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SN74LVC1G08MDCKREP

Texas Instruments

SN74LVC1G08MDCKREP by Texas Instruments

SN74LVC1G08MDCKREP by Texas Instruments is a CMOS logic gate with 2 inputs, 6.5 ns propagation delay, and 11 ns tpd. It operates at a supply voltage of 1.8V to 3.3V and is ideal for military-grade applications requiring fast signal processing in compact spaces due to its small outline package style.

Median Price

$2.528

Lifecycle Status

Suppliers In-Stock

18

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1k+

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Texas Instruments

USA . 62,680 parts In-Stock

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$1.366

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$1.129

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$0.610

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$1.366

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$0.610

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Arrow

USA . 1,312 parts In-Stock

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$2.528

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$1.554

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$1.366

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1,312

$2.528

$1.554

$1.366

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DigiKey

USA . 22,629 parts In-Stock

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$2.790

100+ parts

$1.709

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$1.631

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22,629

$2.790

$1.709

$1.631

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Mouser Electronics

USA . 2,919 parts In-Stock

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$2.790

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$1.710

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$1.560

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$1.450

2,919

$2.790

$1.710

$1.560

$1.450

Verical

USA . 1,312 parts In-Stock

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$1.554

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$1.366

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Nova Conductors

Japan . 150 parts In-Stock

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$0.908

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$0.908

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Ozdisan Elektronik

Türkiye . 535 parts In-Stock

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$0.967

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535

$0.967

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Digiode

USA . 2,668 parts In-Stock

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$1.298

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Vyrian

USA . 23,238 parts In-Stock

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Chip Stock

USA . 8,473 parts In-Stock

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Connector Distribution Corp

USA . 3,000 parts In-Stock

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Right Parts Inc.

USA . 3,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,722 parts In-Stock

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Elcom Components

USA . 407 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

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NAC Semi

USA . 262 parts In-Stock

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$2.860

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$2.640

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Semi Source

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Argo Parts USA

USA . 3,628 parts In-Stock

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$0.908

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3,628

$0.908

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Continental Prestige Electronics

USA . 2,801 parts In-Stock

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$0.908

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$0.890

2,801

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$0.890

Semicontronic

India . 23,447 parts In-Stock

1+ parts

$1.070

100+ parts

$1.043

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$1.038

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23,447

$1.070

$1.043

$1.038

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Ampacity Inc.

Singapore . 23,423 parts In-Stock

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$1.070

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Corphita

USA . 1,719 parts In-Stock

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$1.229

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Component Stockers USA

USA . 75,837 parts In-Stock

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$1.690

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$1.190

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$0.750

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$0.770

75,837

$1.690

$1.190

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$0.770

Microchip USA

USA . 8,925 parts In-Stock

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$5.342

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Corohmni

South Africa . 195 parts In-Stock

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Parana Technologies

USA . 237 parts In-Stock

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$25.701

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$26.302

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DigiPath Technology Company

USA . 611 parts In-Stock

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$28.299

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$26.036

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611

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ChromeModa Solutions

Germany . 1,160 parts In-Stock

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$28.877

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$23.679

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$28.877

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IDEA Electronic Components Group

UK . 1,017 parts In-Stock

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$28.877

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$27.433

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$25.989

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$28.877

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$32.445

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$30.823

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$30.823

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870

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Lixinc

USA . 14,436 parts In-Stock

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Perfect Parts

USA . 9,659 parts In-Stock

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Authorized Procurement Solutions

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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$12.499

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Akira Global LLC

USA . 18 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVC1G08MDCKREP by Texas Instruments, a high-quality logic gate that delivers reliable performance and precision. Manufactured by the esteemed Texas Instruments, this versatile component is ideal for a wide range of applications in various industries. With its compact size, low power consumption, and fast propagation delay, this logic gate offers exceptional value and efficiency to customers seeking top-notch components for their projects. Upgrade your designs with the SN74LVC1G08MDCKREP and experience the superior quality and performance that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the logic gates, ensuring a longer operational life.

Propagation Delay At Nominal Supply: 6.5 ns

The low propagation delay allows for quick signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount compatibility makes installation and integration of these logic gates easier and more efficient.

No. of Inputs: 2

Having 2 inputs allows for basic logic operations to be performed, making these gates versatile for a variety of applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V makes these logic gates energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, these logic gates can withstand extreme heat conditions, ensuring reliable performance in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates reliable and energy-efficient.

Technical Specifications

Logic Gates SN74LVC1G08MDCKREP attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G08MDCKREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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