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MC74HC1G04DFT1G

Onsemi

MC74HC1G04DFT1G by Onsemi

MC74HC1G04DFT1G by Onsemi is a CMOS logic gate with 90ns propagation delay at 3V. It has a max operating temperature of 125°C and can handle load capacitance of 50pF. Ideal for military-grade applications due to its small outline package and dual terminal position.

Median Price

$0.085

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

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Rochester

USA . 358,080 parts In-Stock

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Adafruit Industries

USA . 60 parts In-Stock

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Arrow

USA . 3,000 parts In-Stock

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Mouser Electronics

USA . 1,743 parts In-Stock

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DigiKey

USA . 1,431 parts In-Stock

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Newark

USA . 259 parts In-Stock

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Chip1Stop

Japan . 17,385 parts In-Stock

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Verical

USA . 17,385 parts In-Stock

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Avnet

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Farnell

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Element14

Singapore . 294 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

USA . 1,046 parts In-Stock

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TME

Poland . 630 parts In-Stock

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630

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Component Electronics Inc.

Canada . 2,800 parts In-Stock

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$3.850

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$2.880

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Chip Stock

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Flip Electronics

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NAC Semi

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Vyrian

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QIE Inc.

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Rebound Electronics

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Inventory MP

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NexGen Digital

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Argo Parts USA

USA . 4,817 parts In-Stock

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Continental Prestige Electronics

USA . 4,145 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Ampacity Inc.

Singapore . 8,003 parts In-Stock

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Semicontronic

India . 7,976 parts In-Stock

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Corphita

USA . 144 parts In-Stock

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Corohmni

South Africa . 175 parts In-Stock

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Advanced Electronics

New Zealand . 60 parts In-Stock

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Aztec Data Supply Inc.

USA . 370 parts In-Stock

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Component Stockers USA

USA . 442 parts In-Stock

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Perfect Parts

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Metaverse IC Inc.

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GreenTree Electronics

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Lixinc

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SupplyDigital Components

Austria . 6,683 parts In-Stock

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Problanco Electronics

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Computer Components Inc. - USA

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 2,369 parts In-Stock

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Kepictronics

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UHIMA Technologies

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Kulean Microsystems

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iodParts Technologies Inc.

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Overview

Enhance your electronic designs with the high-quality MC74HC1G04DFT1G logic gate from Onsemi. As a leading manufacturer in the industry, Onsemi offers reliable and advanced components for various applications. The MC74HC1G04DFT1G provides fast propagation delay, low power consumption, and a wide operating temperature range, making it ideal for demanding projects. With its compact package and surface mount design, this logic gate is perfect for space-constrained applications where performance and efficiency are crucial. Trust Onsemi to deliver top-notch products like the MC74HC1G04DFT1G that bring value and innovation to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 90 ns

This fast propagation delay allows for quick response time in processing signals.

Surface Mount: YES

The surface mount design makes this product easy to install and saves space on the circuit board.

Package Shape: RECTANGULAR

The rectangular shape provides a compact and efficient design for easier integration into circuits.

Nominal Supply Voltage / Vsup (V): 3

With a nominal supply voltage of 3V, this product offers efficient power consumption.

Load Capacitance (CL): 50 pF

The low load capacitance ensures stable and reliable operation in various applications.

Power Supplies (V): 2/6

This range of power supplies allows for flexibility in different voltage requirements.

No. of Terminals: 5

The 5 terminals provide multiple connection points for versatile usage in various circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and sleek design of this package style saves space and enhances overall circuit layout.

Maximum I (ol): 2.6 Amp

With a maximum output current of 2.6 Amps, this product can handle high power loads effectively.

Propagation Delay (tpd): 155 ns

The propagation delay of 155ns ensures efficient signal processing and reduces delays in circuit operation.

Technical Specifications

Logic Gates MC74HC1G04DFT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2.6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

90 ns

Propagation Delay (tpd):

155 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

MC74HC1G04DFT1G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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