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NL17SZ14XV5T2G

Onsemi

NL17SZ14XV5T2G by Onsemi

NL17SZ14XV5T2G by Onsemi is a CMOS Logic Gate with 7.5ns Propagation Delay, 1.8V Nominal Voltage, and 32A Max I (ol). Ideal for industrial applications requiring Schmitt Trigger functionality in a small outline package with matte tin finish and dual terminal position.

Median Price

$0.044

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 12,467 parts In-Stock

1+ parts

$0.110

100+ parts

$0.053

1k+ parts

$0.043

10k+ parts

$0.038

12,467

$0.110

$0.053

$0.043

$0.038

DigiKey

USA . 5,190 parts In-Stock

1+ parts

$0.110

100+ parts

$0.052

1k+ parts

$0.042

10k+ parts

$0.038

5,190

$0.110

$0.052

$0.042

$0.038

Rochester

USA . 247,047 parts In-Stock

1+ parts

-

100+ parts

$0.044

1k+ parts

$0.036

10k+ parts

$0.033

247,047

-

$0.044

$0.036

$0.033

Verical

USA . 244,145 parts In-Stock

1+ parts

-

100+ parts

-

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$0.041

244,145

-

-

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$0.041

Flip Electronics (Authorized)

USA . 116,000 parts In-Stock

1+ parts

-

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116,000

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Arrow

USA . 16,000 parts In-Stock

1+ parts

-

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$0.021

16,000

-

-

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$0.021

Chip1Stop

Japan . 3 parts In-Stock

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3

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Distributors (In-Stock)

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Digiode

USA . 2,198 parts In-Stock

1+ parts

$0.031

100+ parts

-

1k+ parts

-

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2,198

$0.031

-

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.136

100+ parts

-

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300

$0.136

-

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DigiKey Marketplace

USA . 268,107 parts In-Stock

1+ parts

-

100+ parts

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268,107

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Flip Electronics

USA . 116,000 parts In-Stock

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116,000

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Vyrian

USA . 90,584 parts In-Stock

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90,584

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Cyclops Electronics Ltd

UK . 9,000 parts In-Stock

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9,000

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Distributors (Availability)

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Ampacity Inc.

Singapore . 73,918 parts In-Stock

1+ parts

$0.028

100+ parts

-

1k+ parts

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73,918

$0.028

-

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Semicontronic

India . 73,503 parts In-Stock

1+ parts

$0.028

100+ parts

$0.027

1k+ parts

$0.027

10k+ parts

-

73,503

$0.028

$0.027

$0.027

-

Corphita

USA . 1,970 parts In-Stock

1+ parts

$0.030

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-

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1,970

$0.030

-

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Corohmni

South Africa . 341 parts In-Stock

1+ parts

$0.033

100+ parts

-

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341

$0.033

-

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Argo Parts USA

USA . 4,860 parts In-Stock

1+ parts

$0.136

100+ parts

-

1k+ parts

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10k+ parts

$0.132

4,860

$0.136

-

-

$0.132

Continental Prestige Electronics

USA . 2,867 parts In-Stock

1+ parts

$0.136

100+ parts

-

1k+ parts

-

10k+ parts

$0.134

2,867

$0.136

-

-

$0.134

Aztec Data Supply Inc.

USA . 2,643 parts In-Stock

1+ parts

$12.430

100+ parts

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2,643

$12.430

-

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Advanced Electronics

New Zealand . 54 parts In-Stock

1+ parts

$12.665

100+ parts

$12.032

1k+ parts

$12.032

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-

54

$12.665

$12.032

$12.032

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Perfect Parts

USA . 44,278 parts In-Stock

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44,278

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Kepictronics

USA . 12,000 parts In-Stock

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Lixinc

USA . 11,875 parts In-Stock

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Problanco Electronics

Mexico . 7,744 parts In-Stock

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Kulean Microsystems

USA . 7,067 parts In-Stock

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TANS Electronics

Latvia . 4,217 parts In-Stock

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GreenTree Electronics

Israel . 1,823 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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$0.134

1k+ parts

$0.129

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$0.127

1,000

-

$0.134

$0.129

$0.127

UHIMA Technologies

Türkiye . 755 parts In-Stock

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755

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Microchip USA

USA . 417 parts In-Stock

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417

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SupplyDigital Components

Austria . 205 parts In-Stock

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Vigor

Singapore . 134 parts In-Stock

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134

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Overview

Upgrade your logic gates with the NL17SZ14XV5T2G from Onsemi, a top-tier manufacturer known for its quality and reliability. Ideal for various applications, this product offers unmatched value with a fast propagation delay of 7.5 ns, low power consumption, wide operating temperature range, and compact design. Experience seamless performance and enhanced efficiency with this cutting-edge solution. Elevate your projects with the NL17SZ14XV5T2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Propagation Delay at Nominal Supply: 7.5 ns

With a low propagation delay at nominal supply, this product ensures fast signal processing.

Surface Mount: YES

Being surface mountable, this product offers easy and convenient installation onto circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board.

Nominal Supply Voltage / Vsup: 1.8

Operating at a nominal supply voltage of 1.8V, this product is energy efficient.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can handle a variety of different loads.

Power Supplies (V): 3.3

Compatible with power supplies of 3.3V, this product is versatile and widely compatible.

No. of Terminals: 5

The 5 terminals offer flexibility in connecting this product to different components.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile make this product suitable for space-constrained applications.

Maximum I (ol): 32 Amp

With a maximum output current of 32 Amps, this product can handle heavy loads.

Propagation Delay (tpd): 15.6 ns

This product ensures minimal propagation delay, leading to quick response times.

Maximum Operating Temperature: 85 °C

Operating efficiently at temperatures up to 85°C, this product is reliable in various environments.

Minimum Operating Temperature: -40 °C

Able to operate in temperatures as low as -40°C, this product is suitable for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and solderability for secure connections.

Terminal Position: DUAL

Dual terminal positions offer flexibility in installation and connectivity options.

Maximum Seated Height: 0.6 mm

With a low maximum seated height, this product is suitable for compact designs.

Width: 1.2 mm

The small width of 1.2 mm allows for efficient use of space on the circuit board.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement of 1.65V makes this product suitable for low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures safe and reliable soldering processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes.

Length: 1.6 mm

The compact length of 1.6 mm contributes to space-efficient circuit board designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product is suitable for harsh operating environments.

Schmitt Trigger: YES

Including a Schmitt trigger allows for improved noise immunity and signal stability.

Technology: CMOS

Built using CMOS technology, this product offers low power consumption and high noise immunity.

Terminal Form: FLAT

The flat terminal form provides a secure connection for reliable performance.

Packing Method: TR

The TR packing method ensures secure transportation and storage of this product.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for compact placement of terminals on the circuit board.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product can handle a wide range of voltage inputs.

Maximum Power Supply Current (ICC): 50 mA

With a maximum power supply current of 50 mA, this product is energy efficient and suitable for low-power applications.

Technical Specifications

Logic Gates NL17SZ14XV5T2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5/6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

15.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.2 mm

Trade Compliance

NL17SZ14XV5T2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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