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SN74LVC2G17DBVRE4

Texas Instruments

SN74LVC2G17DBVRE4 by Texas Instruments

SN74LVC2G17DBVRE4 by Texas Instruments is a logic gate with 2 functions, 5.4 ns propagation delay, and 3.3V nominal voltage. It is used in automotive applications due to its Schmitt Trigger technology and low profile package style for compact designs. The device operates b/w -40°C to 125°C temperature range, making it suitable for various environments.

Median Price

$0.524

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 73,885 parts In-Stock

1+ parts

-

100+ parts

$0.524

1k+ parts

$0.354

10k+ parts

$0.275

73,885

-

$0.524

$0.354

$0.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 84 parts In-Stock

1+ parts

$0.371

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-

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84

$0.371

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Vyrian

USA . 73,719 parts In-Stock

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73,719

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Digiode

USA . 3,150 parts In-Stock

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3,150

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Sensible Micro Corp

USA . 109 parts In-Stock

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109

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Distributors (Availability)

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Continental Prestige Electronics

USA . 2,797 parts In-Stock

1+ parts

$0.348

100+ parts

-

1k+ parts

-

10k+ parts

$0.341

2,797

$0.348

-

-

$0.341

Argo Parts USA

USA . 817 parts In-Stock

1+ parts

$0.348

100+ parts

-

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-

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$0.338

817

$0.348

-

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$0.338

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

$0.352

10k+ parts

$0.345

50

$0.371

-

$0.352

$0.345

Modulus Dynamics

Lithuania . 750 parts In-Stock

1+ parts

$0.386

100+ parts

$0.382

1k+ parts

$0.371

10k+ parts

-

750

$0.386

$0.382

$0.371

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Semicontronic

India . 73,674 parts In-Stock

1+ parts

$0.445

100+ parts

$0.434

1k+ parts

$0.432

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-

73,674

$0.445

$0.434

$0.432

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Ampacity Inc.

Singapore . 73,419 parts In-Stock

1+ parts

$0.445

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73,419

$0.445

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Corohmni

South Africa . 695 parts In-Stock

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$12.828

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695

$12.828

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Parana Technologies

USA . 1,102 parts In-Stock

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$17.562

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$17.760

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1,102

$17.562

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$17.760

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ChromeModa Solutions

Germany . 3,909 parts In-Stock

1+ parts

$19.733

100+ parts

$16.181

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3,909

$19.733

$16.181

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IDEA Electronic Components Group

UK . 338 parts In-Stock

1+ parts

$19.733

100+ parts

$18.746

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$17.760

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338

$19.733

$18.746

$17.760

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$28.679

100+ parts

$27.245

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$27.245

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1,000

$28.679

$27.245

$27.245

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Corphita

USA . 2,262 parts In-Stock

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Microchip USA

USA . 2,010 parts In-Stock

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2,010

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DigiPath Technology Company

USA . 1,349 parts In-Stock

1+ parts

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$17.791

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1,349

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$17.791

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Robosynatics

Brazil . 805 parts In-Stock

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805

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Lucentia Tech

USA . 805 parts In-Stock

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805

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Overview

Discover the power of Texas Instruments with the SN74LVC2G17DBVRE4 Logic Gates. Crafted with precision and expertise, this high-quality product offers unparalleled performance in a compact package. Ideal for automotive applications, this logic gate provides fast propagation delay and low power consumption, making it a valuable asset for your projects. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your designs with the SN74LVC2G17DBVRE4 and experience the difference today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability for the product.

Propagation Delay:

5.4 ns - Fast response time ensures efficient operation.

Surface Mount:

YES - Allows for easy installation on circuit boards.

No. of Functions:

2 - Versatile device with multiple functions in one package.

Package Shape:

RECTANGULAR - Space-saving design for efficient PCB layout.

Nominal Supply Voltage / Vsup (V):

3.3 - Compatible with common supply voltages for easy integration.

Load Capacitance (CL):

50 pF - Can handle a range of capacitance loads for flexibility.

Power Supplies (V):

3.3 - Low power consumption for energy efficiency.

No. of Terminals:

6 - Simplifies connections and reduces wiring complexity.

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH - Ideal for compact electronic devices.

Maximum I (ol):

24 Amp - High current capacity for demanding applications.

Propagation Delay (tpd):

9.3 ns - Ensures reliable signal transmission with minimal delay.

Maximum Operating Temperature:

125 °C - Suitable for a wide range of operating environments.

Minimum Operating Temperature:

40 °C - Can withstand extreme temperature conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides corrosion resistance for long-term reliability.

Terminal Position:

DUAL - Allows for versatile mounting orientations.

Maximum Seated Height:

1.45 mm - Low profile design for space-constrained applications.

Width:

1.6 mm - Compact size for efficient PCB layout.

Minimum Supply Voltage (Vsup):

1.65 V - Can operate at lower voltages for energy savings.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during assembly.

Peak Reflow Temperature °C:

260 - Withstands high-temperature reflow processes.

Length:

2.9 mm - Compact size for space-saving designs.

Temperature Grade:

AUTOMOTIVE - Suitable for automotive applications with wide temperature ranges.

Schmitt Trigger:

YES - Provides noise immunity for reliable operation.

Technology:

CMOS - Low power consumption and high noise immunity.

Terminal Form:

GULL WING - Facilitates easy soldering during assembly.

Packing Method:

TR - Secure packaging for safe transportation and storage.

Terminal Pitch:

0.95 mm - Provides easy connections with standard spacing.

Maximum Supply Voltage (Vsup):

5.5 V - Can handle higher supply voltages for flexibility.

Maximum Power Supply Current (ICC):

0.01 mA - Low power consumption for energy efficiency.

Technical Specifications

Logic Gates SN74LVC2G17DBVRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

9.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74LVC2G17DBVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-632-8843, 5962016328843

NIIN

016328843

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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