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NL17SZ17DFT2G

Onsemi

NL17SZ17DFT2G by Onsemi

NL17SZ17DFT2G by Onsemi is a CMOS Logic Gate with 7.5ns Propagation Delay, 1.8V Nominal Voltage, and 50pF Load Capacitance. Ideal for military applications due to its MILITARY Temperature Grade, Schmitt Trigger feature, and small outline package style.

Median Price

$0.034

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Suppliers In-Stock

33

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1k+

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Newark

USA . 3,811 parts In-Stock

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3,811

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Mouser Electronics

USA . 30,766 parts In-Stock

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$0.100

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$0.042

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$0.034

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$0.030

30,766

$0.100

$0.042

$0.034

$0.030

DigiKey

USA . 23,427 parts In-Stock

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Arrow

USA . 972,000 parts In-Stock

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Verical

USA . 972,000 parts In-Stock

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Avnet

USA . 111,000 parts In-Stock

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Rochester

USA . 99,000 parts In-Stock

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Future Electronics

Canada . 36,000 parts In-Stock

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Chip1Stop

Japan . 27,425 parts In-Stock

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$0.069

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Master Electronics

USA . 27,000 parts In-Stock

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Element14

Singapore . 3,699 parts In-Stock

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$0.082

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$0.047

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EBV Elektronik

Germany . 3,000 parts In-Stock

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Farnell

UK . 1,184 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 203 parts In-Stock

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TME

Poland . 1,860 parts In-Stock

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1,860

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Bristol Electronics

USA . 315 parts In-Stock

1+ parts

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Nova Conductors

Japan . 10 parts In-Stock

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IBS Electronics

USA . 327,000 parts In-Stock

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Chip Stock

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Flip Electronics

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Cyclops Electronics Ltd

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NAC Semi

USA . 6,000 parts In-Stock

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R&J Components

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Martec Srl

Italy . 2,040 parts In-Stock

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LIBRA Elektronik GmbH

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Netsource Technology, Inc.

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Velocity Electronics

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Sensible Micro Corp

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Prism Electronics

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ComSIT Distribution GmbH

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ComSIT USA

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Bas Electronics GmbH & Co. KG

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Semicontronic

India . 33,766 parts In-Stock

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Ampacity Inc.

Singapore . 31,490 parts In-Stock

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Corphita

USA . 2,054 parts In-Stock

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Corohmni

South Africa . 117 parts In-Stock

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Continental Prestige Electronics

USA . 2,869 parts In-Stock

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$0.167

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$0.164

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Argo Parts USA

USA . 2,799 parts In-Stock

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$0.167

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$0.162

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Microchip USA

USA . 385 parts In-Stock

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Vigor

Singapore . 650 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,916 parts In-Stock

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$9.430

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$11.057

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$10.504

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Perfect Parts

USA . 788,796 parts In-Stock

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RC Electronics

USA . 52,476 parts In-Stock

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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GreenTree Electronics

Israel . 18,000 parts In-Stock

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Singapore . 15,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,667 parts In-Stock

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Component Stockers USA

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Glotronic Ltd.

UK . 12,000 parts In-Stock

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TANS Electronics

Latvia . 7,267 parts In-Stock

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Eastek

USA . 6,000 parts In-Stock

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Kulean Microsystems

USA . 4,239 parts In-Stock

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SupplyDigital Components

Austria . 3,690 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,692 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,403 parts In-Stock

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Robosynatics

Brazil . 1,240 parts In-Stock

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Lucentia Tech

USA . 1,240 parts In-Stock

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$30.237

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$29.620

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$29.620

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$29.620

$29.620

Lixinc

USA . 1,157 parts In-Stock

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UHIMA Technologies

Türkiye . 609 parts In-Stock

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609

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Overview

Elevate your electronics projects with the NL17SZ17DFT2G logic gate by Onsemi, a top-tier manufacturer known for delivering premium quality components. This innovative product offers a fast propagation delay of 7.5 ns, making it ideal for high-performance applications where speed is crucial. Whether you're designing consumer electronics, automotive systems, or industrial machinery, this logic gate provides unmatched reliability and efficiency. Experience the value and benefits of choosing Onsemi for all your logic gate needs - trust in their expertise and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a lightweight and cost-effective solution for electronic components.

Propagation Delay At Nominal Supply: 7.5 ns

This fast propagation delay ensures quick signal processing in various applications.

Surface Mount: YES

The surface mount design allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage (Vsup): 1.8 V

The low nominal supply voltage helps reduce power consumption and extend battery life.

Load Capacitance (CL): 50 pF

This ideal load capacitance value ensures reliable performance in high-frequency applications.

Power Supplies (V): 3.3

Compatible with standard 3.3V power supplies for easy integration into existing systems.

No. of Terminals: 5

The minimal number of terminals simplifies circuit design and installation.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style saves space on PCBs and allows for higher density layouts.

Maximum I (ol): 24 Amp

With a high maximum output current, this logic gate can drive heavy loads.

Maximum Operating Temperature: 125 °C

Capable of withstanding high operating temperatures for reliable performance in harsh conditions.

Minimum Operating Temperature: -55 °C

Performs reliably in extreme low-temperature environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance for a long lifespan.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit board layout and manufacturing.

Maximum Seated Height: 1.1 mm

This low profile allows for compact designs and efficient use of space.

Width: 1.25 mm

The slim width enables tight integration into densely populated PCBs.

Minimum Supply Voltage (Vsup): 1.65 V

Allows for a wide operating voltage range for versatility in various applications.

Maximum Time At Peak Reflow Temperature: 40 s

Ensures reliable soldering during the manufacturing process for consistent performance.

Peak Reflow Temperature: 260 °C

Withstands high temperatures during soldering without compromising functionality.

Length: 2 mm

The compact length facilitates space-saving designs in electronic applications.

Temperature Grade: MILITARY

Suitable for rugged military applications where reliability and durability are crucial.

Schmitt Trigger: YES

Features a Schmitt trigger for improved noise immunity and reliable signal processing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide mechanical strength for reliable connections.

Packing Method: TR

Tape and reel packing method offers convenience for automated assembly processes.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage, this logic gate is versatile for a wide range of applications.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current ensures energy efficiency and minimal heat dissipation.

Technical Specifications

Logic Gates NL17SZ17DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SZ

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

15.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.25 mm

Trade Compliance

NL17SZ17DFT2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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