures fast signal processing and efficient operation.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and facilitating automated assembly.

Nominal Supply Voltage / Vsup (V): 3

Works well with standard 3V power supplies, making it compatible with a wide range of devices.

Load Capacitance (CL): 50 pF

Can handle a moderate load capacitance, suitable for many electronic circuits.

No. of Terminals: 5

Simple and easy to integrate into circuits with a small number of terminals.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for harsh environments.

Minimum Operating Temperature: -55 °C

Operates reliably even in extremely cold conditions.

Technology: CMOS

Uses CMOS technology, known for its low power consumption and noise immunity.

Technical Specifications

Logic Gates MC74HC1G14DFT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2.6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

90 ns

Propagation Delay (tpd):

155 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

MC74HC1G14DFT1G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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