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NL17SZ08DBVT1G

Onsemi

NL17SZ08DBVT1G by Onsemi

NL17SZ08DBVT1G by Onsemi is a CMOS Logic Gate with 2 inputs, 12.7 ns propagation delay, and 32 Amp output current. Ideal for military-grade applications due to its small outline package, low profile design, and wide operating temperature range from -55°C to 125°C.

Median Price

$0.045

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 11,725 parts In-Stock

1+ parts

$0.100

100+ parts

$0.038

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$0.031

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$0.027

11,725

$0.100

$0.038

$0.031

$0.027

Mouser Electronics

USA . 2,718 parts In-Stock

1+ parts

$0.140

100+ parts

$0.051

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$0.036

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$0.033

2,718

$0.140

$0.051

$0.036

$0.033

Rochester

USA . 4,581,301 parts In-Stock

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-

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$0.031

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$0.026

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$0.023

4,581,301

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$0.031

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$0.023

Verical

USA . 4,581,187 parts In-Stock

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Chip1Stop

Japan . 15,000 parts In-Stock

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Arrow

USA . 12,000 parts In-Stock

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$0.022

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$0.022

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$0.023

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100

$0.023

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Digiode

USA . 1,637 parts In-Stock

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$0.036

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Vyrian

USA . 1,852,849 parts In-Stock

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IBS Electronics

USA . 21,000 parts In-Stock

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$0.044

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$0.044

Chip Stock

USA . 20,600 parts In-Stock

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NAC Semi

USA . 18,000 parts In-Stock

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Flip Electronics

USA . 15,000 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,849,741 parts In-Stock

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$0.021

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Continental Prestige Electronics

USA . 5,913 parts In-Stock

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$0.023

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5,913

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Argo Parts USA

USA . 1,296 parts In-Stock

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Corphita

USA . 1,147 parts In-Stock

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$0.034

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Corohmni

South Africa . 72 parts In-Stock

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Semicontronic

India . 1,850,038 parts In-Stock

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$0.046

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$0.045

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Microchip USA

USA . 314 parts In-Stock

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$0.234

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Aztec Data Supply Inc.

USA . 2,347 parts In-Stock

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$21.440

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Kepictronics

USA . 12,000 parts In-Stock

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TANS Electronics

Latvia . 7,611 parts In-Stock

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Lixinc

USA . 6,769 parts In-Stock

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Kulean Microsystems

USA . 5,825 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Problanco Electronics

Mexico . 1,977 parts In-Stock

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Robosynatics

Brazil . 1,370 parts In-Stock

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Lucentia Tech

USA . 1,370 parts In-Stock

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$17.373

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$17.019

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$17.019

$17.019

SupplyDigital Components

Austria . 413 parts In-Stock

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UHIMA Technologies

Türkiye . 361 parts In-Stock

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Advanced Electronics

New Zealand . 47 parts In-Stock

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Overview

Experience the next level of performance with the NL17SZ08DBVT1G by Onsemi. Known for their superior quality and reliability, Onsemi brings you a cutting-edge Logic Gates package that is perfect for a wide range of applications. From industrial automation to consumer electronics, this product offers unparalleled value and benefits to customers. With a small outline and low profile design, dual terminal position, and high maximum power supply current, this Logic Gate is sure to exceed your expectations. Elevate your projects with Onsemi's NL17SZ08DBVT1G and experience seamless functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gate, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Propagation Delay (tpd): 12.7 ns

Low propagation delay ensures fast signal processing and response times, making this logic gate suitable for high-speed applications.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows for use in various environments, including harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this logic gate energy-efficient and reliable.

Technical Specifications

Logic Gates NL17SZ08DBVT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay (tpd):

12.7 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NL17SZ08DBVT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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