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MC74HCT14ADR2G

Onsemi

MC74HCT14ADR2G by Onsemi

MC74HCT14ADR2G by Onsemi is a CMOS Logic Gates IC with 6 functions. It has a propagation delay of 48ns at 5V, suitable for military-grade applications. This Schmitt Trigger device comes in a small outline package with matte tin finish and operates b/w -55 to 125°C.

Median Price

$0.166

Lifecycle Status

Suppliers In-Stock

34

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1k+

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Adafruit Industries

USA . 150 parts In-Stock

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Newark

USA . 2,500 parts In-Stock

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Mouser Electronics

USA . 4,483 parts In-Stock

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DigiKey

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Farnell

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Verical

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Digiode

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Nova Conductors

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DF Sales Co.

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DF Sales Co.

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Component Electronics Inc.

Canada . 69 parts In-Stock

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Vyrian

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IBS Electronics

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Cyclops Electronics Ltd

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NAC Semi

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LIBRA Elektronik GmbH

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ComSIT Distribution GmbH

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Micros

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Partservice

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Micros sp.j. W. Kędra i J. Lic

Poland . 645 parts In-Stock

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EMSNET

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Ampacity Inc.

Singapore . 59,370 parts In-Stock

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Semicontronic

India . 55,343 parts In-Stock

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Corohmni

South Africa . 118 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 150 parts In-Stock

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Argo Parts USA

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Aztec Data Supply Inc.

USA . 4,283 parts In-Stock

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Continental Prestige Electronics

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XScomponents

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SupplyDigital Components

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Problanco Electronics

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Kulean Microsystems

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Infinite Electronics LLP (Excess)

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Computer Components Inc. - USA

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Netroflash

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Authorized Procurement Solutions

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Glotronic Ltd.

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Andel Nordic

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UHIMA Technologies

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Robosynatics

Brazil . 350 parts In-Stock

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Lucentia Tech

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Overview

Elevate your logic gates game with the MC74HCT14ADR2G by Onsemi. Known for its superior quality and reliability, Onsemi delivers top-notch products that meet the highest industry standards. Whether you're working on a military-grade project or a commercial application, this small outline package offers 6 functions, a fast propagation delay, and a wide operating temperature range to ensure optimal performance. With a nominal supply voltage of 5V and Schmitt trigger technology, this product is a powerhouse in the world of logic gates. Upgrade your projects with the MC74HCT14ADR2G and experience unparalleled efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Good choice for durability and resistance to environmental factors.

Propagation Delay At Nominal Supply: 48 ns

Fast response time for efficient operation.

Surface Mount: YES

Easy to integrate into circuit boards for streamlined design.

Maximum Operating Temperature: 125 °C

Can handle high temperatures for reliable performance in various environments.

Technology: CMOS

Utilizes low power consumption and offers compatibility with a wide range of devices.

Technical Specifications

Logic Gates MC74HCT14ADR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

48 ns

Propagation Delay (tpd):

48 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74HCT14ADR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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