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CD74ACT14M

Texas Instruments

CD74ACT14M by Texas Instruments

CD74ACT14M by Texas Instruments is a CMOS logic gate with 6 functions and 14 terminals. It has a propagation delay of 14.5 ns at 5V, making it ideal for high-speed applications. With Schmitt Trigger technology and a MILITARY temperature grade, it ensures reliable performance in harsh environments.

Median Price

$0.481

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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Adafruit Industries

USA . 100 parts In-Stock

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$0.481

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$0.457

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Mouser Electronics

USA . 1,826 parts In-Stock

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RS (Exports)

UK . 171 parts In-Stock

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$0.464

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Freelance Electronics

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Digiode

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Nova Conductors

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NAC Semi

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ComSIT Distribution GmbH

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Semtec, LLC

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Ampacity Inc.

Singapore . 335 parts In-Stock

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$0.394

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Semicontronic

India . 293 parts In-Stock

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Corphita

USA . 8,743 parts In-Stock

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Corohmni

South Africa . 93 parts In-Stock

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Argo Parts USA

USA . 3,430 parts In-Stock

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$0.453

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Continental Prestige Electronics

USA . 3,322 parts In-Stock

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$0.467

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Netroflash

USA . 100 parts In-Stock

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$0.444

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$0.481

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Component Stockers USA

USA . 2,147 parts In-Stock

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$0.520

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$0.490

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$0.440

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ChromeModa Solutions

Germany . 2,065 parts In-Stock

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$9.338

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$7.657

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IDEA Electronic Components Group

UK . 1,087 parts In-Stock

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$24.088

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DigiPath Technology Company

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Perfect Parts

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Microchip USA

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Metaverse IC Inc.

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Supply Digital

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GreenTree Electronics

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Computer Components Inc. - USA

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Cyclops Electronics Ltd (Excess)

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iodParts Technologies Inc.

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Overview

Enhance your projects with the CD74ACT14M logic gates by Texas Instruments, known for their top-notch quality and reliability. Perfect for a wide range of applications, these logic gates offer fast propagation delay, low power consumption, and high noise immunity. With 6 functions in a compact small outline package, this product provides excellent value and performance to meet all your design needs. Trust Texas Instruments for cutting-edge technology and unmatched innovation in the world of logic gates.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast response time for logic operations, making it suitable for high-speed applications.

No. of Functions: 6

Having multiple functions in a single package offers versatility and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Operates at standard 5V supply voltage, compatible with most logic circuits and widely available power sources.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for industrial and military applications where temperature fluctuations are common.

Technology: CMOS

Utilizes CMOS technology which offers low power consumption and high noise immunity, ideal for battery-operated devices and noisy environments.

Technical Specifications

Logic Gates CD74ACT14M attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Trade Compliance

CD74ACT14M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-468-5788, 5962014685788

NIIN

014685788

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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