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SN74LVC1G08DCK3

Texas Instruments

SN74LVC1G08DCK3 by Texas Instruments

SN74LVC1G08DCK3 by Texas Instruments is a CMOS Logic Gate with 2 inputs, 10ns propagation delay, and 32 Amp output current. It operates b/w -40 to 125 °C and has a supply voltage range of 1.65V to 5.5V. Ideal for automotive applications due to its small outline package and surface-mount capability.

Median Price

$0.310

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 171,194 parts In-Stock

1+ parts

$0.201

100+ parts

$0.137

1k+ parts

$0.070

10k+ parts

-

171,194

$0.201

$0.137

$0.070

-

Mouser Electronics

USA . 23,367 parts In-Stock

1+ parts

$0.310

100+ parts

$0.164

1k+ parts

$0.137

10k+ parts

$0.130

23,367

$0.310

$0.164

$0.137

$0.130

DigiKey

USA . 2,661 parts In-Stock

1+ parts

$0.310

100+ parts

$0.163

1k+ parts

$0.137

10k+ parts

-

2,661

$0.310

$0.163

$0.137

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.141

100+ parts

-

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10

$0.141

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Digiode

USA . 3,755 parts In-Stock

1+ parts

$0.191

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3,755

$0.191

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Chip Stock

USA . 941,970 parts In-Stock

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941,970

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Vyrian

USA . 74,062 parts In-Stock

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74,062

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ComSIT USA

USA . 1,674 parts In-Stock

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1,674

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ComSIT Distribution GmbH

Germany . 1,674 parts In-Stock

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1,674

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Distributors (Availability)

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.138

100+ parts

-

1k+ parts

$0.133

10k+ parts

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50

$0.138

-

$0.133

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Corohmni

South Africa . 273 parts In-Stock

1+ parts

$0.141

100+ parts

-

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273

$0.141

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Argo Parts USA

USA . 2,688 parts In-Stock

1+ parts

$0.141

100+ parts

-

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$0.137

2,688

$0.141

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-

$0.137

Continental Prestige Electronics

USA . 262 parts In-Stock

1+ parts

$0.141

100+ parts

-

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$0.138

262

$0.141

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-

$0.138

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$0.145

100+ parts

$0.138

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$0.138

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200

$0.145

$0.138

$0.138

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Ampacity Inc.

Singapore . 74,067 parts In-Stock

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$0.171

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74,067

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Semicontronic

India . 73,147 parts In-Stock

1+ parts

$0.171

100+ parts

$0.167

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$0.166

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73,147

$0.171

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$0.166

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Corphita

USA . 3,041 parts In-Stock

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$0.181

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3,041

$0.181

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Parana Technologies

USA . 71 parts In-Stock

1+ parts

$7.465

100+ parts

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1k+ parts

$7.955

10k+ parts

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71

$7.465

-

$7.955

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DigiPath Technology Company

USA . 1,872 parts In-Stock

1+ parts

$8.220

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1,872

$8.220

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ChromeModa Solutions

Germany . 3,960 parts In-Stock

1+ parts

$8.388

100+ parts

$6.878

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3,960

$8.388

$6.878

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IDEA Electronic Components Group

UK . 275 parts In-Stock

1+ parts

$8.388

100+ parts

$7.969

1k+ parts

$7.549

10k+ parts

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275

$8.388

$7.969

$7.549

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Lixinc

USA . 8,269 parts In-Stock

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Assy Fe

Spain . 6,000 parts In-Stock

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Kepictronics

USA . 2,565 parts In-Stock

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2,565

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Overview

Unlock the power of seamless logic operations with the SN74LVC1G08DCK3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This versatile logic gate is perfect for a wide range of applications, offering quick propagation delays and a wide operating temperature range. With its compact design and high performance, this product provides exceptional value and efficiency to customers looking for reliable logic gate solutions. Elevate your projects with the SN74LVC1G08DCK3 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the logic gate lightweight and cost-effective.

Surface Mount: YES

Being surface mountable makes the logic gate easy to install and saves space on the PCB.

Nominal Supply Voltage / Vsup (V): 3.3

The logic gate operates efficiently at a nominal supply voltage of 3.3V, making it suitable for various electronic applications.

Propagation Delay (tpd): 10 ns

The low propagation delay of 10 ns ensures quick response times, making the logic gate ideal for high-speed applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the logic gate can withstand high-temperature environments, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology used in the logic gate offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making it a reliable choice for digital circuits.

Technical Specifications

Logic Gates SN74LVC1G08DCK3 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e6

Length:

2 mm

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

10 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC1G08DCK3 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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