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CD40106BMT

Texas Instruments

CD40106BMT by Texas Instruments

CD40106BMT by Texas Instruments is a CMOS logic gate with 6 functions. It operates at a supply voltage of 5V, has a propagation delay of 280ns, and can handle load capacitance of 50pF. This Schmitt Trigger IC is ideal for military-grade applications due to its wide temperature range and small outline package style.

Median Price

$1.430

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Chip1Stop

Japan . 491 parts In-Stock

1+ parts

$1.570

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$0.573

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$0.477

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$0.419

491

$1.570

$0.573

$0.477

$0.419

Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$18.359

100+ parts

$17.441

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$17.441

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-

3,000

$18.359

$17.441

$17.441

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Rochester

USA . 233 parts In-Stock

1+ parts

-

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$0.762

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$0.633

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$0.564

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$0.762

$0.633

$0.564

DigiKey

USA . 233 parts In-Stock

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$1.290

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$1.290

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Distributors (In-Stock)

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Digiode

USA . 3,736 parts In-Stock

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$0.452

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$0.452

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Nova Conductors

Japan . 50 parts In-Stock

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$0.618

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$0.618

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Chip Stock

USA . 125,800 parts In-Stock

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125,800

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Vyrian

USA . 3,919 parts In-Stock

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NexGen Digital

USA . 170 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,096 parts In-Stock

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$0.405

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1,096

$0.405

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Semicontronic

India . 824 parts In-Stock

1+ parts

$0.405

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$0.395

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$0.393

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824

$0.405

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Corphita

USA . 3,818 parts In-Stock

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$0.428

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Continental Prestige Electronics

USA . 4,517 parts In-Stock

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$0.601

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$0.589

4,517

$0.601

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$0.589

Argo Parts USA

USA . 929 parts In-Stock

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$0.601

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$0.583

929

$0.601

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$0.583

Corohmni

South Africa . 214 parts In-Stock

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$8.034

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$8.034

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AZTECH Wire

Italy . 292 parts In-Stock

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$15.880

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Parana Technologies

USA . 1,547 parts In-Stock

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$17.677

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$17.866

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$17.677

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$17.866

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$18.359

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$17.441

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$17.441

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$18.359

$17.441

$17.441

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DigiPath Technology Company

USA . 807 parts In-Stock

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$19.465

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$19.465

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ChromeModa Solutions

Germany . 860 parts In-Stock

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$19.862

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$16.287

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$19.862

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IDEA Electronic Components Group

UK . 224 parts In-Stock

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$19.862

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$18.869

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$17.876

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$19.862

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Microchip USA

USA . 4,882 parts In-Stock

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Robosynatics

Brazil . 1,369 parts In-Stock

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1,369

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$1.573

Lucentia Tech

USA . 1,369 parts In-Stock

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$1.573

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Perfect Parts

USA . 775 parts In-Stock

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Kepictronics

USA . 598 parts In-Stock

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Overview

Discover the superior quality and reliability of the CD40106BMT by Texas Instruments, a top-tier manufacturer in the industry. Ideal for logic gates applications, this product offers unmatched value with its high-performance features and innovative technology. With a wide range of functionalities and a compact small outline package style, this product ensures efficiency and precision in every use. Trust in Texas Instruments to deliver excellence, choose the CD40106BMT for all your logic gate needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes this product lightweight and durable, ideal for portable electronic devices.

Propagation Delay At Nominal Supply: 280 ns

With a fast propagation delay at nominal supply voltage, this product ensures efficient signal processing and reduces latency in electronic circuits.

Surface Mount: YES

Being surface mountable, this product can be easily integrated onto printed circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 6

With six functions in one package, this product offers versatility and flexibility in designing complex logic circuits.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides compatibility with standard electronic systems, making this product widely compatible and easy to integrate.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures stable performance and minimizes signal distortion in high-speed digital applications.

Power Supplies (V): 5/15

Supporting multiple power supply voltages of 5V and 15V, this product offers flexibility in system design and compatibility with different power sources.

No. of Terminals: 14

With 14 terminals, this product provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making this product suitable for compact electronic devices with limited board real estate.

Maximum I (ol): 2.4 Amp

With a high maximum output current of 2.4 Amp, this product can drive heavy loads and power multiple components without external amplification.

Propagation Delay (tpd): 280 ns

Consistent propagation delay of 280 ns ensures reliable and predictable signal timing in digital logic circuits.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this product to withstand harsh environmental conditions and ensures reliable performance in industrial applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C enables this product to function in extremely cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and ensures long-term reliability in various operating conditions.

Terminal Position: DUAL

With dual terminal positions, this product offers flexibility in PCB layout and enables easy routing of connections for streamlined circuit design.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75 mm minimizes the overall profile of the product, making it suitable for slim and compact electronic devices.

Width: 3.9 mm

The compact width of 3.9 mm allows for high-density packaging and efficient use of board space in densely populated electronic assemblies.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage of 3V ensures compatibility with a wide range of power sources and extends the operational range of this product.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during the assembly process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes without compromising its electrical and mechanical properties.

Length: 8.65 mm

The moderate length of 8.65 mm provides a balanced form factor that is suitable for various electronic applications and allows for easy integration into different designs.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this product offers rugged construction and high reliability for mission-critical applications in harsh environments.

Schmitt Trigger: YES

Featuring a Schmitt trigger input, this product provides hysteresis and noise immunity, ensuring robust signal processing and stable operation in noisy environments.

Technology: CMOS

Built with CMOS technology, this product offers low power consumption, high noise immunity, and fast switching speeds, making it an energy-efficient and reliable choice for digital circuits.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and inspection during the assembly process, ensuring reliable electrical connections and reducing manufacturing defects.

Packing Method: TR

The tape and reel packing method (TR) provides convenient handling and transportation of this product, simplifying the inventory management and assembly process.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm ensures compatibility with common PCB designs and allows for easy integration into various electronic systems.

Maximum Supply Voltage (Vsup): 18 V

Supporting a maximum supply voltage of 18V, this product offers flexibility in voltage selection and allows for compatibility with a wide range of power sources.

Maximum Power Supply Current (ICC): 0.12 mA

With a low maximum power supply current of 0.12 mA, this product reduces power consumption and heat dissipation, making it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Logic Gates CD40106BMT attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2.4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.12 mA

Propagation Delay At Nominal Supply:

280 ns

Propagation Delay (tpd):

280 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD40106BMT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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