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MC74HC04ADG

Onsemi

MC74HC04ADG by Onsemi

MC74HC04ADG by Onsemi is a CMOS Logic Gates IC with 6 functions, 1 input, and 22ns propagation delay at 3V. It operates b/w -55 to 125°C, has a max I (ol) of 4A, and is suitable for military-grade applications requiring fast signal processing in compact designs.

Median Price

$0.184

Lifecycle Status

Suppliers In-Stock

40

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 378 parts In-Stock

1+ parts

$0.251

100+ parts

$0.176

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$0.161

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$0.147

378

$0.251

$0.176

$0.161

$0.147

Mouser Electronics

USA . 5,875 parts In-Stock

1+ parts

$0.320

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$0.171

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$0.142

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5,875

$0.320

$0.171

$0.142

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Newark

USA . 11 parts In-Stock

1+ parts

$0.400

100+ parts

$0.238

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$0.191

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$0.160

11

$0.400

$0.238

$0.191

$0.160

Element14

Singapore . 825 parts In-Stock

1+ parts

$0.587

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$0.363

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$0.275

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$0.230

825

$0.587

$0.363

$0.275

$0.230

Adafruit Industries

USA . 200 parts In-Stock

1+ parts

$32.961

100+ parts

$31.313

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$31.313

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200

$32.961

$31.313

$31.313

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Rochester

USA . 63,225 parts In-Stock

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-

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$0.147

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$0.122

10k+ parts

$0.109

63,225

-

$0.147

$0.122

$0.109

Verical

USA . 27,364 parts In-Stock

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$0.165

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$0.154

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Master Electronics

USA . 5,500 parts In-Stock

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$0.147

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$0.139

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$0.139

Arrow

USA . 5,170 parts In-Stock

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$0.121

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$0.097

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$0.086

5,170

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$0.121

$0.097

$0.086

Chip1Stop

Japan . 491 parts In-Stock

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$0.149

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491

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DigiKey

USA . 308 parts In-Stock

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$0.171

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Future Electronics

Canada . 17 parts In-Stock

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17

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Distributors (In-Stock)

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Digiode

USA . 1,054 parts In-Stock

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$0.114

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$0.114

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DF Sales Co.

USA . 557 parts In-Stock

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$0.160

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DF Sales Co.

USA . 557 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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TME

Poland . 190 parts In-Stock

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$0.280

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$0.280

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Component Electronics Inc.

Canada . 322 parts In-Stock

1+ parts

$1.150

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$0.870

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$0.750

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322

$1.150

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$0.750

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Chip Stock

USA . 39,000 parts In-Stock

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Flip Electronics

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Vyrian

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IBS Electronics

USA . 5,517 parts In-Stock

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Component Sense

UK . 4,142 parts In-Stock

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NAC Semi

USA . 3,740 parts In-Stock

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$0.205

PC Components Company LLC

USA . 2,145 parts In-Stock

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Semtec, LLC

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QIE Inc.

USA . 330 parts In-Stock

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Prism Electronics

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Sunrise Surplus Inc.

USA . 245 parts In-Stock

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A2Z Electronics, Inc.

USA . 240 parts In-Stock

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240

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Bristol Electronics

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Inventory MP

USA . 188 parts In-Stock

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Sea View Technologies

USA . 160 parts In-Stock

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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First Choice Components Inc.

USA . 100 parts In-Stock

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Ashlea Components Ltd

UK . 89 parts In-Stock

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Microfarads

USA . 70 parts In-Stock

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MISTER SPROCKETS

USA . 45 parts In-Stock

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Contempo Components LLC

USA . 43 parts In-Stock

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EMSNET

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Distributors (Availability)

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Ampacity Inc.

Singapore . 7,759 parts In-Stock

1+ parts

$0.093

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7,759

$0.093

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Corohmni

South Africa . 181 parts In-Stock

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$0.098

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$0.098

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Corphita

USA . 1,683 parts In-Stock

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$0.108

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1,683

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Component Stockers USA

USA . 85,599 parts In-Stock

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$0.190

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$0.170

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$0.160

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$0.160

85,599

$0.190

$0.170

$0.160

$0.160

Argo Parts USA

USA . 676 parts In-Stock

1+ parts

$0.217

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$0.210

676

$0.217

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$0.210

Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

$0.237

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$0.225

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$0.214

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$0.211

500

$0.237

$0.225

$0.214

$0.211

Continental Prestige Electronics

USA . 3,172 parts In-Stock

1+ parts

$0.313

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$0.224

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$0.159

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$0.145

3,172

$0.313

$0.224

$0.159

$0.145

Aztec Data Supply Inc.

USA . 3,503 parts In-Stock

1+ parts

$15.742

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3,503

$15.742

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$32.961

100+ parts

$31.313

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$31.313

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200

$32.961

$31.313

$31.313

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Perfect Parts

USA . 31,155 parts In-Stock

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SupplyDigital Components

Austria . 7,962 parts In-Stock

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Lixinc

USA . 7,678 parts In-Stock

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Problanco Electronics

Mexico . 7,021 parts In-Stock

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Benley Electronics

USA . 5,650 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,298 parts In-Stock

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Kepictronics

USA . 5,170 parts In-Stock

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TANS Electronics

Latvia . 4,384 parts In-Stock

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Kulean Microsystems

USA . 3,825 parts In-Stock

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3,825

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Allen Electronics Distributors

USA . 3,795 parts In-Stock

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$0.324

1k+ parts

$0.316

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3,795

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$0.324

$0.316

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UHIMA Technologies

Türkiye . 752 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 24 parts In-Stock

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Robosynatics

Brazil . 10 parts In-Stock

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$0.255

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$0.255

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$0.255

10

-

$0.255

$0.255

$0.255

Lucentia Tech

USA . 10 parts In-Stock

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$0.255

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$0.255

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$0.255

10

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$0.255

$0.255

$0.255

Overview

Enhance your electronic projects with the reliable MC74HC04ADG logic gate from Onsemi. With a fast propagation delay of 22 ns and 6 functions in one package, this component is perfect for a wide range of applications. The high-quality construction and advanced technology ensure optimal performance, while the small outline design makes it easy to integrate into your designs. Trust Onsemi's expertise in semiconductor manufacturing and unlock the full potential of your projects with the MC74HC04ADG logic gate.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material makes this product durable and cost-effective.

Propagation Delay At Nominal Supply:

22 ns - The fast propagation delay at nominal supply voltage ensures efficient operation of the logic gates.

Surface Mount:

YES - The surface mount feature allows for easy installation and space-saving in electronic circuits.

No. of Functions:

6 - The multiple functions in one package provide versatility and flexibility in circuit design.

No. of Inputs:

1 - The single input allows for simplicity in circuit connections and logic operations.

Package Shape:

RECTANGULAR - The rectangular package shape is standard and easy to handle in electronic assemblies.

Nominal Supply Voltage / Vsup (V):

3 - The nominal supply voltage of 3V is commonly used, making this product compatible with a wide range of applications.

Load Capacitance (CL):

50 pF - The low load capacitance ensures minimal interference and noise in signal transmission.

Power Supplies (V):

2/6 - The availability of multiple power supply options provides flexibility in voltage requirements for different applications.

No. of Terminals:

14 - The ample number of terminals allow for easy connections and integration into complex circuits.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space and is suitable for compact electronic designs.

Maximum I (ol):

4 Amp - The high maximum output current capability allows for driving various loads without external amplification.

Propagation Delay (tpd):

110 ns - The propagation delay of 110 ns ensures efficient and reliable logic operations in electronic systems.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature makes this product suitable for harsh environmental conditions.

Minimum Operating Temperature:

55 °C - The low minimum operating temperature ensures reliable operation even in extreme cold conditions.

Terminal Finish:

MATTE TIN - The matte tin finish provides good solderability and connection reliability in electronic assemblies.

Terminal Position:

DUAL - The dual terminal position allows for versatile mounting and connection options in circuits.

Maximum Seated Height:

1.75 mm - The low maximum seated height enables compact and space-saving circuit designs.

Width:

3.9 mm - The narrow width of the product allows for efficient use of space in electronic assemblies.

Minimum Supply Voltage (Vsup):

2 V - The minimum supply voltage of 2V allows for operation in low-power applications.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature ensures proper soldering and assembly of the product.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature capability ensures reliable solder connections in manufacturing processes.

Length:

8.65 mm - The length of the product is compact, suitable for space-constrained electronic designs.

Temperature Grade:

MILITARY - The military-grade temperature tolerance ensures reliable performance in extreme environments.

Technology:

CMOS - The CMOS technology offers low power consumption and high noise immunity in logic gate operations.

Terminal Form:

GULL WING - The gull wing terminal form allows for easy surface mounting and assembly in electronic circuits.

Packing Method:

RAIL - The rail packing method provides convenient handling and storage of the product during production.

Terminal Pitch:

1.27 mm - The standard terminal pitch of 1.27 mm ensures compatibility with commonly used electronic components.

Moisture Sensitivity Level (MSL):

1 - The low moisture sensitivity level of 1 ensures the product's reliability during storage and assembly.

Maximum Supply Voltage (Vsup):

6 V - The maximum supply voltage of 6V offers versatility in voltage requirements for different applications.

Technical Specifications

Logic Gates MC74HC04ADG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74HC04ADG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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