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MC74VHC1G08DFT2G

Onsemi

MC74VHC1G08DFT2G by Onsemi

MC74VHC1G08DFT2G by Onsemi is a logic gate with 2 inputs, 11 ns propagation delay at 3.3V, and 50 pF load capacitance. Ideal for applications requiring fast signal processing in small outline packages. Operating temperature range from -55 to 125 °C makes it suitable for military-grade electronics.

Median Price

$0.038

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31

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1k+

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Newark

USA . 6,007 parts In-Stock

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Arrow

USA . 5,320 parts In-Stock

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Mouser Electronics

USA . 13,121 parts In-Stock

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DigiKey

USA . 2,158 parts In-Stock

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EBV Elektronik

Germany . 204,000 parts In-Stock

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Chip1Stop

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Verical

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Master Electronics

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Farnell

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Element14

Singapore . 915 parts In-Stock

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Digiode

USA . 2,396 parts In-Stock

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Bristol Electronics

USA . 2,136 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Component Electronics Inc.

Canada . 6,757 parts In-Stock

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Chip Stock

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NAC Semi

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IBS Electronics

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Flip Electronics

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Electronic Treasures

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Semicontronic

India . 12,200 parts In-Stock

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Corphita

USA . 407 parts In-Stock

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Corohmni

South Africa . 218 parts In-Stock

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Ampacity Inc.

Singapore . 13,684 parts In-Stock

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Continental Prestige Electronics

USA . 6,255 parts In-Stock

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Argo Parts USA

USA . 4,613 parts In-Stock

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Advanced Electronics

New Zealand . 60 parts In-Stock

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Component Stockers USA

USA . 37,805 parts In-Stock

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Microchip USA

USA . 301 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,287 parts In-Stock

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Perfect Parts

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RC Electronics

USA . 58,315 parts In-Stock

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iodParts Technologies Inc.

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Alle Elektronik GmbH

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Problanco Electronics

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Kulean Microsystems

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TANS Electronics

Latvia . 1,276 parts In-Stock

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UHIMA Technologies

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Formix International (Excess)

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GreenTree Electronics

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Overview

Discover the Onsemi MC74VHC1G08DFT2G Logic Gate, a high-quality product that embodies precision and reliability. Manufactured by Onsemi, a trusted name in the industry, this logic gate offers exceptional performance and versatility for a wide range of applications. With its compact design and advanced technology, this logic gate provides fast propagation delay and low power consumption, making it an ideal choice for demanding projects. Trust Onsemi to deliver top-notch products that meet your needs while exceeding your expectations. Elevate your designs with the Onsemi MC74VHC1G08DFT2G Logic Gate today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for a variety of applications.

Propagation Delay At Nominal Supply: 11 ns

With a fast propagation delay, this logic gate ensures quick signal processing, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable, this logic gate can be easily integrated into compact electronic designs, saving space and simplifying assembly.

No. of Inputs: 2

With two inputs, this logic gate provides flexibility for various logic operations, making it versatile for different circuit designs.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and alignment on circuit boards, ensuring efficient installation.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this logic gate is compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF helps in stabilizing the circuit by reducing noise and ensuring reliable performance.

Power Supplies (V): 2/5.5

Compatible with power supplies ranging from 2V to 5.5V, this logic gate can be used in a variety of voltage environments.

No. of Terminals: 5

With five terminals, this logic gate is easy to connect and integrate into circuit designs, providing convenient setup.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this logic gate suitable for space-constrained applications.

Maximum I (ol): 8 Amp

With a maximum output current of 8 Amp, this logic gate can drive multiple loads without voltage drop, ensuring efficient signal transmission.

Propagation Delay (tpd): 16.5 ns

The propagation delay of 16.5 ns ensures accurate timing in signal processing, making this logic gate reliable for critical applications.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C, this logic gate can withstand harsh environmental conditions, making it durable and reliable.

Output Characteristics: 3-STATE

Featuring 3-state output characteristics, this logic gate can be used to control multiple outputs, providing enhanced flexibility in circuit design.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this logic gate is suitable for extreme cold environments, ensuring consistent performance.

Terminal Finish: Matte Tin (Sn) - annealed

The terminal finish of matte tin (Sn) - annealed provides strong solder connections, ensuring secure and reliable electrical contact.

Terminal Position: DUAL

With dual terminal positions, this logic gate offers flexibility in PCB layout and orientation, making it adaptable to different design requirements.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this logic gate is compact and low-profile, suitable for space-constrained applications.

Width: 1.25 mm

The width of 1.25 mm allows for efficient use of PCB space, making this logic gate a suitable choice for compact electronic designs.

Minimum Supply Voltage (Vsup): 2 V

Operating at a minimum supply voltage of 2V, this logic gate is energy-efficient and can function in low-power environments.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering during assembly, making installation quick and convenient.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this logic gate can withstand high-temperature soldering processes, ensuring reliable performance after assembly.

Length: 2 mm

The length of 2 mm allows for efficient use of PCB space, making this logic gate suitable for compact electronic designs.

Temperature Grade: MILITARY

Designed for military-grade applications, this logic gate meets stringent performance and reliability standards, making it suitable for mission-critical systems.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption and high noise immunity, making it efficient and reliable for various electronic applications.

Terminal Form: GULL WING

With a gull wing terminal form, this logic gate offers secure solder connections and easy PCB mounting, ensuring reliable electrical connections.

Packing Method: TR

Packaged in tape and reel format, this logic gate is easy to handle and store, simplifying production and inventory management.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm allows for easy PCB layout and assembly, making this logic gate suitable for high-density electronic designs.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V, this logic gate is compatible with a wide range of electronic systems, offering versatility in usage.

Maximum Power Supply Current (ICC): 50 mA

With a maximum power supply current of 50 mA, this logic gate operates efficiently without overloading the power source, ensuring reliable performance.

Technical Specifications

Logic Gates MC74VHC1G08DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.25 mm

Trade Compliance

MC74VHC1G08DFT2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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